公开(公告)号：US12224481B2

公开(公告)日：2025-02-11

申请号：US18118738

申请日：2023-03-07

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin Ho ,  Chih-Cheng Lee ,  Chun Chen Chen ,  Yuanhao Yu

IPC: H01Q1/22 ,  H01L23/31 ,  H01L23/66 ,  H01Q1/40 ,  H01Q21/00 ,  H01Q21/06

Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.

公开(公告)号：US11811957B2

公开(公告)日：2023-11-07

申请号：US17324958

申请日：2021-05-19

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao Yu ,  Chung Ju Yu ,  Jui-Hsien Wang ,  Chai-Chi Lin ,  Hong Jie Chen

IPC: H04M1/02 ,  H01L25/16 ,  H01L23/498

CPC classification number: H04M1/0202 ,  H01L23/4985 ,  H01L25/16

Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package comprises a substrate, an antenna, and an active component. The antenna is disposed at least partially within the substrate. The active component is disposed on the substrate and electrically connected to the antenna. A location of the antenna is configured to be adjustable with respect to a location of the active component.

公开(公告)号：US11756904B2

公开(公告)日：2023-09-12

申请号：US16895989

申请日：2020-06-08

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao Yu ,  Cheng-Lin Ho ,  Yu-Lin Shih ,  Shih-Chun Li

IPC: H01L23/66 ,  H01Q1/22

CPC classification number: H01L23/66 ,  H01Q1/2283 ,  H01L2223/6616 ,  H01L2223/6677

Abstract: A semiconductor device package includes a substrate, a reflector, a radiator and a first director. The reflector is disposed on a surface of the substrate. The radiator is disposed over the reflector. The first director is disposed over the radiator. The reflector, the radiator and the first director have different elevations with respect to the surface of the substrate. The radiator and the first director define an antenna.

公开(公告)号：US11489508B2

公开(公告)日：2022-11-01

申请号：US17013333

申请日：2020-09-04

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao Yu ,  Weifan Wu ,  Tingyen Chang ,  Mingjhih Tsai ,  Fengchuan Tsai

IPC: H03H7/38 ,  H01Q1/22 ,  H04R1/10 ,  H04R1/22

Abstract: A wearable device and method for operating the same are provided. The wearable device includes an antenna element, a first matching circuit, a second matching circuit, and a switch element. The first matching circuit has a first impedance value. The second matching circuit has a second impedance value different from the first impedance value. The switch element is configured to determine whether the antenna element is electrically connected with the first matching circuit or the second matching circuit.

公开(公告)号：US11201386B2

公开(公告)日：2021-12-14

申请号：US16670487

申请日：2019-10-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin Ho ,  Chih-Cheng Lee ,  Chun Chen Chen ,  Yuanhao Yu

IPC: H01L23/495 ,  H01L21/786 ,  H01Q1/22 ,  H01L23/28 ,  H01L21/768 ,  H01L23/66

Abstract: A semiconductor device package and a method for manufacturing the same are provided. The semiconductor device package includes a circuit layer and an antenna module. The circuit layer has a first surface, a second surface opposite to the first surface and a lateral surface. The lateral surface extends between the first surface and the second surface. The circuit layer has an interconnection structure. The antenna module has an antenna pattern layer and is disposed on the first surface of the circuit layer. The lateral surface of the circuit layer is substantially coplanar with a lateral surface of the antenna module.

公开(公告)号：US11682660B2

公开(公告)日：2023-06-20

申请号：US17076480

申请日：2020-10-21

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao Yu ,  Chun Chen Chen ,  Shang Chien Chen

IPC: H01L25/10 ,  H01L25/18 ,  G06F3/0354

CPC classification number: H01L25/105 ,  H01L25/18 ,  G06F3/03545 ,  H01L2225/107 ,  H01L2225/1058 ,  H01L2225/1076

Abstract: The present disclosure provides a semiconductor structure including a first substrate having a first surface, a first semiconductor device package disposed on the first surface of the first substrate, and a second semiconductor device package disposed on the first surface of the first substrate. The first semiconductor device package and the second semiconductor device package have a first signal transmission path through the first substrate and a second signal transmission path insulated from the first substrate. The present disclosure also provides an electronic device.

公开(公告)号：US11658102B2

公开(公告)日：2023-05-23

申请号：US16749635

申请日：2020-01-22

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao Yu ,  Cheng Yuan Chen ,  Chun Chen Chen ,  Jiming Li ,  Chien-Wen Tu

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/66

CPC classification number: H01L23/49811 ,  H01L21/4889 ,  H01L23/66 ,  H01L2223/6605

Abstract: A semiconductor device package includes a carrier, an electronic component and a connector. The electronic component is disposed on the carrier. The connector is disposed on the carrier and electrically connected to the electronic component. A S11 parameter of the connector is less than −20 dB.

公开(公告)号：US11600901B2

公开(公告)日：2023-03-07

申请号：US16506654

申请日：2019-07-09

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng-Lin Ho ,  Chih-Cheng Lee ,  Chun Chen Chen ,  Yuanhao Yu

IPC: H01Q1/22 ,  H01L23/66 ,  H01Q1/40 ,  H01Q21/00 ,  H01L23/31 ,  H01Q21/06

Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.

公开(公告)号：US11552026B2

公开(公告)日：2023-01-10

申请号：US16264599

申请日：2019-01-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Cheng Yuan Chen ,  Jiming Li ,  Chun Chen Chen ,  Yuanhao Yu

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66 ,  H01L23/00 ,  H01L21/56 ,  H01Q1/22 ,  H01Q1/52 ,  H01L21/48

Abstract: A semiconductor package includes a substrate, a preformed feeding element, a preformed shielding element, and an encapsulant. The preformed feeding element is disposed on the substrate and the preformed feeding element is disposed on the substrate and adjacent to the preformed feeding element. The encapsulant encapsulates the preformed feeding element and the preformed shielding element.

公开(公告)号：US11532878B2

公开(公告)日：2022-12-20

申请号：US17239481

申请日：2021-04-23

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Yuanhao Yu ,  Wei Fan Wu ,  Feng Chuan Tsai ,  Mingjhih Tsai ,  Shih Yuan Ho

IPC: H01Q1/48 ,  G09G3/00 ,  G06F3/041 ,  G02F1/167 ,  G02F1/16753 ,  H01Q1/24

Abstract: The present disclosure provides an electronic device. The electronic device includes a display module having a grounding element disposed under the display module and an antenna pattern. The grounding element is configured to function as a reference ground of the antenna pattern. A wearable device is also provided.