公开(公告)号：US11892346B2

公开(公告)日：2024-02-06

申请号：US17707802

申请日：2022-03-29

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Ying-Chung Chen

IPC: G01J1/02

CPC classification number: G01J1/0209 ,  G01J1/0214

Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.

公开(公告)号：US11551963B2

公开(公告)日：2023-01-10

申请号：US16791938

申请日：2020-02-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Wei Ling Ma ,  Ying-Chung Chen ,  Hsin-Ying Ho ,  Cheng-Ling Huang ,  Chang Chin Tsai

IPC: H01L33/00 ,  H01L33/18 ,  H01L21/82 ,  H01L21/683 ,  H01L31/18

Abstract: A semiconductor device package includes a substrate, a partition structure and a polymer film. The partition structure is disposed on the substrate and defines a space for accommodating a semiconductor device. The polymer film is adjacent to a side of the partition structure distal to the substrate. A first side surface of the polymer film substantially aligns with a first side surface of the partition structure.

公开(公告)号：US11262197B2

公开(公告)日：2022-03-01

申请号：US16683117

申请日：2019-11-13

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung Chen ,  Hsun-Wei Chan ,  Lu-Ming Lai ,  Kuang-Hsiung Chen

IPC: G01C3/08

Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.

公开(公告)号：US10177268B2

公开(公告)日：2019-01-08

申请号：US15870278

申请日：2018-01-12

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ying-Chung Chen ,  Hsu-Liang Hsiao ,  Sung-Fu Yang

IPC: H01L31/16 ,  H01L31/0232

Abstract: An optical device includes: (1) an emitter; (2) a detector disposed adjacent to the emitter; (3) an encapsulation layer encapsulating the emitter and the detector; (4) a dielectric layer disposed on the emitter, the detector and the encapsulation layer; (5) a redistribution layer disposed on the dielectric layer and electrically connected to the emitter and the detector; and (6) a light shielding structure disposed on the encapsulation layer and corresponding to a location between the emitter and the detector.

公开(公告)号：US11888081B2

公开(公告)日：2024-01-30

申请号：US17227152

申请日：2021-04-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Mei-Yi Wu ,  Chang Chin Tsai ,  Bo-Yu Huang ,  Ying-Chung Chen

IPC: H01L31/16 ,  H04B10/40 ,  H01L33/64 ,  H01L33/62 ,  H01L31/024

CPC classification number: H01L31/16 ,  H01L31/024 ,  H01L33/62 ,  H01L33/644 ,  H04B10/40

Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.

公开(公告)号：US11515220B2

公开(公告)日：2022-11-29

申请号：US16703385

申请日：2019-12-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Chia Yun Hsu ,  Ying-Chung Chen

IPC: H01L23/04 ,  H01L31/0203 ,  H01L31/02 ,  H01L23/00 ,  H01L23/10

Abstract: A semiconductor package structure includes a carrier, an electronic device, a spacer, a transparent panel, and a conductive wire. The electronic device has a first surface and an optical structure on the first surface. The spacer is disposed on the first surface to enclose the optical structure of the electronic device. The transparent panel is disposed on the spacer. The conductive wire electrically connects the electronic device to the carrier and is exposed to air.

公开(公告)号：US11495511B2

公开(公告)日：2022-11-08

申请号：US17006664

申请日：2020-08-28

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-Che Huang ,  Lu-Ming Lai ,  Ying-Chung Chen

IPC: H01L23/32 ,  H01L23/498 ,  H01L21/48

Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a semiconductor package device, a first constraint structure and a second constraint structure. The first constraint structure is connected to the semiconductor package device. The second constraint structure is connected to the semiconductor package device and under a projection of the semiconductor package device.

公开(公告)号：US11287312B2

公开(公告)日：2022-03-29

申请号：US16405838

申请日：2019-05-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Hsin-Ying Ho ,  Ying-Chung Chen

IPC: G01J1/02

Abstract: An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.

公开(公告)号：US10446454B2

公开(公告)日：2019-10-15

申请号：US15351241

申请日：2016-11-14

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yu-An Fang ,  Ying-Chung Chen ,  Cheng-Ling Huang

IPC: H01L23/053 ,  H01L23/10 ,  B81B7/00 ,  B81C1/00 ,  H01L23/04 ,  H01L21/683

Abstract: A semiconductor device package comprises a carrier having a through hole. A lid is over the carrier and comprises a first side wall, a second side wall, and a connection wall. The second side wall is opposite the first side wall, and the connection wall is between the first side wall and the second side wall. The lid and the carrier form a plurality of chambers. The first side wall, the second side wall and the connection wall form a space to fluidly connect the plurality of chambers.

公开(公告)号：US09977147B2

公开(公告)日：2018-05-22

申请号：US14975036

申请日：2015-12-18

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Ruei-Bin Ma ,  Ying-Chung Chen ,  Lu-Ming Lai

IPC: H01L31/16 ,  H01L25/16 ,  G01V8/12 ,  H01L31/167

CPC classification number: G01V8/12 ,  H01L25/167 ,  H01L31/167 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: An optical module includes a carrier, a light-emitting component disposed over the carrier, an optical sensor disposed over the carrier, a housing, and a lens. The housing is disposed over the carrier and encircles the light-emitting component and the optical sensor. The housing defines a first accommodation space including a first aperture and a second aperture below the first aperture. The housing includes a first sidewall surrounding the first aperture, a second sidewall surrounding the second aperture, and a first support portion where a bottom end of the first sidewall and a top end of the second sidewall meet. The lens is located in the first aperture and is supported by the first support portion. One of the light-emitting component or the optical sensor is located in the first accommodation space.