公开(公告)号：US10177099B2

公开(公告)日：2019-01-08

申请号：US15482464

申请日：2017-04-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mark Gerber ,  Rich Rice ,  Bradford Factor

IPC: H01L23/00 ,  H01L23/373 ,  H01L25/065 ,  H01L25/00 ,  H01L25/10

Abstract: A semiconductor package structure includes a substrate, a first semiconductor device, a first encapsulant and a second encapsulant. The substrate has a first coefficient of thermal expansion CTE1. The first semiconductor device is disposed adjacent to a first surface of the substrate. The first encapsulant is disposed on the first surface of the substrate, and covers at least a portion of the first semiconductor device. The first encapsulant has a second coefficient of thermal expansion CTE2. The second encapsulant is disposed on a second surface of the substrate and has a third coefficient of thermal expansion CTE3. A difference between CTE1 and CTE2 is substantially equal to a difference between CTE1 and CTE3.