Abstract:
A light-emitting package structure is provided, including an encapsulant, an light-emitting component embedded the encapsulant and having a light-emitting side and a non-emitting side opposing the light-emitting side, a dam embedded and exposed from the encapsulant, and a phosphor layer covering the light-emitting side and the dam. The non-emitting side has a plurality of electrodes. Since the heat generated by the phosphor layer can be transmitted to an outside region of the light-emitting package structure through the dam, the etiolation of the encapsulant can thus be prevented. A method of fabricating the light-emitting package structure is also provided.
Abstract:
A charged powder supply device is disclosed. A plurality of charged powder particles are disposed on an upper side of a carrier and at least an action source is positioned at a lower side of the carrier for acting on the carrier so as to vibrate the charged powder particles on the upper side of the carrier. As such, the vibrated charged powder particles are attached to objects to be coated, such as LEDs, under the effect of an electric field so as to form a powder layer, such as a phosphor layer. Since there are no other external forces that affect the moving direction of the charged powder particles, the powder layer can be uniformly formed on the objects.
Abstract:
A charged powder supply device is disclosed. A plurality of charged powder particles are disposed on an upper side of a carrier and at least an action source is positioned at a lower side of the carrier for acting on the carrier so as to vibrate the charged powder particles on the upper side of the carrier. As such, the vibrated charged powder particles are attached to objects to be coated, such as LEDs, under the effect of an electric field so as to form a powder layer, such as a phosphor layer. Since there are no other external forces that affect the moving direction of the charged powder particles, the powder layer can be uniformly formed on the objects.
Abstract:
A light-emitting package structure is provided, including an encapsulant, an light-emitting component embedded the encapsulant and having a light-emitting side and a non-emitting side opposing the light-emitting side, a dam embedded and exposed from the encapsulant, and a phosphor layer covering the light-emitting side and the dam. The non-emitting side has a plurality of electrodes. Since the heat generated by the phosphor layer can be transmitted to an outside region of the light-emitting package structure through the dam, the etiolation of the encapsulant can thus be prevented. A method of fabricating the light-emitting package structure is also provided.
Abstract:
A method for forming a uniform film layer structure, including providing a phosphorous powder and a first surface of an object, wherein the phosphorous powder has a plurality of phosphorous particles, at least a portion of a surface of each of the phosphorous particles is covered with an adhesive material, and the first surface does not contact the phosphorous powder; and adsorbing the phosphorous powder to the first surface of the object by using an electrostatic adsorption method.