公开(公告)号：US20240347419A1

公开(公告)日：2024-10-17

申请号：US18133505

申请日：2023-04-11

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Chii-Ming Leu

IPC: H01L23/40

CPC classification number: H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4087

Abstract: A heat dissipation fastener structure includes a support body, a heat sink, a cover body and an operation unit assembly. The support body comprises a window formed on an upper side and support legs extended from a lower side to together define a reciprocating space in communication with the window. The heat sink is formed with perforations at four corners and disposed in the reciprocating space. Threaded locking members, around which elastic members are fitted, are correspondingly passed through the perforations to mount the heat sink above a heat source in a floating state. The cover body is disposed on the support body and comprises at least one vertical folded edge. The operation unit assembly is disposed on the heat sink to drive the cover body to shield the threaded locking members and make the heat sink get close to or away from the heat source.

公开(公告)号：US20230422443A1

公开(公告)日：2023-12-28

申请号：US18172323

申请日：2023-02-22

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin

IPC: H05K7/20

CPC classification number: H05K7/20336

Abstract: A vapor chamber structure includes a main body. The main body has multiple independent heat dissipation blocks. Each of the heat dissipation blocks has an internal independent airtight chamber. A capillary structure is disposed on an inner wall face of the airtight chamber. A working fluid is filled in the airtight chamber. Multiple connection bodies are disposed between the independent heat dissipation blocks to connect the independent heat dissipation blocks with each other. At least one heat insulation penetrating slot is formed between each two adjacent connection bodies to separate the heat dissipation blocks from each other so as to achieve heat insulation effect. By means of the heat insulation penetrating slots formed on the connection bodies, the respectively airtight chambers can independently conduct heat without transferring heat to each other.

公开(公告)号：US11817372B2

公开(公告)日：2023-11-14

申请号：US16849968

申请日：2020-04-15

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin

IPC: H01L23/427 ,  F28D15/04 ,  F28D15/02 ,  F28D5/02

CPC classification number: H01L23/427 ,  F28D15/0275 ,  F28D15/04

Abstract: A heat sink device, comprising a body, at least a heat pipe, and a base. The body has a first side and a second side onto which a heat source is attached. The heat pipe has a heat-absorbing portion and a heat-dissipating portion. The heat-absorbing portion is attached to the first side, while the heat-dissipating portion is away from the heat-absorbing portion, so that the heat generated by the heat source is absorbed by the heat-absorbing portion and transferred to the distal end of the heat-dissipating portion. The base is disposed on the heat pipe and above the body.

公开(公告)号：US20230243603A1

公开(公告)日：2023-08-03

申请号：US18064293

申请日：2022-12-12

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Yuan-Yi Lin

IPC: F28F3/02 ,  F28D15/02 ,  F28D21/00

CPC classification number: F28F3/027 ,  F28D15/0275 ,  F28D21/00 ,  F28D2021/0029

Abstract: A heat sink structure with heat pipe includes at least one aluminum fin assembly and at least one copper heat pipe, which are made of dissimilar metal materials. The aluminum fin assembly includes at least one through hole and al least one groove, in which a copper embedding layer is provided for contacting with and connected to the copper heat pipe. By providing the copper embedding layer, the connection between the aluminum fin assembly and the copper heat pipe made of dissimilar metal materials is improved, and the problems of eutectic grains formed on the surface of the aluminum fin assembly and environmental pollution caused by electroless nickel plating are eliminated.

公开(公告)号：US10541155B2

公开(公告)日：2020-01-21

申请号：US15408424

申请日：2017-01-18

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin

IPC: H01L21/48 ,  H01L23/367

Abstract: A nested finned heat sink with heat pipe(s). A heat dissipation unit includes a base seat and a first radiating fin assembly. The first radiating fin assembly includes multiple first radiating fins. Two ends of each first radiating fin are respectively formed with a first end edge and a second end edge on a first side. The respective first radiating fins are nested with height and width gradually increased. Each first radiating fin is formed with at least one first support section and a first opening in a position corresponding to the first support section. The first support section abuts against and supports another first radiating fin.

