公开(公告)号：US11310916B1

公开(公告)日：2022-04-19

申请号：US17133597

申请日：2020-12-23

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： Jhao-Siang Jheng ,  Chun-Lung Wu

IPC: H05K1/09 ,  H05K3/06 ,  H05K3/18 ,  H01L21/302 ,  H01L23/52 ,  H01L23/528 ,  H05K3/00 ,  H05K1/05

Abstract: A metal circuit on a polymer composite substrate surface and a method for manufacturing the same are provided. The metal circuit on the polymer composite substrate surface includes a polymer composite layer and a metal circuit layer. The metal circuit layer is formed from a metal piece molded by metal processing, and is integrated onto a surface of the polymer composite layer. The metal circuit layer has one or a plurality of circuit grooves formed therein, the polymer composite layer has one or a plurality of bulges formed therein, and the bulge is deformed and bulged at the corresponding circuit groove.

公开(公告)号：US10015907B2

公开(公告)日：2018-07-03

申请号：US15078015

申请日：2016-03-23

Applicant: Amulaire thermal technology, INC.

Inventor： Chun-Lung Wu ,  Ming-Sian Lin

IPC: F28F7/00 ,  H05K7/20

CPC classification number: H05K7/20254 ,  H01L23/3677

Abstract: A heat dissipating device includes a thermal conductive substance, a plurality of heat-radiating protrusions and a plurality of turbulence-generating structures. The thermal conductive substance has a first surface and a second surface opposite to the first surface. The heat-radiating protrusions are integrally formed with the thermal conductive substance on the first surface. At least one of the turbulence-generating structures is formed on the first surface of the thermal conductive substance in concaved manner, and arranged around a bottom periphery of the heat-radiating protrusions, so as to obstruct a development of a boundary layer around the bottom of the heat-radiating protrusions.

公开(公告)号：US12194831B2

公开(公告)日：2025-01-14

申请号：US17963986

申请日：2022-10-11

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： Kuo-Wei Lee ,  Chun-Li Hsiung ,  Chien-Cheng Wu ,  Chun-Lung Wu

IPC: H05K7/20 ,  B60K11/02 ,  B60K1/00

Abstract: A vehicle water-cooling heat sink plate having fin sets with different fin pitch distances is provided. The vehicle water-cooling heat sink plate includes a heat-dissipating plate body and three fin sets. The heat-dissipating plate body has a first heat-dissipating surface and a second heat-dissipating surface that are opposite to each other, the first heat-dissipating surface is used for contacting three traction inverter power component sets, and the second heat-dissipating surface is used for contacting a cooling fluid. The second heat-dissipating surface of the heat-dissipating plate body along a flow direction of the cooling fluid is divided into three heat-dissipating areas which are spaced apart from each other and have the same size, and the three heat-dissipating areas respectively correspond to three projection areas that are respectively generated by the three traction inverter power component sets.

公开(公告)号：US11965702B1

公开(公告)日：2024-04-23

申请号：US17970728

申请日：2022-10-21

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： Chun-Li Hsiung ,  Kuo-Wei Lee ,  Chien-Cheng Wu ,  Chun-Lung Wu

IPC: F28F3/04 ,  F28D1/03 ,  F28D9/00 ,  H05K7/20 ,  F28D21/00

CPC classification number: F28F3/048 ,  F28D1/0316 ,  F28D9/0043 ,  F28D2021/0028 ,  H05K7/20009

Abstract: A low pressure drop automotive liquid-cooling heat dissipation plate and an enclosed automotive liquid-cooling cooler having the same are provided. The low pressure drop automotive liquid-cooling heat dissipation plate includes a heat dissipation plate body and three fin sets. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that are opposite to each other. The first heat dissipation surface is in contact with three traction inverter power component sets, and the second heat dissipation surface is in contact with a cooling fluid. Three heat dissipation regions that are spaced equidistantly apart from each other and that have a same size are defined on the second heat dissipation surface along a flow direction of the cooling fluid, and respectively correspond to three projection areas formed by projecting three traction inverter power component sets on the second heat dissipation surface.

公开(公告)号：US11037857B1

公开(公告)日：2021-06-15

申请号：US16711747

申请日：2019-12-12

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： Tzu-Hsuan Wang ,  Tze-Yang Yeh ,  Chun-Lung Wu

IPC: H01L23/373 ,  H01L25/07 ,  H01L23/00 ,  H01L25/18

Abstract: An IGBT module with a heat dissipation structure includes a first layer of chips, a second layer of chips, a first bonding layer, a second bonding layer, a first copper layer, a second copper layer, a thermally-conductive and electrically-insulating layer, and a heat dissipation layer. The first copper layer and the second copper layer are disposed on the thermally-conductive and electrically-insulating layer at intervals. The first layer of chips and the second layer of chips are disposed on the first bonding layer and the second bonding layer, respectively. The number of chips of the first layer of chips is larger than that of the second layer of chips such that the first copper layer has a greater thickness than the second copper layer.

