公开(公告)号：US12300560B2

公开(公告)日：2025-05-13

申请号：US18440919

申请日：2024-02-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Han Wang ,  Ian Hu

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/683 ,  H01L23/00 ,  H01L23/48 ,  H01L25/065 ,  H01L25/10

Abstract: A semiconductor device package includes a first substrate, a second substrate, and a first electronic component between the first substrate and the second substrate. The first electronic component has a first surface facing the first substrate and a second surface facing the second substrate. The semiconductor device package also includes a first electrical contact disposed on the first surface of the first electronic component and electrically connecting the first surface of the first electronic component with the first substrate. The semiconductor device package also includes a second electrical contact disposed on the second surface of the first electronic component and electrically connecting the second surface of the first electronic component with the second substrate. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US11217502B2

公开(公告)日：2022-01-04

申请号：US16676284

申请日：2019-11-06

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ian Hu ,  Meng-Kai Shih ,  Chih-Pin Hung

IPC: H01L23/367 ,  H01L23/13 ,  H01L23/00 ,  H01L23/427

Abstract: A semiconductor device package includes a substrate, an electronic component disposed on the substrate, a supporting structure disposed on the substrate and surrounding the electronic component, and a heat spreading structure disposed on the supporting structure. A length of the supporting structure and a length of the heat spreading structure are greater than a length of the substrate.

公开(公告)号：US10410942B2

公开(公告)日：2019-09-10

申请号：US15823467

申请日：2017-11-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Tsan-Hsien Chen ,  Ian Hu ,  Jin-Feng Yang ,  Shih-Wei Chen ,  Hui-Chen Hsu

IPC: H01L23/34 ,  H01L23/31 ,  H01L23/433 ,  H01L21/56 ,  H01L23/00 ,  H01L23/373 ,  H01L21/48

Abstract: A semiconductor package device includes a substrate, an electronic component, a bonding wire, a heat spreader, a thermal conductive structure and an encapsulant. The electronic component is disposed on the substrate. The bonding wire connects the electronic component to the substrate. The heat spreader is disposed over the electronic component. The thermal conductive structure is disposed between the heat spreader and the electronic component. The thermal conductive structure includes two polymeric layers and a thermal conductive layer. The conductive layer is disposed between the two polymeric layers. The thermal conductive layer has a first end in contact with the electronic component and a second end in contact with the heat spreader. The encapsulant covers the bonding wire.

公开(公告)号：US11482482B2

公开(公告)日：2022-10-25

申请号：US17018701

申请日：2020-09-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ian Hu ,  Jin-Feng Yang ,  Cheng-Yu Tsai ,  Hung-Hsien Huang

IPC: H01L23/498 ,  H01L23/427 ,  H01L21/48 ,  H01L23/00

Abstract: A substrate structure, a method for manufacturing the same and a semiconductor device structure including the same are provided. The substrate structure includes a heat pipe, a first conductive layer and an insulation layer. The heat pipe has an upper surface and a lower surface. The heat pipe includes an opening extending from the upper surface to the lower surface. The first conductive layer is disposed on the upper surface and includes a via structure passing through the opening. The insulation layer is disposed between the heat pipe and the conductive layer.

公开(公告)号：US10985085B2

公开(公告)日：2021-04-20

申请号：US16413467

申请日：2019-05-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ian Hu ,  Chih-Pin Hung ,  Meng-Kai Shih

IPC: H01L23/427 ,  H01L25/065 ,  H01L23/367 ,  F28D15/04

Abstract: A thermal conductive device includes a first conductive plate, a second conductive plate, a plurality of wicks and a fluid. The first conductive plate has a first portion adjacent to edges of the first conductive plate and a second portion far away from the edges. The second conductive plate has a first portion adjacent to edges of the first conductive plate and a second portion far away from the edges. The first portion and the second portion of the first conductive plate are respectively connected to the first portion and the second portion of the second conductive plate to define a chamber. The plurality of wicks are disposed within the chamber. The fluid is disposed within the chamber.

公开(公告)号：US10861726B2

公开(公告)日：2020-12-08

申请号：US16138938

申请日：2018-09-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chun Hung Tsai ,  Hsuan Yu Chen ,  Ian Hu ,  Meng-Kai Shih ,  Shin-Luh Tarng

IPC: H01L21/67 ,  G01N21/95 ,  G06T7/00 ,  G01B11/25 ,  G01N21/956

Abstract: An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40° to approximately 85° with respect to the surface of the carrier.

公开(公告)号：US10453802B2

公开(公告)日：2019-10-22

申请号：US15691455

申请日：2017-08-30

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ian Hu

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48 ,  H01L23/13 ,  H01L23/538 ,  H01L25/065

Abstract: A semiconductor package structure includes a substrate, at least one first semiconductor element, a heat dissipation structure and an insulation layer. The at least one first semiconductor element is attached to the substrate, and has a first surface and a second surface opposite to the first surface. The first surface of the at least one first semiconductor element faces the substrate. The heat dissipation structure is disposed on the second surface of the at least one first semiconductor element. The insulation layer is disposed on the heat dissipation structure, and defines a plurality of openings extending through the insulation layer and exposing a plurality of exposed portions of the heat dissipation structure.

公开(公告)号：US11410902B2

公开(公告)日：2022-08-09

申请号：US16572340

申请日：2019-09-16

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Han Wang ,  Ian Hu

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/00 ,  H01L21/56 ,  H01L23/48 ,  H01L21/683 ,  H01L25/10

Abstract: A semiconductor device package includes a first substrate, a second substrate, and a first electronic component between the first substrate and the second substrate. The first electronic component has a first surface facing the first substrate and a second surface facing the second substrate. The semiconductor device package also includes a first electrical contact disposed on the first surface of the first electronic component and electrically connecting the first surface of the first electronic component with the first substrate. The semiconductor device package also includes a second electrical contact disposed on the second surface of the first electronic component and electrically connecting the second surface of the first electronic component with the second substrate. A method of manufacturing a semiconductor device package is also disclosed.

公开(公告)号：US11375124B2

公开(公告)日：2022-06-28

申请号：US16285000

申请日：2019-02-25

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ming-Han Wang ,  Ian Hu ,  Meng-Kai Shih ,  Hsuan Yu Chen

IPC: H04N5/232 ,  H04N5/247 ,  G06T7/00 ,  H04N5/225

Abstract: An optical measurement equipment includes an adjustment apparatus and at least two image capturing devices. The image capturing devices have a depth-of-field and attached to the adjustment apparatus. The image capturing devices are adjusted by the adjustment apparatus such that a portion to be measured of a workpiece is located within the depth-of-field of the image capturing devices.

公开(公告)号：US11152274B2

公开(公告)日：2021-10-19

申请号：US15701394

申请日：2017-09-11

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei-Hsuan Lee ,  Sung-Mao Li ,  Ming-Han Wang ,  Ian Hu

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/00 ,  H01L23/544

Abstract: A semiconductor device package includes a semiconductor device, a conductive bump, a first encapsulant and a second encapsulant. The semiconductor device has a first surface, a second surface and a lateral surface. The second surface is opposite to the first surface. The lateral surface extends between the first surface and the second surface. The semiconductor device comprises a conductive pad adjacent to the first surface of the semiconductor device. The conductive bump is electrically connected to the conductive pad. The first encapsulant covers the first surface of the semiconductor device and a first portion of the lateral surface of the semiconductor device, and surrounds the conductive bump. The second encapsulant covers the second surface of the semiconductor device and a second portion of the lateral surface of the semiconductor device.