公开(公告)号：US20150083371A1

公开(公告)日：2015-03-26

申请号：US14034561

申请日：2013-09-24

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Kuo-Chun Hsieh ,  Chuan-Chin Huang

IPC: H05K7/20

CPC classification number: G06F1/20

Abstract: A heat dissipation structure for hand-held mobile device includes a supporting body having a first and an opposite second side and including at least one heat dissipation area. In the heat dissipation area, a heat dissipation element is correspondingly fitted without increasing an overall thickness and volume of the supporting body for the hand-held mobile device. With the heat dissipation element fitted in the heat dissipation area on the supporting body, heat produced by the hand-held mobile device during operation thereof can be quickly transferred to the heat dissipation element for dissipating into ambient air.

Abstract translation: 用于手持式移动装置的散热结构包括具有第一和相对的第二侧并且包括至少一个散热区域的支撑体。 在散热区域中，相应地安装散热元件，而不增加用于手持移动设备的支撑体的总体厚度和体积。 通过将散热元件安装在支撑体上的散热区域中，由手持移动装置在其运行过程中产生的热量可以快速地传递到散热元件，以散发到周围的空气中。

公开(公告)号：US09470459B2

公开(公告)日：2016-10-18

申请号：US13933088

申请日：2013-07-01

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Chih-Yeh Lin ,  Chuan-Chin Huang

IPC: F28D15/04 ,  F28D15/02 ,  H01L23/427

CPC classification number: F28D15/0233 ,  F28D15/046 ,  F28F2245/02 ,  F28F2245/04 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A support structure for heat dissipation unit includes at least one main body and an oxide coating. Multiple grooves are formed on an outer circumference of the main body. The oxide coating is coated on the outer circumference of the main body and the surfaces of the grooves. The sintered powder body can be replaced with the support structure with the directional oxide coating coated on the outer circumference of the main body and the surfaces of the grooves to greatly speed the vapor-liquid circulation of the working fluid in the chamber of the heat dissipation unit so as to enhance the heat dissipation performance.

Abstract translation: 散热单元的支撑结构包括至少一个主体和氧化物涂层。 在主体的外周形成有多个槽。 氧化物涂层涂覆在主体的外周和凹槽的表面上。 烧结粉末体可以用支撑结构代替，其中定向氧化物涂层涂覆在主体的外周和槽的表面上，以极大地加速腔室内的工作流体的蒸气 - 液体循环的散热 单元，以增强散热性能。

公开(公告)号：US09244504B2

公开(公告)日：2016-01-26

申请号：US14034561

申请日：2013-09-24

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Kuo-Chun Hsieh ,  Chuan-Chin Huang

IPC: H05K7/20 ,  G06F1/20

CPC classification number: G06F1/20

Abstract: A heat dissipation structure for hand-held mobile device includes a supporting body having a first and an opposite second side and including at least one heat dissipation area. In the heat dissipation area, a heat dissipation element is correspondingly fitted without increasing an overall thickness and volume of the supporting body for the hand-held mobile device. With the heat dissipation element fitted in the heat dissipation area on the supporting body, heat produced by the hand-held mobile device during operation thereof can be quickly transferred to the heat dissipation element for dissipating into ambient air.

Abstract translation: 用于手持式移动装置的散热结构包括具有第一和相对的第二侧并且包括至少一个散热区域的支撑体。 在散热区域中，相应地安装散热元件，而不增加用于手持移动设备的支撑体的总体厚度和体积。 通过将散热元件安装在支撑体上的散热区域中，由手持移动装置在其运行过程中产生的热量可以快速地传递到散热元件，以散发到周围的空气中。

公开(公告)号：US20150055300A1

公开(公告)日：2015-02-26

申请号：US13973995

申请日：2013-08-22

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Kuo-Chun Hsieh ,  Chuan-Chin Huang

IPC: H05K7/20

CPC classification number: H04M1/0202 ,  G06F1/1626 ,  G06F1/20 ,  G06F1/203

Abstract: A heat dissipation structure includes a heat conduction support body disposed in a handheld electronic device. The heat conduction support body has a first face and a second face opposite to the first face. A chamber is defined between the first and second faces. More than one capillary structure and a working fluid are disposed in the chamber. One of the first and second faces or both of the first and second faces are in contact with the electronic components of the handheld electronic device. One of the first and second faces is in contact with the housing of the handheld electronic device. Accordingly, the heat generated by the electronic components can be quickly conducted and dissipated outward.