公开(公告)号：US12120845B2

公开(公告)日：2024-10-15

申请号：US18147672

申请日：2022-12-28

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： Yi-Hsin Huang ,  Chun-Lung Wu ,  Kuo-Wei Lee ,  Tze-Yang Yeh

IPC: H05K7/20

CPC classification number: H05K7/20263 ,  H05K7/20409

Abstract: A liquid-cooling heat dissipation plate with unequal height pin-fins and an enclosed liquid-cooling cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of full-height pin-fins, and a plurality of non-full-height pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that face away from each other, the first heat dissipation surface is configured to be in contact with a plurality of heat sources, and the second heat dissipation surface is configured to be in contact with a cooling fluid. The full-height and non-full-height pin-fins are formed at the second heat dissipation surface of the heat dissipation plate body. A first heat dissipation region to an Nth heat dissipation region are defined on the heat dissipation plate body along a flowing direction of the cooling fluid.

公开(公告)号：US10861768B2

公开(公告)日：2020-12-08

申请号：US16442538

申请日：2019-06-16

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： Tze-Yang Yeh ,  Chun-Lung Wu

IPC: H01L23/373 ,  H01L29/739 ,  H01L23/367

Abstract: An IGBT module with an improved heat dissipation structure includes a layer of IGBT chips, a bonding layer, a thick copper layer, a polymer composite layer, a thermal spray layer, and a heat dissipation layer. The thermal spray layer is disposed on the heat dissipation layer. The polymer composite layer is disposed on the thermal spray layer. The thick copper layer is disposed on the polymer composite layer. The bonding layer is disposed on the thick copper layer. The layer of IGBT chips is disposed on the bonding layer.

公开(公告)号：US11988467B2

公开(公告)日：2024-05-21

申请号：US17890317

申请日：2022-08-18

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： Ching-Ming Yang ,  Chun-Lung Wu ,  Tze-Yang Yeh

IPC: F28F3/00 ,  F28F3/02 ,  F28F3/04 ,  F28F13/06

CPC classification number: F28F3/022 ,  F28F3/04 ,  F28F13/06 ,  F28F2215/04

Abstract: A liquid-cooling heat dissipation plate with pin-fins and an enclosed liquid cooler having the same are provided. The liquid-cooling heat dissipation plate includes a heat dissipation plate body, a plurality of rhombus-shaped pin-fins, and a plurality of ellipse-shaped pin-fins. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface opposite to each other. The first heat dissipation surface is in contact with a heat source, and the second heat dissipation surface is in contact with a cooling fluid. The rhombus-shaped pin-fins and the ellipse-shaped pin-fins are integrally formed on the second heat dissipation surface and in a high density arrangement. The ellipse-shaped pin-fins correspond in position to a relative low temperature region of the heat source, and the rhombus-shaped pin-fins correspond in position to a relative high temperature region of the heat source.

公开(公告)号：US11081421B2

公开(公告)日：2021-08-03

申请号：US16711830

申请日：2019-12-12

Applicant: AMULAIRE THERMAL TECHNOLOGY, INC.

Inventor： Tzu-Hsuan Wang ,  Tze-Yang Yeh ,  Chun-Lung Wu

IPC: H01L23/373 ,  H01L25/07 ,  H01L23/00 ,  H01L23/367

Abstract: An IGBT module with a heat dissipation structure includes a first layer of chips, a second layer of chips, a first bonding layer, a second bonding layer, a first copper layer, a second copper layer, a first polymer composite layer, a second polymer composite layer, a first ceramic layer, a second ceramic layer, and a heat dissipation layer. The first ceramic layer is partially formed on the heat dissipation layer and corresponds in position and in area to the first layer of chips, and the second ceramic layer is partially formed on the heat dissipation layer and corresponds in position and in area to the second layer of chips.

公开(公告)号：US10475723B1

公开(公告)日：2019-11-12

申请号：US16182535

申请日：2018-11-06

Applicant: Amulaire thermal technology, INC.

Inventor： Tze-Yang Yeh ,  Chun-Lung Wu

IPC: H01L23/34 ,  H01L23/48 ,  H01L21/00 ,  H01L23/373 ,  H01L23/00 ,  H01L29/739

Abstract: An IGBT heat dissipation structure includes a layer of IGBT chips, a bonding layer, a cold spray layer, a thermal spray layer, and a heat dissipation layer. The thermal spray layer is disposed on top of the heat dissipation layer. The cold spray layer is disposed on top of the thermal spray layer. The bonding layer is disposed on top of the cold spray layer, and the layer of IGBT chips is disposed on top of the bonding layer.