公开(公告)号：US11232965B2

公开(公告)日：2022-01-25

申请号：US16591456

申请日：2019-10-02

Applicant: Applied Materials, Inc.

Inventor： Jacob Newman ,  Ulrich Oldendorf ,  Martin Aenis ,  Andrew J. Constant ,  Shay Assaf ,  Jeffrey C. Hudgens ,  Alexander Berger ,  William Tyler Weaver

IPC: H01L21/677 ,  B65G47/92 ,  H01L21/67 ,  H01L21/687

Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.

公开(公告)号：US11894251B2

公开(公告)日：2024-02-06

申请号：US17647120

申请日：2022-01-05

Applicant: Applied Materials, Inc.

Inventor： Jacob Newman ,  Ulrich Oldendorf ,  Martin Aenis ,  Andrew J. Constant ,  Shay Assaf ,  Jeffrey C. Hudgens ,  Alexander Berger ,  William Tyler Weaver

IPC: H01L21/677 ,  B65G47/92 ,  H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67724 ,  B65G47/92 ,  H01L21/67167 ,  H01L21/67709 ,  H01L21/67712 ,  H01L21/68707

Abstract: Embodiments herein relate to a transport system and a substrate processing and transfer (SPT) system. The SPT system includes a transport system that connects two processing tools. The transport system includes a vacuum tunnel that is configured to transport substrates between the processing tools. The vacuum tunnel includes a substrate transport carriage to move the substrate through the vacuum tunnel. The SPT system has a variety of configurations that allow the user to add or remove processing chambers, depending on the process chambers required for a desired substrate processing procedure.

公开(公告)号：US20230187239A1

公开(公告)日：2023-06-15

申请号：US18107701

申请日：2023-02-09

Applicant: Applied Materials, Inc.

Inventor： Jacob Newman ,  Andrew J. Constant ,  Michael R. Rice ,  Paul B. Reuter ,  Shay Assaf ,  Sushant S. Koshti

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/677

CPC classification number: H01L21/67201 ,  B65G47/90 ,  H01L21/67727

Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a load lock disposed within the interior volume of the factory interface, and a factory interface robot disposed within the interior volume of the factory interface, wherein the factory interface robot is configured to transfer substrates between a set of substrate carriers and the load lock.

公开(公告)号：US12142508B2

公开(公告)日：2024-11-12

申请号：US17499109

申请日：2021-10-12

Applicant: APPLIED MATERIALS, INC.

Inventor： Sushant S. Koshti ,  Paul B. Reuter ,  David Phillips ,  Jacob Newman ,  Andrew J. Constant ,  Michael R. Rice ,  Shay Assaf ,  Srinivas Poshatrahalli Gopalakrishna ,  Devendra Channappa Holeyannavar ,  Douglas B. Baumgarten ,  Arunkumar Ramachandraiah ,  Narayanan Ramachandran

IPC: H01L21/677 ,  B65G1/04 ,  H01L21/687

Abstract: A factory interface for an electronic device manufacturing system can include a load lock disposed within the interior volume of a factory interface and a factory interface robot disposed within the interior volume of the factory interface. The factory interface robot can be configured to transfer substrates between a first set of substrate carriers and the first load lock. The factory interface robot can comprise a vertical tower, a plurality of links, and an end effector.

公开(公告)号：US20230113673A1

公开(公告)日：2023-04-13

申请号：US17499109

申请日：2021-10-12

Applicant: APPLIED MATERIALS, INC.

Inventor： Sushant S. Koshti ,  Paul B. Reuter ,  David Phillips ,  Jacob Newman ,  Andrew J. Constant ,  Michael R. Rice ,  Shay Assaf ,  Srinivas Poshatrahalli Gopalakrishna ,  Devendra Channappa Holeyannavar ,  Douglas B. Baumgarten ,  Arunkumar Ramachandraiah ,  Narayanan Ramachandran

IPC: H01L21/677 ,  H01L21/687 ,  B65G1/04

Abstract: A factory interface for an electronic device manufacturing system can include a load lock disposed within the interior volume of a factory interface and a factory interface robot disposed within the interior volume of the factory interface. The factory interface robot can be configured to transfer substrates between a first set of substrate carriers and the first load lock. The factory interface robot can comprise a vertical tower, a plurality of links, and an end effector.

