公开(公告)号：US10177268B2

公开(公告)日：2019-01-08

申请号：US15870278

申请日：2018-01-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung Chen ,  Hsu-Liang Hsiao ,  Sung-Fu Yang

IPC: H01L31/16 ,  H01L31/0232

Abstract: An optical device includes: (1) an emitter; (2) a detector disposed adjacent to the emitter; (3) an encapsulation layer encapsulating the emitter and the detector; (4) a dielectric layer disposed on the emitter, the detector and the encapsulation layer; (5) a redistribution layer disposed on the dielectric layer and electrically connected to the emitter and the detector; and (6) a light shielding structure disposed on the encapsulation layer and corresponding to a location between the emitter and the detector.

公开(公告)号：US09905722B1

公开(公告)日：2018-02-27

申请号：US15391648

申请日：2016-12-27

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung Chen ,  Hsu-Liang Hsiao ,  Sung-Fu Yang

IPC: H01L31/12 ,  H01L31/16 ,  H01L31/0232

CPC classification number: H01L31/16 ,  H01L31/02325

Abstract: An optical module structure includes a light source, a light receiver, a dielectric layer, a circuit layer, an encapsulant and a light shielding structure. The light source is embedded in the encapsulant, and a first surface of the light source is exposed from a first surface of the encapsulant. The light receiver is embedded in the encapsulant, and a first surface of the light receiver is exposed from the first surface of the encapsulant. The dielectric layer is disposed on the first surface of the encapsulant. The circuit layer is disposed on the dielectric layer and electrically connected to the light source and the light receiver. The light shielding structure is disposed in the dielectric layer corresponding to a location between the light source and the light receiver.