公开(公告)号：US11588081B2

公开(公告)日：2023-02-21

申请号：US16809506

申请日：2020-03-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Hsun-Wei Chan ,  Shih-Chieh Tang ,  Lu-Ming Lai

IPC: H01L33/58

Abstract: A semiconductor device package includes a light-emitting device, a diffuser structure, a first optical sensor, and a second optical sensor. The light-emitting device has a light-emitting surface. The diffuser structure is above the light-emitting surface of the light-emitting device. The first optical sensor is disposed below the diffuser structure, and the first optical sensor is configured to detect a first reflected light reflected by the diffuser structure. The second optical sensor is disposed below the diffuser structure, and the second optical sensor is configured to detect a second reflected light reflected by the diffuser structure.

公开(公告)号：US10686105B2

公开(公告)日：2020-06-16

申请号：US16011555

申请日：2018-06-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi Wu ,  Ying-Chung Chen ,  Hsin-Ying Ho

IPC: H01L33/56 ,  H01L31/02 ,  H01L31/0203 ,  H01L33/62

Abstract: An optical package device comprises a carrier, a die, a support element, and an encapsulant. The die is on the carrier. The support element is on the carrier and adjacent to the die. The encapsulant covers the die and the support element. The encapsulant has a first top surface over the die and a second top surface adjacent to the first top surface. A ratio of a distance between the first top surface and the second top surface of the encapsulant to a distance between the die and the first top surface of the encapsulant is less than 0.1.

公开(公告)号：US11287312B2

公开(公告)日：2022-03-29

申请号：US16405838

申请日：2019-05-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Ying-Chung Chen

IPC: G01J1/02

Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.

公开(公告)号：US10770624B2

公开(公告)日：2020-09-08

申请号：US16132206

申请日：2018-09-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chang Chin Tsai ,  Chun-Han Chen ,  Hsin-Ying Ho

IPC: H01L33/48 ,  H01S5/022 ,  H01S5/40 ,  H01L33/56 ,  H01L23/528 ,  H01L33/62

Abstract: A semiconductor package includes a first substrate having a first surface, a second substrate on the first surface of the first substrate, the second substrate having a first surface and a second surface adjacent to the first surface, and the first surface of the second substrate being disposed on the first surface of the first substrate, and a light source on the second surface of the second substrate. A method for manufacturing the semiconductor device package is also provided.

公开(公告)号：US11626441B2

公开(公告)日：2023-04-11

申请号：US16745139

申请日：2020-01-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho

IPC: H01L27/146 ,  G02B3/00

Abstract: An optical module includes an image sensor and micro lens array. The image sensor has at least one group of pixels. The micro lens array is disposed on the image sensor. The at least one group of pixels is shifted from the micro lens array in a first direction from a top view perspective.

公开(公告)号：US11892570B2

公开(公告)日：2024-02-06

申请号：US16825704

申请日：2020-03-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho

IPC: G01S7/497 ,  G01S7/481 ,  G01S17/08 ,  G01S17/04 ,  G01S1/04

CPC classification number: G01S7/497 ,  G01S1/04 ,  G01S7/4814 ,  G01S7/4816 ,  G01S17/08

Abstract: An optical assembly includes a light-emitting device, a partition structure and a cover. The partition structure defines a first space for accommodating the light-emitting device. The cover is disposed over the partition structure. The cover has a first surface facing the partition structure and a second surface opposite to the first surface. A light emitted by the light-emitting device forms a first irradiance pattern projected on the second surface of the cover, and the first irradiance pattern includes a first dark zone traversing the first irradiance pattern.

公开(公告)号：US11892346B2

公开(公告)日：2024-02-06

申请号：US17707802

申请日：2022-03-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Ying-Chung Chen

IPC: G01J1/02

CPC classification number: G01J1/0209 ,  G01J1/0214

Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.

公开(公告)号：US11551963B2

公开(公告)日：2023-01-10

申请号：US16791938

申请日：2020-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Ling Ma ,  Ying-Chung Chen ,  Hsin-Ying Ho ,  Cheng-Ling Huang ,  Chang Chin Tsai

IPC: H01L33/00 ,  H01L33/18 ,  H01L21/82 ,  H01L21/683 ,  H01L31/18

Abstract: A semiconductor device package includes a substrate, a partition structure and a polymer film. The partition structure is disposed on the substrate and defines a space for accommodating a semiconductor device. The polymer film is adjacent to a side of the partition structure distal to the substrate. A first side surface of the polymer film substantially aligns with a first side surface of the partition structure.

公开(公告)号：US11257799B2

公开(公告)日：2022-02-22

申请号：US16404337

申请日：2019-05-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho

IPC: H01L25/16 ,  H01L31/12 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/167 ,  H01L31/173 ,  H02S40/44 ,  G01S7/481 ,  G01S17/04

Abstract: An optical sensor module includes: (1) a lid defining a first chamber and a second chamber isolated from the first chamber; (2) a light emitting component disposed within the first chamber; and (3) a light sensing component disposed within the second chamber; wherein the lid includes a capping substrate and a top of the first chamber and a top of the second chamber are demarcated by the capping substrate, wherein the capping substrate defines a first penetrating hole at the top of the first chamber and a first runner connecting a side wall of the first penetrating hole, and wherein a first lens or a first transmissive panel is formed or disposed in the first penetrating hole and has an extension formed or disposed in the first runner connecting the side wall of the first penetrating hole.

公开(公告)号：US10910532B2

公开(公告)日：2021-02-02

申请号：US16198511

申请日：2018-11-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Hsun-Wei Chan

IPC: H01L33/58 ,  H01L25/16 ,  H01L33/52 ,  H01L33/60 ,  H03K17/00

Abstract: A semiconductor device package is provided, which includes a carrier, an emitter and a first transparent encapsulant. The carrier has a first surface. The emitter is disposed on the first surface. The first transparent encapsulant encapsulates the emitter. The first transparent encapsulant includes a body and a lens portion. The body has a first planar surface. The lens portion is disposed on the body and has a first planar surface. The first planar surface of the lens portion is substantially coplanar with the first planar surface of the body.