公开(公告)号：US12215934B2

公开(公告)日：2025-02-04

申请号：US18064291

申请日：2022-12-12

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Yuan-Yi Lin

IPC: F28F21/08 ,  F28F1/32 ,  H05K7/20

Abstract: A thermal module structure includes an aluminum base having an upper and a lower surface, at least one L-shaped copper heat pipe, a first aluminum fin assembly, a second aluminum fin assembly, and at least one copper embedding layer. The copper heat pipe includes a heat absorption section fitted on the aluminum base, and a heat dissipation section connected to the second aluminum fin assembly. The copper embedding layers are provided on the aluminum base at areas corresponding to the first aluminum fin assembly and the heat absorption section of the copper heat pipe, and on a bottom surface of the first aluminum fin assembly that is to be connected to the aluminum base. Thus, the first aluminum fin assembly and the copper heat pipe can be directly welded to the aluminum base via the copper embedding layers without the need of electroless nickel plating.

公开(公告)号：US11917795B2

公开(公告)日：2024-02-27

申请号：US17242230

申请日：2021-04-27

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Yuan-Yi Lin ,  Fu-Kuei Chang

IPC: H05K7/20

CPC classification number: H05K7/2039

Abstract: A heat sink structure includes a base seat and at least one heat dissipation unit. The base seat has a first face and a second face. At least one extension column extends from the second face of the base seat. The heat dissipation unit is disposed above the base seat and spaced from the base seat by a gap. The extension column serves to restrict or secure the heat dissipation unit in horizontal and vertical directions. The heat dissipation unit with different structures provides multiple heat dissipation features to enhance the entire heat dissipation performance.

公开(公告)号：US20230243597A1

公开(公告)日：2023-08-03

申请号：US18064292

申请日：2022-12-12

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Yuan-Yi Lin

IPC: F28D15/02 ,  F28F1/32 ,  F28F21/08

CPC classification number: F28D15/0275 ,  F28F1/325 ,  F28F21/084 ,  F28F21/085 ,  F28F2215/12

Abstract: A heat sink assembly with heat pipe includes at least one aluminum fin assembly and at least one copper heat pipe, which are made of dissimilar metal materials. The aluminum fin assembly includes at least one area to be connected to other members of the heat sink assembly, such as a groove. A copper embedding layer is provided on a groove inner surface of the groove for connecting the aluminum fin assembly to the copper heat pipe. By providing the copper embedding layer, the connection between the aluminum fin assembly and the copper heat pipe made of dissimilar metal materials is improved, and the problems of eutectic grains formed on the surface of the aluminum fin assembly and environmental pollution caused by electroless nickel plating are eliminated.

公开(公告)号：US20240162108A1

公开(公告)日：2024-05-16

申请号：US18196413

申请日：2023-05-11

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Yuan-Yi Lin ,  Fu-Kuei Chang

IPC: H01L23/367

CPC classification number: H01L23/3672

Abstract: A knockdown heat sink structure includes a carrier body with a high-temperature section in contact with at least one heat source. A non-high-temperature section of the carrier body has a first radiating fin assembly, while a higher second radiating fin assembly is on the high-temperature section. The second radiating fin assembly has a first part higher than the height of the first radiating fin assembly, and a second part that outward spreads and extends from a top end of the first part and covers the first assembly without touching it, creating a spacing flow way. Therefore, the structure increases the heat dissipation area for the high-temperature section, allowing for faster heat dissipation.

公开(公告)号：US20230243603A1

公开(公告)日：2023-08-03

申请号：US18064293

申请日：2022-12-12

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Yuan-Yi Lin

IPC: F28F3/02 ,  F28D15/02 ,  F28D21/00

CPC classification number: F28F3/027 ,  F28D15/0275 ,  F28D21/00 ,  F28D2021/0029

Abstract: A heat sink structure with heat pipe includes at least one aluminum fin assembly and at least one copper heat pipe, which are made of dissimilar metal materials. The aluminum fin assembly includes at least one through hole and al least one groove, in which a copper embedding layer is provided for contacting with and connected to the copper heat pipe. By providing the copper embedding layer, the connection between the aluminum fin assembly and the copper heat pipe made of dissimilar metal materials is improved, and the problems of eutectic grains formed on the surface of the aluminum fin assembly and environmental pollution caused by electroless nickel plating are eliminated.

