公开(公告)号：US07461771B2

公开(公告)日：2008-12-09

申请号：US11112016

申请日：2005-04-22

Applicant: Alexander Leon

Inventor： Alexander Leon

IPC: B23K30/02

CPC classification number: H05K1/0268 ,  G01R1/07357 ,  H05K1/116 ,  H05K3/1225 ,  H05K3/3484 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/0545 ,  H05K2203/167

Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including colinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.

Abstract translation: 公开了一种处理与衬底连接的通孔的方法和探测通孔的方法。 将无铅焊膏的图案施加在通孔的孔周围，而不完全覆盖通孔的焊盘。 该膏被回流以在衬垫上形成无铅焊料的图案，其仅覆盖焊盘的表面区域的一部分并且位于孔周围。 焊料可以围绕孔基本上对称地定位。 在回流期间产生的焊剂不足以堵塞孔。 无铅焊料可以由包括共线的第一和第二边缘的刀片探针探测，并且相对于无铅焊料的图案具有优选的取向。

公开(公告)号：US20060238208A1

公开(公告)日：2006-10-26

申请号：US11221258

申请日：2005-09-06

Applicant: Alexander Leon

Inventor： Alexander Leon

IPC: G01R31/02

CPC classification number: G01R31/2808 ,  G01R1/06722 ,  G01R1/06738

Abstract: An arcuate blade probe is disclosed. The arcuate blade probe includes a shaft with a pair of faces that converge towards each other along a probe axis and terminate at a single edge that includes an arcuate profile. The arcuate profile provides a surface that makes an electrical connection between the edge and a node to be probed. The connection can be made along at least one portion of the edge. The edge can be used to probe lead-based and lead-free solder on the pads of vias and test pads. The arcuate profile give the edge a gradual arc that does not come to a sharp point so that the edge can probe vias with plugged holes.

Abstract translation: 公开了一种弓形刀片探针。 弓形刀片探针包括具有一对面的轴，所述一对面沿着探针轴线朝向彼此会聚，并终止于包括弧形轮廓的单个边缘。 弧形轮廓提供了一个在边缘和要探测的节点之间形成电连接的表面。 连接可以沿边缘的至少一部分进行。 该边缘可用于在通孔和测试垫的焊盘上探测铅基和无铅焊料。 弧形轮廓使边缘呈渐进的弧形，不会产生尖锐的边缘，因此边缘可以用堵塞的孔探测通孔。

公开(公告)号：US08102057B2

公开(公告)日：2012-01-24

申请号：US11645908

申请日：2006-12-27

Applicant: Alexander Leon ,  Rosa Reinosa ,  Michael David Carothers ,  Glen Griffiths

Inventor： Alexander Leon ,  Rosa Reinosa ,  Michael David Carothers ,  Glen Griffiths

IPC: B32B3/24

CPC classification number: H05K1/115 ,  H05K1/0268 ,  H05K3/3484 ,  H05K3/429 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/045 ,  Y10T428/24273

Abstract: Provided is an electrically conductive via for reducing flux residue. The via has a first aperture having a first diameter size. The via further has a second aperture having a second diameter size. A chamber is disposed between the first aperture and the second aperture, the chamber having a third diameter size. At least one of the diameters being of a different dimension than the other two. In addition, the via may also provide improved test point access in addition to reducing flux residue.

Abstract translation: 提供了用于减少助焊剂残留物的导电通孔。 通孔具有第一直径尺寸的第一孔。 通孔还具有具有第二直径尺寸的第二孔。 腔室设置在第一孔和第二孔之间，腔室具有第三直径尺寸。 直径中的至少一个与其他两个尺寸不同。 此外，除了还原助焊剂残留之外，通孔还可以提供改进的测试点存取。

公开(公告)号：US07954693B2

公开(公告)日：2011-06-07

申请号：US12263469

申请日：2008-11-01

Applicant: Alexander Leon

Inventor： Alexander Leon

IPC: B23K30/02

CPC classification number: H05K1/0268 ,  G01R1/07357 ,  H05K1/116 ,  H05K3/1225 ,  H05K3/3484 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/0545 ,  H05K2203/167

Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including collinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.