公开(公告)号：US10247488B2

公开(公告)日：2019-04-02

申请号：US14857779

申请日：2015-09-17

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Yuan-Yi Lin

IPC: F28D15/00 ,  F28F3/02 ,  F28D15/02 ,  H01L23/427 ,  H01L21/48

Abstract: A heat dissipation device includes a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate, so as to have reduced manufacturing costs and provide uniform temperature effect.

公开(公告)号：US09895778B2

公开(公告)日：2018-02-20

申请号：US14952923

申请日：2015-11-26

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin

IPC: B23P15/26

CPC classification number: B23P15/26 ,  B23P2700/09 ,  F28D15/0275 ,  F28F2275/12

Abstract: A heat dissipation unit manufacturing method is disclosed. The heat dissipation unit includes a heat pipe and a base seat. The base seat has a first side and a second side. The second side is formed with a channel and multiple perforations in communication with the first and second sides. The heat pipe has a heat absorption section and a conduction section. The conduction section extends from the heat absorption section in a direction to at least one end of the heat pipe distal from the heat absorption section. Several parts of the heat pipe corresponding to the perforations are received in the perforations and flush with the first side of the base seat. The heat dissipation unit manufacturing method improves the shortcoming of the conventional heat dissipation component that the coplanar precision between the heat pipe and the protruding platform of the base seat is hard to control.

公开(公告)号：US20170229376A1

公开(公告)日：2017-08-10

申请号：US15494026

申请日：2017-04-21

Applicant: Asia Vital Components Co., Ltd.

Inventor： Sheng-Huang Lin

IPC: H01L23/427 ,  H01L21/48 ,  F28D15/02 ,  H01L23/367

CPC classification number: H01L23/427 ,  B21D39/038 ,  B21D53/04 ,  F28D15/0275 ,  H01L21/4878 ,  H01L23/3672 ,  H01L23/467 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A thermal module is disclosed. The thermal module includes a radiating fin assembly and a base. The base has a bottom and a plurality of slot vertically extending through the base in a thickness direction thereof. The radiating fin assembly includes a plurality of radiating fins, each of which has a heat-dissipation end and a heat-absorption end. The heat-absorption ends are correspondingly extended through the slots and bent to bear on the bottom for contacting with a heat-producing element. Heat produced by the heat-producing element is absorbed by the heat-absorption ends and directly transferred from the heat-absorption ends to the heat-dissipation ends without the problem of thermal resistance. Therefore, upgraded heat transfer efficiency and excellent heat dissipation effect can be achieved with the thermal module.

公开(公告)号：US09699884B2

公开(公告)日：2017-07-04

申请号：US14882395

申请日：2015-10-13

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0203 ,  H01L23/4006 ,  H01L23/4093 ,  H05K1/0201 ,  H05K1/0212 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/066 ,  H05K2201/10598

Abstract: A latch device for heat dissipation unit is applied to and mounted on a motherboard in tight contact with at least one heat source. The latch device includes a heat sink, a first elastic abutment member having a first protrusion block and a second elastic abutment member having a second protrusion block. A first latch member and a second latch member are disposed on two opposite sides of the heat sink. The first and second latch members are freely latchable with the corresponding first and second protrusion blocks or unlatchable from the corresponding first and second protrusion blocks. Accordingly, along with the latching or unlatching, the first and second elastic abutment members are elastically deformed into abutment against or out of abutment with the other face of the heat sink. Therefore, the heat sink can be easily and securely fixed on or detached from the motherboard.

公开(公告)号：US20170080533A1

公开(公告)日：2017-03-23

申请号：US14857784

申请日：2015-09-17

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Yuan-Yi Lin

IPC: B23P15/26

CPC classification number: B23P15/26 ,  B23P2700/09 ,  F28D15/0233 ,  F28D15/0275 ,  H01L21/4871 ,  H01L23/427

Abstract: A method is disclosed for manufacturing a heat dissipation device including a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate due to secondary processing, so as to have reduced manufacturing costs and provide uniform temperature effect.