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    PACKAGES FOR STRESS-SENSITIVE DEVICE DIES
    3.
    发明申请
    PACKAGES FOR STRESS-SENSITIVE DEVICE DIES 有权
    应力敏感装置包装

    公开(公告)号：US20160090298A1

    公开(公告)日：2016-03-31

    申请号：US14554661

    申请日：2014-11-26

    Applicant: ANALOG DEVICES, INC.

    Inventor： Dipak Sengupta ,  Shafi Saiyed

    IPC: B81B7/00 ,  B81C1/00

    CPC classification number: B81B7/0048 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

    Abstract: An integrated device package is disclosed. The package includes a substrate comprising a cavity through a top surface of the substrate. A first integrated device die is positioned in the cavity. The first integrated device die includes one or more active components. A second integrated device die is attached to the top surface of the substrate and positioned over the cavity. The second integrated device die covers the cavity. Encapsulant can cover the second integrate device die.

    Abstract translation: 公开了一种集成器件封装。 该封装包括基板，该基板包括通过基板的顶表面的空腔。 第一集成器件管芯位于腔体中。 第一集成器件管芯包括一个或多个有源部件。 第二集成器件管芯附着到衬底的顶表面并且定位在腔体上。 第二集成器件管芯覆盖空腔。 封装剂可以覆盖第二个集成器件裸片。

    Integrated gesture sensor module
    4.
    发明授权
    Integrated gesture sensor module 有权

    公开(公告)号：US10884551B2

    公开(公告)日：2021-01-05

    申请号：US14276238

    申请日：2014-05-13

    Applicant: ANALOG DEVICES, INC.

    Inventor： Dipak Sengupta ,  Shrenik Deliwala ,  Ying Zhao ,  Bruce Fried ,  William Schoppee ,  Woodrow Beckford

    IPC: G06F3/042 ,  G06F3/01

    Abstract: An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.

    Microphone module with sound pipe
    5.
    发明授权
    Microphone module with sound pipe 有权
    带声管的麦克风模块

    公开(公告)号：US08767982B2

    公开(公告)日：2014-07-01

    申请号：US13661401

    申请日：2012-10-26

    Applicant: Analog Devices, Inc.

    Inventor： Kieran P. Harney ,  Dipak Sengupta ,  Brian Moss ,  Alain V. Guery

    IPC: H04R25/00

    CPC classification number: H04R1/342 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/15151 ,  H04R1/04 ,  H04R1/08 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003 ,  H04R2499/11 ,  H01L2924/00014

    Abstract: A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone.

    Abstract translation: 麦克风模块具有带孔的基板，以允许声波通过基板，安装到基板上以限定第一内部空间的盖，安装到第一内部空间内的基板的麦克风以及耦合到该基板的壳体 衬底并覆盖孔径。 壳体形成第二内部容积并且包括被配置为允许声音进入第二内部容积的声学端口。 模块还包括从壳体中的声学接口延伸的管道，以及在第二内部容积体外部的至少一个外部接口焊盘。 管道具有接收声波的开口端，并将它们引导到壳体中的声学端口。 此外，至少一个外部接口垫电连接到麦克风。

    Packaged devices with integrated antennas
    6.
    发明授权
    Packaged devices with integrated antennas 有权

    公开(公告)号：US10593634B2

    公开(公告)日：2020-03-17

    申请号：US15396107

    申请日：2016-12-30

    Applicant: Analog Devices, Inc.

    Inventor： Youn-Jae Kook ,  Yeonsung Kim ,  Dipak Sengupta

    IPC: H01L23/66 ,  H01Q1/22 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/552 ,  H01L25/10 ,  H01L23/04

    Abstract: Various embodiments of an integrated device package with integrated antennas are disclosed. In some embodiments, an antenna can be defined along a die pad of the package. In some embodiments, an antenna can be disposed in a first packaging component, and an integrated device die can be disposed in a second packaging component. The first and second packaging components can be stacked on one another and electrically connected. In some embodiments, a package can include one or a plurality of antennas disposed along a wall of a package body. The plurality of antennas can be disposed facing different directions from the package.

    INTEGRATED GESTURE SENSOR MODULE
    9.
    发明申请
    INTEGRATED GESTURE SENSOR MODULE 审中-公开
    集成式传感器模块

    公开(公告)号：US20140340302A1

    公开(公告)日：2014-11-20

    申请号：US14276238

    申请日：2014-05-13

    Applicant: ANALOG DEVICES, INC.

    Inventor： Dipak Sengupta ,  Shrenik Deliwala ,  Ying Zhao ,  Bruce Fried ,  William Schoppee ,  Woodrow Beckford

    IPC: G06F3/042 ,  G06F3/01

    CPC classification number: G06F3/042 ,  G06F3/017 ,  H01L2224/48095 ,  H01L2224/48145 ,  H01L2224/48465 ,  H01L2224/73265 ,  Y10T29/49826 ,  H01L2924/00012

    Abstract: An integrated gesture sensor module includes an optical sensor die, an application-specific integrated circuit (ASIC) die, and an optical emitter die disposed in a single package. The optical sensor die and ASIC die can be disposed in a first cavity of the package, and the optical emitter die can be disposed in a second cavity of the package. The second cavity can be conical or step-shaped so that the opening defining the cavity increases with distance from the upper surface of the optical emitter die. The upper surface of the optical emitter die may be higher than the upper surface of the optical sensor die. An optical barrier positioned between the first and second cavities can include a portion of a pre-molded, laminate, or ceramic package, molding compound, and/or metallized vias.

    Abstract translation: 集成的手势传感器模块包括光学传感器芯片，专用集成电路（ASIC）裸片和设置在单个封装中的光发射器管芯。 光学传感器管芯和ASIC管芯可以设置在封装的第一腔中，并且光发射器管芯可以设置在封装的第二腔中。 第二空腔可以是圆锥形或阶梯形的，使得限定空腔的开口随着距离光发射器管芯的上表面的距离而增加。 光发射器管芯的上表面可以高于光学传感器管芯的上表面。 位于第一和第二腔之间的光学屏障可以包括预成型，层压或陶瓷封装，模塑料和/或金属化通孔的一部分。

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