Abstract translation: 公开了一种处理与衬底连接的通孔的方法和探测通孔的方法。 将无铅焊膏的图案施加在通孔的孔周围，而不完全覆盖通孔的焊盘。 该膏被回流以在衬垫上形成无铅焊料的图案，其仅覆盖焊盘的表面区域的一部分并且位于孔周围。 焊料可以围绕孔基本上对称地定位。 在回流期间产生的焊剂不足以堵塞孔。 无铅焊料可以由包括共线的第一和第二边缘的刀片探针探测，并且相对于无铅焊料的图案具有优选的取向。

公开(公告)号：US20090051379A1

公开(公告)日：2009-02-26

申请号：US12263469

申请日：2008-11-01

Applicant: Alexander Leon

Inventor： Alexander Leon

IPC: G01R31/28

CPC classification number: H05K1/0268 ,  G01R1/07357 ,  H05K1/116 ,  H05K3/1225 ,  H05K3/3484 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/0545 ,  H05K2203/167

Abstract: A method of treating a via connected with a substrate and a method of probing the via are disclosed. A pattern of a lead-free solder paste is applied around a hole of the via without completely covering a pad of the via. The paste is reflowed to form a pattern of a lead-free solder on a pad that covers only a portion of a surface area of the pad and is positioned around the hole. The solder may be substantially symmetrically positioned around the hole. A flux generated during reflow is insufficient to plug the hole. The lead-free solder can be probed by a blade probe including collinear first and second edges and having a preferred orientation relative to the pattern of the lead-free solder.

Abstract translation: 公开了一种处理与衬底连接的通孔的方法和探测通孔的方法。 将无铅焊膏的图案施加在通孔的孔周围，而不完全覆盖通孔的焊盘。 该膏被回流以在衬垫上形成无铅焊料的图案，其仅覆盖焊盘的表面区域的一部分并且位于孔周围。 焊料可以围绕孔基本上对称地定位。 在回流期间产生的焊剂不足以堵塞孔。 无铅焊料可以由包括共线的第一和第二边缘的刀片探针探测，并且相对于无铅焊料的图案具有优选的取向。

公开(公告)号：US07453278B2

公开(公告)日：2008-11-18

申请号：US11777177

申请日：2007-07-12

Applicant: Alexander Leon

Inventor： Alexander Leon

IPC: G01R31/02

CPC classification number: G01R31/2808 ,  G01R1/06722 ,  G01R1/06738

Abstract: A method of using a blade probe for probing a node of a circuit where the node includes a pad surface surrounding a node hole is disclosed. A probe having a longitudinal probe axis, a shaft, and a probe blade is provided. The shaft is generally concentric to the longitudinal probe axis and is made from an electrically conductive material. A probe blade is disposed at a first end of the shaft. The probe blade includes first and second faces positioned about the longitudinal probe axis in facing opposition to each other. The first and second faces converge towards each other and terminate at an edge. The probe is urged in a direction generally parallel to the longitudinal probe axis to create at least one electrical contact point between the edge of the probe blade and one of the solder disposed a pad surface of a node or the solder disposed on a rim of a hole of the node. Electrical coupling is established between the probe and the node via the at least one electrical contact point and the node is electrically evaluated.

Abstract translation: 公开了一种使用刀片探针来探测节点包括围绕节点孔的衬垫表面的电路的节点的方法。 提供具有纵向探针轴的探头，轴和探针叶片。 轴通常与纵向探针轴线同心，并由导电材料制成。 探针刀片设置在轴的第一端。 探针刀片包括围绕纵向探针轴线相对定位的第一和第二面。 第一和第二面朝向彼此会聚并终止于边缘。 探针沿大致平行于纵向探针轴线的方向被推压，以在探针叶片的边缘和焊料之一之间形成至少一个电接触点，其中一个焊料将一个节点的焊盘表面或设置在 节点的孔。 通过所述至少一个电接触点在所述探针和所述节点之间建立电耦合，并且对所述节点进行电学评估。

公开(公告)号：US20080160252A1

公开(公告)日：2008-07-03

申请号：US11645908

申请日：2006-12-27

Applicant: Alexander Leon ,  Rosa Reinosa ,  Michael David Carothers ,  Glen Griffiths

Inventor： Alexander Leon ,  Rosa Reinosa ,  Michael David Carothers ,  Glen Griffiths

IPC: B32B3/24

CPC classification number: H05K1/115 ,  H05K1/0268 ,  H05K3/3484 ,  H05K3/429 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/045 ,  Y10T428/24273

Abstract: Provided is an electrically conductive via for reducing flux residue. The via has a first aperture having a first diameter size. The via further has a second aperture having a second diameter size. A chamber is disposed between the first aperture and the second aperture, the chamber having a third diameter size. At least one of the diameters being of a different dimension than the other two. In addition, the via may also provide improved test point access in addition to reducing flux residue.

