公开(公告)号：US11272618B2

公开(公告)日：2022-03-08

申请号：US16095276

申请日：2017-04-11

Applicant: ANALOG DEVICES INTERNATIONAL UNLIMITED COMPANY

Inventor： John David Brazzle ,  Frederick E. Beville ,  David A. Pruitt

IPC: H05K7/00 ,  H05K1/18 ,  H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K3/28 ,  H05K3/34

Abstract: A component-on-package circuit may include a component for an electrical circuit and a circuit module attached to the component. The circuit module may have circuitry and at least one leadframe which connects the circuitry to the component both electrically and thermally. The leadframe may have a high degree of both electrical and thermal conductivity and a non-planar shape that provides spring-like cushioning of force applied to the component in the direction of the circuit module.