公开(公告)号：US11201386B2

公开(公告)日：2021-12-14

申请号：US16670487

申请日：2019-10-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin Ho ,  Chih-Cheng Lee ,  Chun Chen Chen ,  Yuanhao Yu

IPC: H01L23/495 ,  H01L21/786 ,  H01Q1/22 ,  H01L23/28 ,  H01L21/768 ,  H01L23/66

Abstract: A semiconductor device package and a method for manufacturing the same are provided. The semiconductor device package includes a circuit layer and an antenna module. The circuit layer has a first surface, a second surface opposite to the first surface and a lateral surface. The lateral surface extends between the first surface and the second surface. The circuit layer has an interconnection structure. The antenna module has an antenna pattern layer and is disposed on the first surface of the circuit layer. The lateral surface of the circuit layer is substantially coplanar with a lateral surface of the antenna module.

公开(公告)号：US12074118B2

公开(公告)日：2024-08-27

申请号：US18209412

申请日：2023-06-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia Hsiu Huang ,  Chun Chen Chen ,  Wei Chih Cho ,  Shao-Lun Yang

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/562 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265

Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a substrate, a clip, and a support structure. The clip is disposed on the substrate. The clip includes a first portion and a second portion separated from each other by a slit. The support structure is above the substrate and supports the clip. The support structure has a first surface and a second surface facing the first surface, and the first surface and the second surface define a gap.

公开(公告)号：US11682660B2

公开(公告)日：2023-06-20

申请号：US17076480

申请日：2020-10-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao Yu ,  Chun Chen Chen ,  Shang Chien Chen

IPC: H01L25/10 ,  H01L25/18 ,  G06F3/0354

CPC classification number: H01L25/105 ,  H01L25/18 ,  G06F3/03545 ,  H01L2225/107 ,  H01L2225/1058 ,  H01L2225/1076

Abstract: The present disclosure provides a semiconductor structure including a first substrate having a first surface, a first semiconductor device package disposed on the first surface of the first substrate, and a second semiconductor device package disposed on the first surface of the first substrate. The first semiconductor device package and the second semiconductor device package have a first signal transmission path through the first substrate and a second signal transmission path insulated from the first substrate. The present disclosure also provides an electronic device.

公开(公告)号：US11658102B2

公开(公告)日：2023-05-23

申请号：US16749635

申请日：2020-01-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao Yu ,  Cheng Yuan Chen ,  Chun Chen Chen ,  Jiming Li ,  Chien-Wen Tu

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/66

CPC classification number: H01L23/49811 ,  H01L21/4889 ,  H01L23/66 ,  H01L2223/6605

Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S11 parameter of the connector is less than −20 dB.

公开(公告)号：US10886208B2

公开(公告)日：2021-01-05

申请号：US16264602

申请日：2019-01-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin Ho ,  Chih-Cheng Lee ,  Chun Chen Chen ,  Chen Yuang Chen

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H05K1/18 ,  H05K3/34 ,  H01L21/48

Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

公开(公告)号：US12224481B2

公开(公告)日：2025-02-11

申请号：US18118738

申请日：2023-03-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin Ho ,  Chih-Cheng Lee ,  Chun Chen Chen ,  Yuanhao Yu

IPC: H01Q1/22 ,  H01L23/31 ,  H01L23/66 ,  H01Q1/40 ,  H01Q21/00 ,  H01Q21/06

Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.

公开(公告)号：US11764137B2

公开(公告)日：2023-09-19

申请号：US17140926

申请日：2021-01-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin Ho ,  Chih-Cheng Lee ,  Chun Chen Chen ,  Cheng Yuan Chen

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H05K1/18 ,  H05K3/34 ,  H01L21/48

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49838 ,  H05K1/181 ,  H05K3/341 ,  H05K2201/10446 ,  H05K2201/10522

Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.

公开(公告)号：US11676912B2

公开(公告)日：2023-06-13

申请号：US17133365

申请日：2020-12-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia Hsiu Huang ,  Chun Chen Chen ,  Wei Chih Cho ,  Shao-Lun Yang

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/562 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265

Abstract: A semiconductor device package and a method for manufacturing a semiconductor device package are provided. The semiconductor device package includes a substrate, a clip, and a support structure. The clip is disposed on the substrate. The clip includes a first portion and a second portion separated from each other by a slit. The support structure is above the substrate and supports the clip. The support structure has a first surface and a second surface facing the first surface, and the first surface and the second surface define a gap.

公开(公告)号：US11600901B2

公开(公告)日：2023-03-07

申请号：US16506654

申请日：2019-07-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin Ho ,  Chih-Cheng Lee ,  Chun Chen Chen ,  Yuanhao Yu

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q1/40 ,  H01Q21/00 ,  H01L23/31 ,  H01Q21/06

Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.

公开(公告)号：US11552026B2

公开(公告)日：2023-01-10

申请号：US16264599

申请日：2019-01-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng Yuan Chen ,  Jiming Li ,  Chun Chen Chen ,  Yuanhao Yu

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01L21/56 ,  H01Q1/22 ,  H01Q1/52 ,  H01L21/48

Abstract: A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.