Abstract translation: 散热结构包括设置在手持电子设备中的导热支撑体。 导热支撑体具有与第一面相对的第一面和第二面。 在第一和第二面之间限定一个室。 多个毛细管结构和工作流体设置在腔室中。 第一面和第二面中的一个或第一面和第二面中的一个与手持电子设备的电子部件接触。 第一和第二面之一与手持电子设备的外壳接触。 因此，电子部件产生的热能够快速地向外散发。

公开(公告)号：US09247034B2

公开(公告)日：2016-01-26

申请号：US13973995

申请日：2013-08-22

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Kuo-Chun Hsieh ,  Chuan-Chin Huang

IPC: H05K7/20 ,  H04M1/02 ,  G06F1/20

CPC classification number: H04M1/0202 ,  G06F1/1626 ,  G06F1/20 ,  G06F1/203

Abstract: A heat dissipation structure includes a heat conduction support body disposed in a handheld electronic device. The heat conduction support body has a first face and a second face opposite to the first face. A chamber is defined between the first and second faces. More than one capillary structure and a working fluid are disposed in the chamber. One of the first and second faces or both of the first and second faces are in contact with the electronic components of the handheld electronic device. One of the first and second faces is in contact with the housing of the handheld electronic device. Accordingly, the heat generated by the electronic components can be quickly conducted and dissipated outward.

Abstract translation: 散热结构包括设置在手持电子设备中的导热支撑体。 导热支撑体具有与第一面相对的第一面和第二面。 在第一和第二面之间限定一个室。 多个毛细管结构和工作流体设置在腔室中。 第一面和第二面中的一个或第一面和第二面中的一个与手持电子设备的电子部件接触。 第一和第二面之一与手持电子设备的外壳接触。 因此，电子部件产生的热能够快速地向外散发。

公开(公告)号：US20150185793A1

公开(公告)日：2015-07-02

申请号：US14145440

申请日：2013-12-31

Applicant: Asia Vital Components Co., Ltd.

Inventor： Kuo-Chun Hsieh ,  Chuan-Chin Huang

IPC: G06F1/20

CPC classification number: G06F1/203 ,  G06F1/206 ,  Y02D10/16

Abstract: A heat dissipation structure of mobile device includes a case and a heat generation component. The case defines a receiving space. The heat generation component is disposed in the receiving space. One face of the heat generation component is attached to one face of a cooling chip. The other face of the cooling chip is attached to the case. The cooling chip serves to absorb the heat generated by the heat generation component and conduct the heat to the case to dissipate the heat, whereby the heat dissipation problem of the mobile device is solved and an energy-saving effect is achieved.

Abstract translation: 移动装置的散热结构包括壳体和发热部件。 案例定义了接收空间。 发热部件设置在容纳空间中。 发热部件的一个面附着在冷却芯片的一个面上。 冷却芯片的另一面附着在壳体上。 冷却芯片用于吸收由发热部件产生的热量并将热量传导到壳体以散热，从而解决了移动设备的散热问题，并且实现了节能效果。

公开(公告)号：US20150000866A1

公开(公告)日：2015-01-01

申请号：US13933088

申请日：2013-07-01

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Chih-Yeh Lin ,  Chuan-Chin Huang

IPC: F28F9/007

CPC classification number: F28D15/0233 ,  F28D15/046 ,  F28F2245/02 ,  F28F2245/04 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A support structure for heat dissipation unit includes at least one main body and an oxide coating. Multiple grooves are formed on an outer circumference of the main body. The oxide coating is coated on the outer circumference of the main body and the surfaces of the grooves. The sintered powder body can be replaced with the support structure with the directional oxide coating coated on the outer circumference of the main body and the surfaces of the grooves to greatly speed the vapor-liquid circulation of the working fluid in the chamber of the heat dissipation unit so as to enhance the heat dissipation performance.

Abstract translation: 散热单元的支撑结构包括至少一个主体和氧化物涂层。 在主体的外周形成有多个槽。 氧化物涂层涂覆在主体的外周和凹槽的表面上。 烧结粉末体可以用支撑结构代替，其中定向氧化物涂层涂覆在主体的外周和槽的表面上，以极大地加速腔室内的工作流体的蒸气 - 液体循环的散热 单元，以增强散热性能。