公开(公告)号：US12228778B2

公开(公告)日：2025-02-18

申请号：US17866400

申请日：2022-07-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei Lin ,  Mei-Ju Lu

IPC: G02B6/26 ,  G02B6/30 ,  G02B6/42 ,  B82Y20/00 ,  G02B6/10 ,  G02B6/12 ,  G02B6/122 ,  G02B6/36

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component, an optical component, and a connection element. The photonic component includes an optical transmission portion, which includes a plurality of first terminals exposed from a first surface of the photonic component. The optical component faces the first surface of the photonic component. The optical component is configured to transmit optical signals to or receive optical signals from the optical transmission portion. The connection element is disposed between the first surface of the photonic component and the optical component. The connection element is configured to reshape the optical signals.

公开(公告)号：US10989885B2

公开(公告)日：2021-04-27

申请号：US16413487

申请日：2019-05-15

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju Lu ,  Chi-Han Chen ,  Zong-Yu Yang ,  Pei-Jung Yang

IPC: G02B6/42

Abstract: A semiconductor module includes a photonic integrated circuit and a receptacle. The photonic integrated circuit includes a substrate, a waveguide disposed on the substrate, and a recess in the substrate and having a first width. The receptacle is bonded to a top surface of the substrate and aligning with the recess. The receptacle and the recess jointly form a cavity, and the receptacle has a second width greater than the first width. A method for manufacturing the semiconductor module is also disclosed.

公开(公告)号：US10241264B2

公开(公告)日：2019-03-26

申请号：US15201095

申请日：2016-07-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi-Min Chin ,  Yung-Shun Chang ,  Mei-Ju Lu ,  Jia-Hao Zhang ,  Wen-Chi Hung

IPC: G02B6/36 ,  G02B6/12

Abstract: A semiconductor device package includes a substrate and an optical device. The optical device includes a first portion extending into the substrate and not extending beyond a first surface of the substrate. The optical device further includes a second portion extending along the first surface of the substrate.

公开(公告)号：US20170336561A1

公开(公告)日：2017-11-23

申请号：US15406509

申请日：2017-01-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yi-Min Chin ,  Jia-Hao Zhang ,  Chi-Han Chen ,  Mei-Ju Lu

IPC: G02B6/122 ,  H01L31/167

CPC classification number: G02B6/122 ,  H01L31/167

Abstract: A semiconductor device includes a substrate, a passivation layer and an optical element. The substrate includes a surface and a sidewall. The passivation layer is disposed on the surface of the substrate. The optical element is disposed in the substrate and exposed from the sidewall of the substrate. The sidewall of the substrate is inclined towards the surface of the substrate at an angle of approximately 87 degrees to approximately 89 degrees.

公开(公告)号：US11982853B2

公开(公告)日：2024-05-14

申请号：US17492495

申请日：2021-10-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei Lin ,  Mei-Ju Lu

IPC: G02B6/42 ,  G02B6/43

CPC classification number: G02B6/43 ,  G02B6/4227 ,  G02B6/4239

Abstract: An optoelectronic package and a method of manufacturing an optoelectronic package are provided. The optoelectronic package includes a carrier. The carrier includes a first region and a second region. The first region is configured to supply power to a processing unit disposed on the carrier. The second region is for accommodating at least one optoelectronic device electrically coupled to the processing unit.

公开(公告)号：US11837566B2

公开(公告)日：2023-12-05

申请号：US17534358

申请日：2021-11-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju Lu ,  Chi-Han Chen ,  Chang-Yu Lin ,  Jr-Wei Lin ,  Chih-Pin Hung

IPC: H01L23/00

CPC classification number: H01L24/17 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/02373 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/1703 ,  H01L2224/17177 ,  H01L2224/73204 ,  H01L2224/81951

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

公开(公告)号：US11675136B2

公开(公告)日：2023-06-13

申请号：US17129644

申请日：2020-12-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei Lin ,  Mei-Ju Lu

IPC: G02B6/36 ,  G02B6/30 ,  G02B6/42

CPC classification number: G02B6/3652 ,  G02B6/305 ,  G02B6/3636 ,  G02B6/4239

Abstract: An optoelectronic structure includes a substrate, an electronic die and a photonic die. The electronic die is disposed on the substrate and includes a first surface, wherein the first surface is configured to support an optical component. The photonic die is disposed on the first surface of the electronic die and has an active surface toward the first surface of the electronic die and a side surface facing the optical component.

公开(公告)号：US11183474B2

公开(公告)日：2021-11-23

申请号：US16673699

申请日：2019-11-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju Lu ,  Chi-Han Chen ,  Chang-Yu Lin ,  Jr-Wei Lin ,  Chih-Pin Hung

IPC: H01L23/00

Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.

公开(公告)号：US11929357B2

公开(公告)日：2024-03-12

申请号：US17506462

申请日：2021-10-20

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Jr-Wei Lin ,  Mei-Ju Lu

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/538

CPC classification number: H01L25/167 ,  H01L23/5386 ,  H01L24/16 ,  H01L2224/16227

Abstract: An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.

公开(公告)号：US11835757B2

公开(公告)日：2023-12-05

申请号：US17492491

申请日：2021-10-01

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Ju Lu ,  Jr-Wei Lin ,  Chang-Feng You

IPC: G02B6/12 ,  G02B6/42

CPC classification number: G02B6/12004 ,  G02B6/4203 ,  G02B2006/12121

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component. The photonic component has a bottom surface and a lateral surface. The lateral surface of the photonic component includes a light coupling region and a non-light coupling plane. The non-light coupling plane contacts the bottom surface. The light coupling region and the non-light coupling plane are not aligned.