公开(公告)号：US11047039B2

公开(公告)日：2021-06-29

申请号：US16232496

申请日：2018-12-26

Applicant: APPLIED MATERIALS, INC.

Inventor： Alexander Lerner ,  Kim Vellore ,  Ami Sade ,  Steven Sansoni ,  Andrew Constant ,  Kevin Moraes ,  Roey Shaviv ,  Niranjan Kumar ,  Jeffrey Brodine ,  Michael Karazim

IPC: C23C14/50 ,  C23C14/04 ,  C23C14/24

Abstract: Substrate carrier apparatus having a hard mask are disclosed herein. In some embodiments, a substrate carrier apparatus includes a carrier body having a support surface to support a substrate; and a mask assembly disposed above the support surface. The mask assembly includes an annular frame disposed atop the support surface; and a hard mask coupled to and disposed within the annular frame above the support surface, wherein the hard mask includes one or more openings arranged in a predetermined pattern and disposed through the hard mask, and wherein the hard mask includes a plurality of spacer elements extending from a bottom surface of the hard mask.

公开(公告)号：US10361104B2

公开(公告)日：2019-07-23

申请号：US15660784

申请日：2017-07-26

Applicant: Applied Materials, Inc.

Inventor： Shay Assaf ,  Andrew Constant ,  Jacob Newman ,  Charles Carlson ,  William Tyler Weaver ,  Stephen Hickerson

IPC: H01L21/67

Abstract: Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal process chamber. In other implementations, a process platform having a load lock chamber, a transfer chamber, and a thermal process chamber is disclosed. Methods of measuring oxygen concentration in a load lock chamber via evacuation of a transfer chamber are also described herein.

公开(公告)号：US10818525B2

公开(公告)日：2020-10-27

申请号：US16431239

申请日：2019-06-04

Applicant: Applied Materials, Inc.

Inventor： Shay Assaf ,  Andrew Constant ,  Jacob Newman ,  Charles Carlson ,  William Tyler Weaver ,  Stephen Hickerson

IPC: H01L21/67

Abstract: Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal process chamber. In other implementations, a process platform having a load lock chamber, a transfer chamber, and a thermal process chamber is disclosed. Methods of measuring oxygen concentration in a load lock chamber via evacuation of a transfer chamber are also described herein.

公开(公告)号：US09696097B2

公开(公告)日：2017-07-04

申请号：US14504021

申请日：2014-10-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Kallol Bera ,  Kim Vellore ,  Andrew Constant ,  Jacob Newman ,  Jeffrey Blahnik ,  Jason Schaller ,  William Weaver ,  Robert Vopat ,  Benjamin Riordon

IPC: E21B27/00 ,  F28F3/12 ,  H01L21/67 ,  H01L21/673

CPC classification number: F28F3/12 ,  H01L21/67109 ,  H01L21/67303

Abstract: Embodiments of multi-substrate thermal management apparatus are provided herein. In some embodiments, a multi-substrate thermal management apparatus includes a plurality of plates vertically arranged above one another; a plurality of channels extending through each of the plurality of plates; a supply manifold including a supply channel coupled to the plurality of plates at first locations; and a return manifold including a return channel coupled to the plurality of plates via a plurality of legs at second locations, wherein the supply and return channels are fluidly coupled to the plurality of channels to flow a heat transfer fluid through the plurality of plates.