公开(公告)号：US10361104B2

公开(公告)日：2019-07-23

申请号：US15660784

申请日：2017-07-26

Applicant: Applied Materials, Inc.

Inventor： Shay Assaf ,  Andrew Constant ,  Jacob Newman ,  Charles Carlson ,  William Tyler Weaver ,  Stephen Hickerson

IPC: H01L21/67

Abstract: Methods and apparatus for processing a substrate are provided herein. In one implementation, the apparatus includes a load lock chamber coupled to a transfer chamber. The transfer chamber is coupled to a thermal process chamber and a substrate is transferred between each of the load lock chamber, the transfer chamber, and the thermal process chamber. In other implementations, a process platform having a load lock chamber, a transfer chamber, and a thermal process chamber is disclosed. Methods of measuring oxygen concentration in a load lock chamber via evacuation of a transfer chamber are also described herein.

公开(公告)号：US12159796B2

公开(公告)日：2024-12-03

申请号：US18107701

申请日：2023-02-09

Applicant: Applied Materials, Inc.

Inventor： Jacob Newman ,  Andrew J. Constant ,  Michael R. Rice ,  Paul B. Reuter ,  Shay Assaf ,  Sushant S. Koshti

IPC: H01L21/67 ,  B65G47/90 ,  H01L21/677

Abstract: Devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a load lock disposed within the interior volume of the factory interface, and a factory interface robot disposed within the interior volume of the factory interface, wherein the factory interface robot is configured to transfer substrates between a set of substrate carriers and the load lock.

公开(公告)号：US20220068677A1

公开(公告)日：2022-03-03

申请号：US17392392

申请日：2021-08-03

Applicant: APPLIED MATERIALS, INC.

Inventor： Jacob Newman ,  Andrew J. Constant ,  Michael R. Rice ,  Paul B. Reuter ,  Shay Assaf ,  Sushant S. Koshti

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677 ,  B65G47/90

Abstract: The disclosure describes devices, systems, and methods for integrating load locks into a factory interface footprint space. A factory interface for an electronic device manufacturing system can include an interior volume defined by a bottom, a top and a plurality of sides, a first load lock disposed within the interior volume of the factory interface, and a first factory interface robot disposed within the interior volume of the factory interface, wherein the first factory interface robot is configured to transfer substrates between a first set of substrate carriers and the first load lock.

公开(公告)号：US11204312B2

公开(公告)日：2021-12-21

申请号：US16818499

申请日：2020-03-13

Applicant: Applied Materials, Inc.

Inventor： Ami Sade ,  Todd Egan ,  Shay Assaf ,  Jacob Newman

IPC: G01N21/01 ,  G01B11/06 ,  G01N21/21 ,  G01N21/55

Abstract: Full wafer in-situ metrology chambers and methods of use are described. The metrology chambers include a substrate support and a sensor bar that are rotatable relative to each other. The sensor bar includes a plurality of sensors at different radii from a central axis.

公开(公告)号：US20210285865A1

公开(公告)日：2021-09-16

申请号：US16818499

申请日：2020-03-13

Applicant: Applied Materials, Inc.

Inventor： Ami Sade ,  Todd Egan ,  Shay Assaf ,  Jacob Newman

IPC: G01N21/01 ,  G01B11/06 ,  G01N21/21 ,  G01N21/55

Abstract: Full wafer in-situ metrology chambers and methods of use are described. The metrology chambers include a substrate support and a sensor bar that are rotatable relative to each other. The sensor bar includes a plurality of sensors at different radii from a central axis.