公开(公告)号：US20210048108A1

公开(公告)日：2021-02-18

申请号：US16542798

申请日：2019-08-16

Applicant: APPLIED MATERIALS, INC.

Inventor： Andrew Nguyen ,  Yogananda Sarode Vishwanath ,  Xue Chang ,  Anilkumar Rayaroth ,  Chetan Naik ,  Balachandra Jatak Narayan

IPC: F16K1/42

Abstract: Embodiments of symmetric flow valves for use in a substrate processing chamber are provided herein. In some embodiments, a symmetric flow valve includes a valve body having sidewalls, a bottom plate, and a top plate that together define an interior volume, wherein the top plate includes one or more axisymmetrically disposed openings; a poppet disposed in the interior volume, wherein the poppet includes a central opening and a plurality of portions configured to selectively seal the one or more axisymmetrically disposed openings of the top plate when the symmetric flow valve is in a closed position; and a first actuator coupled to the poppet to position the poppet within the interior volume in at least an open position, where the poppet is spaced apart from the top plate to allow flow through the one or more axisymmetrically disposed openings of the top plate, and the closed position.

公开(公告)号：US11551965B2

公开(公告)日：2023-01-10

申请号：US16657604

申请日：2019-10-18

Applicant: Applied Materials, Inc.

Inventor： Andrew Nguyen ,  Xue Chang ,  Shahid Rauf ,  Jason A. Kenney

IPC: H01L21/687 ,  H01L21/683 ,  H02N13/00

Abstract: Implementations of the present disclosure provide a process kit for an electrostatic chuck. In one implementation, a substrate support assembly is provided. The substrate support assembly includes an electrostatic chuck having a first recess formed in an upper portion of the electrostatic chuck. A process kit surrounds the electrostatic chuck. The process kit includes an inner ring and an outer ring disposed radially outward of the inner ring. The outer ring includes a second recess formed in an upper portion of the upper ring. The inner ring is positioned within and is supported by the first recess and the second recess. An upper surface of the inner ring and an upper surface of the outer ring are co-planar.

公开(公告)号：US11211282B2

公开(公告)日：2021-12-28

申请号：US16010239

申请日：2018-06-15

Applicant: APPLIED MATERIALS, INC.

Inventor： Xue Chang ,  Andrew Nguyen

IPC: H01L21/687 ,  C23C16/458 ,  H01J37/32 ,  C23C14/50

Abstract: Embodiments of process kit components for use in a substrate support, and substrate supports incorporating same, are provided herein. In some embodiments, the substrate support may include a body, a grounding shell formed of an electrically conductive material disposed about the body, a liner formed of an electrically conductive material disposed about the grounding shell, where the liner includes an upper lip that extends inwardly towards the body, a metal fastener disposed through the upper lip to couple the liner to the grounding shell, and a first insulator ring disposed atop the upper lip of the liner and covering the metal fastener.

公开(公告)号：US12183605B2

公开(公告)日：2024-12-31

申请号：US17477750

申请日：2021-09-17

Applicant: Applied Materials, Inc.

Inventor： Andrew Nguyen ,  Yogananda Sarode ,  Xue Chang ,  Kartik Ramaswamy

IPC: H01L21/67 ,  H01J37/32 ,  H10N10/13 ,  C23C16/455

Abstract: Methods and systems for in-situ temperature control are provided. The method includes delivering a temperature-sensing disc into a processing region of a processing chamber without breaking vacuum. The temperature-sensing disc includes one or more cameras configured to perform IR-based imaging. The method further includes measuring a temperature of at least one region of at least one chamber surface in the processing region of the processing chamber by imaging the at least one surface using the temperature-sensing disc. The method further includes comparing the measured temperature to a desired temperature to determine a temperature difference. The method further includes adjusting a temperature of the at least one chamber surface to compensate for the temperature difference.

公开(公告)号：US11835146B2

公开(公告)日：2023-12-05

申请号：US17539372

申请日：2021-12-01

Applicant: Applied Materials, Inc.

Inventor： Andrew Nguyen ,  Yogananda Sarode Vishwanath ,  Xue Chang ,  Anilkumar Rayaroth ,  Chetan Naik ,  Balachandra Jatak Narayan

IPC: F16K11/22 ,  F16K1/42 ,  F16K1/36 ,  F16K51/02

CPC classification number: F16K1/42 ,  F16K1/36 ,  F16K11/22 ,  F16K51/02 ,  Y10T137/87877

Abstract: Embodiments of symmetric flow valves for use in a substrate processing chamber are provided herein. In some embodiments, a symmetric flow valve includes a valve body having sidewalls, a bottom plate, and a top plate that together define an interior volume, wherein the top plate includes one or more axisymmetrically disposed openings; a poppet disposed in the interior volume, wherein the poppet includes a central opening and a plurality of portions configured to selectively seal the one or more axisymmetrically disposed openings of the top plate when the symmetric flow valve is in a closed position; and a first actuator coupled to the poppet to position the poppet within the interior volume in at least an open position, where the poppet is spaced apart from the top plate to allow flow through the one or more axisymmetrically disposed openings of the top plate, and the closed position.

公开(公告)号：US11199267B2

公开(公告)日：2021-12-14

申请号：US16542798

申请日：2019-08-16

Applicant: APPLIED MATERIALS, INC.

Inventor： Andrew Nguyen ,  Yogananda Sarode Vishwanath ,  Xue Chang ,  Anilkumar Rayaroth ,  Chetan Naik ,  Balachandra Jatak Narayan

IPC: F16K1/42 ,  F16K1/36

Abstract: Embodiments of symmetric flow valves for use in a substrate processing chamber are provided herein. In some embodiments, a symmetric flow valve includes a valve body having sidewalls, a bottom plate, and a top plate that together define an interior volume, wherein the top plate includes one or more axisymmetrically disposed openings; a poppet disposed in the interior volume, wherein the poppet includes a central opening and a plurality of portions configured to selectively seal the one or more axisymmetrically disposed openings of the top plate when the symmetric flow valve is in a closed position; and a first actuator coupled to the poppet to position the poppet within the interior volume in at least an open position, where the poppet is spaced apart from the top plate to allow flow through the one or more axisymmetrically disposed openings of the top plate, and the closed position.

公开(公告)号：US20190341233A1

公开(公告)日：2019-11-07

申请号：US16375681

申请日：2019-04-04

Applicant: Applied Materials, Inc.

Inventor： Andrew Nguyen ,  Yogananda Sarode Vishwanath ,  Xue Chang

IPC: H01J37/32 ,  H01L21/683 ,  H01L21/67

Abstract: Embodiments described herein include a processing tool comprising configured for rapid and stable changes in the processing pressure. In an embodiment, the processing tool may comprises a chamber body. In an embodiment, the chamber body is a vacuum chamber. The processing tool may further comprise a chuck for supporting a substrate in the chamber body. In an embodiment, the processing tool may also comprise a cathode liner surrounding the chuck and a flow confinement ring aligned with the cathode liner. In an embodiment, the cathode liner and the flow confinement ring define an opening between a main processing volume and a peripheral volume of the vacuum chamber.