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    Semiconductor package device
    3.
    发明授权
    Semiconductor package device 有权

    公开(公告)号：US11133284B2

    公开(公告)日：2021-09-28

    申请号：US16232935

    申请日：2018-12-26

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Hsu-Nan Fang ,  Jen-Hsien Wong

    IPC: H01L25/065 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L25/00

    Abstract: A semiconductor package device includes a circuit layer, a first set of stacked components, a first conductive wire, a space and an electronic component. The first set of stacked components is disposed on the circuit layer. The first conductive wire electrically connects the first set of stacked components. The space is defined between the first set of stacked components and the circuit layer. The space accommodates the first conductive wire. The electronic component is disposed in the space.

    Package structure and method for manufacturing the same
    5.
    发明授权
    Package structure and method for manufacturing the same 有权

    公开(公告)号：US12136579B2

    公开(公告)日：2024-11-05

    申请号：US18226210

    申请日：2023-07-25

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Hsu-Nan Fang

    IPC: H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/367 ,  H01L23/373

    Abstract: A package structure and a method for manufacturing the same are provided. The package structure includes an electronic device, a heat spreader, an intermediate layer and an encapsulant. The electronic device includes a plurality of electrical contacts. The intermediate layer is interposed between the electronic device and the heat spreader. The intermediate layer includes a sintered material. The encapsulant encapsulates the electronic device. A surface of the encapsulant is substantially coplanar with a plurality of surfaces of the electrical contacts.

    Semiconductor device package with stacked die having traces on lateral surface
    6.
    发明授权
    Semiconductor device package with stacked die having traces on lateral surface 有权

    公开(公告)号：US11257788B2

    公开(公告)日：2022-02-22

    申请号：US16581009

    申请日：2019-09-24

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Hsu-Nan Fang ,  Chun-Jun Zhuang

    IPC: H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00 ,  H01L25/00 ,  H01L21/683 ,  H01L21/78 ,  H01L21/56

    Abstract: A semiconductor device package includes a first electronic component, a plurality of first conductive traces, a second electronic component, a plurality of second conductive traces and a plurality of first conductive structures. The first electronic component has a first active surface. The first conductive traces are disposed on and electrically connected to the first active surface. The second electronic component is stacked on the first electronic component. The second electronic component has an inactive surface facing the first active surface, a second active surface opposite the inactive surface, and at least one lateral surface connecting the second active surface and the inactive surface. The second conductive traces are electrically connected to the second active surface, and extending from the second active surface to the lateral surface. The first conductive structures are electrically connecting the second conductive traces to the first conductive traces, respectively.

    Semiconductor package and method for manufacturing the same
    8.
    发明授权
    Semiconductor package and method for manufacturing the same 有权

    公开(公告)号：US11139252B2

    公开(公告)日：2021-10-05

    申请号：US16802479

    申请日：2020-02-26

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Hsu-Nan Fang ,  Chun-Jun Zhuang ,  Yung I. Yeh

    IPC: H01L23/552 ,  H01L23/31 ,  H01L23/00 ,  H01L21/56

    Abstract: A semiconductor package includes a semiconductor die, a plurality of conductive bumps, a shielding layer, an encapsulant and a redistribution layer. The semiconductor die has an active surface, a backside surface and a lateral surface. The conductive bumps are disposed on the active surface of the semiconductor die. The shielding layer is disposed on the lateral surface of the semiconductor die. The encapsulant covers the shielding layer, and has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the first surface of the encapsulant and electrically connected to the semiconductor die through the conductive bumps. The shielding layer is electrically connected to the redistribution layer.

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    9.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME 审中-公开

    公开(公告)号：US20190109117A1

    公开(公告)日：2019-04-11

    申请号：US16152270

    申请日：2018-10-04

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Hsu-Nan Fang ,  Chun-Jun Zhuang ,  Yung I. Yeh ,  Ming-Chiang Lee

    IPC: H01L25/065 ,  H01L23/31 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

    Abstract: A semiconductor device package includes a first redistribution layer (RDL), a first die, a second die, a second RDL and an encapsulant. The first die is disposed on the first RDL and is electrically connected to the first RDL. The first die has a first electrical contact. The second die is disposed on the first RDL and is electrically connected to the first RDL. The second die has a first electrical contact. The second RDL is surrounded by the first RDL. The second RDL has a first electrical contact electrically connected to the first electrical contact of the first die and a second electrical contact electrically connected to the first electrical contact of the second die. A size of the first electrical contact of the second RDL is greater than a size of the second electrical contact of the second RDL.

    Semiconductor package structure and method for manufacturing the same
    10.
    发明授权
    Semiconductor package structure and method for manufacturing the same 有权

    公开(公告)号：US12249578B2

    公开(公告)日：2025-03-11

    申请号：US17356199

    申请日：2021-06-23

    Applicant: Advanced Semiconductor Engineering, Inc.

    Inventor： Hsu-Nan Fang

    IPC: H01L23/535 ,  H01L23/00 ,  H01L25/16

    Abstract: A semiconductor package structure and a method of manufacturing the same are provided. The semiconductor package structure includes an electronic component having a first surface, a second surface opposite to the first surface and a circuit structure closer to the first surface than to the second surface. The semiconductor package structure also includes a passive component connected to the second surface of the electronic component. The semiconductor package structure further includes a conductive element extending into the electronic component and configured to electrically connect the circuit structure with the passive component.

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