公开(公告)号：US20220346276A1

公开(公告)日：2022-10-27

申请号：US17242242

申请日：2021-04-27

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Yuan-Yi Lin ,  Fu-Kuei Chang

IPC: H05K7/20 ,  F28D15/02

Abstract: A thermal module includes a base seat, at least two heat pipes and multiple heat dissipation units. Each heat pipe has a heat absorption end and a heat dissipation end outward extending from the heat absorption end. The heat absorption ends are disposed on the base seat. The heat dissipation ends of the at least two heat pipes are positioned above the base seat at different heights and misaligned from each other. The multiple heat dissipation units are connected with the heat dissipation ends of the heat pipes and arranged at intervals. By means of arranging the multiple heat dissipation unit at intervals as multiple layers, the heat dissipation areas is enlarged to prevent the airflow from being interrupted so as to effectively greatly enhance the heat dissipation efficiency.

公开(公告)号：US10247488B2

公开(公告)日：2019-04-02

申请号：US14857779

申请日：2015-09-17

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Yuan-Yi Lin

IPC: F28D15/00 ,  F28F3/02 ,  F28D15/02 ,  H01L23/427 ,  H01L21/48

Abstract: A heat dissipation device includes a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate, so as to have reduced manufacturing costs and provide uniform temperature effect.

公开(公告)号：US09989321B2

公开(公告)日：2018-06-05

申请号：US14548295

申请日：2014-11-20

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Yuan-Yi Lin

IPC: F28F7/00 ,  F28F13/00 ,  H01L23/367 ,  H01L23/427 ,  H01L23/40 ,  H01L23/467

CPC classification number: F28F13/00 ,  H01L23/367 ,  H01L23/3672 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipation device includes a heat dissipation member, a heat transfer member, and a reinforcing member. The heat transfer member has one side attached to the heat dissipation member, and two opposite lateral edges thereof are respectively provided with at least one connection portion and at least one through hole. The reinforcing member is connected to the other side of the heat transfer member, and two opposite lateral edges thereof are respectively formed with at least one mating connection portion for correspondingly connecting to the connection portion. The reinforcing member is provided at a central portion with an opening. With these arrangements, the heat transfer member can bear a larger locking force when the heat dissipation member is locked thereto, and is also prevented from deformation.

公开(公告)号：US20170080533A1

公开(公告)日：2017-03-23

申请号：US14857784

申请日：2015-09-17

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Yuan-Yi Lin

IPC: B23P15/26

CPC classification number: B23P15/26 ,  B23P2700/09 ,  F28D15/0233 ,  F28D15/0275 ,  H01L21/4871 ,  H01L23/427

Abstract: A method is disclosed for manufacturing a heat dissipation device including a substrate and at least one heat pipe, which is pressed to tightly fit in a receiving groove defined by the substrate to make two opposite lateral sides of the heat pipe tightly respectively in contact with two opposite inner sides of the receiving groove to tightly connect the substrate to the heat pipe to solve the problem existing in the conventional heat dissipation device of a poor levelness of the receiving groove on a top and a bottom side of the substrate due to secondary processing, so as to have reduced manufacturing costs and provide uniform temperature effect.

公开(公告)号：US20230243596A1

公开(公告)日：2023-08-03

申请号：US18064289

申请日：2022-12-12

Applicant: ASIA VITAL COMPONENTS CO., LTD.

Inventor： Sheng-Huang Lin ,  Yuan-Yi Lin

IPC: F28D15/02 ,  H05K7/20 ,  F28F3/04

CPC classification number: F28D15/0275 ,  H05K7/20336 ,  F28F3/048

Abstract: A heat dissipation device includes an aluminum base seat and any or both of at least one copper two-phase fluid component and a copper heat conduction component. The aluminum base seat has an upper face and a lower face. A connection section is formed on the lower face and a copper embedding layer is disposed on the connection section. Any or both of the copper two-phase fluid component and the copper heat conduction component are disposed on the connection section and connected with the copper embedding layer. By means of the copper embedding layer disposed on the connection section, the aluminum base seat can be directly welded and connected with the copper two-phase fluid component and/or the copper heat conduction component made of heterogeneous metal materials without chemical nickel treatment procedure.