Abstract translation: 提供了用于减少助焊剂残留物的导电通孔。 通孔具有第一直径尺寸的第一孔。 通孔还具有具有第二直径尺寸的第二孔。 腔室设置在第一孔和第二孔之间，腔室具有第三直径尺寸。 直径中的至少一个与其他两个尺寸不同。 此外，除了还原助焊剂残留之外，通孔还可以提供改进的测试点存取。

公开(公告)号：US20070262784A1

公开(公告)日：2007-11-15

申请号：US11781146

申请日：2007-07-20

Applicant: Alexander Leon

Inventor： Alexander Leon

IPC: G01R31/02

CPC classification number: G01R31/2808 ,  G01R1/06722 ,  G01R1/06738

Abstract: An arcuate blade probe is disclosed. The arcuate blade probe includes a shaft with a pair of faces that converge towards each other along a probe axis and terminate at a single edge that includes an arcuate profile. The arcuate profile provides a surface that makes an electrical connection between the edge and a node to be probed. The connection can be made along at least one portion of the edge. The edge can be used to probe lead-based and lead-free solder on the pads of vias and test pads. The arcuate profile give the edge a gradual arc that does not come to a sharp point so that the edge can probe vias with plugged holes.

Abstract translation: 公开了一种弓形刀片探针。 弓形刀片探针包括具有一对面的轴，所述一对面沿着探针轴线朝向彼此会聚，并终止于包括弧形轮廓的单个边缘。 弧形轮廓提供了一个在边缘和要探测的节点之间形成电连接的表面。 连接可以沿边缘的至少一部分进行。 该边缘可用于在通孔和测试垫的焊盘上探测铅基和无铅焊料。 弧形轮廓使边缘呈渐进的弧形，不会产生尖锐的边缘，因此边缘可以用堵塞的孔探测通孔。

公开(公告)号：US20070257687A1

公开(公告)日：2007-11-08

申请号：US11777177

申请日：2007-07-12

Applicant: Alexander Leon

Inventor： Alexander Leon

IPC: G01R31/02

CPC classification number: G01R31/2808 ,  G01R1/06722 ,  G01R1/06738

Abstract: A method of using a blade probe for probing a node of a circuit where the node includes a pad surface surrounding a node hole is disclosed. A probe having a longitudinal probe axis, a shaft, and a probe blade is provided. The shaft is generally concentric to the longitudinal probe axis and is made from an electrically conductive material. A probe blade is disposed at a first end of the shaft. The probe blade includes first and second faces positioned about the longitudinal probe axis in facing opposition to each other. The first and second faces converge towards each other and terminate at an edge. The probe is urged in a direction generally parallel to the longitudinal probe axis to create at least one electrical contact point between the edge of the probe blade and one of the solder disposed a pad surface of a node or the solder disposed on a rim of a hole of the node. Electrical coupling is established between the probe and the node via the at least one electrical contact point and the node is electrically evaluated.

Abstract translation: 公开了一种使用刀片探针来探测节点包括围绕节点孔的衬垫表面的电路的节点的方法。 提供具有纵向探针轴的探头，轴和探针叶片。 轴通常与纵向探针轴线同心，并由导电材料制成。 探针刀片设置在轴的第一端。 探针刀片包括围绕纵向探针轴线相对定位的第一和第二面。 第一和第二面朝向彼此会聚并终止于边缘。 探针沿大致平行于纵向探针轴线的方向被推压，以在探针叶片的边缘和焊料之一之间形成至少一个电接触点，其中一个焊料将一个节点的焊盘表面或设置在 节点的孔。 通过所述至少一个电接触点在所述探针和所述节点之间建立电耦合，并且对所述节点进行电学评估。

公开(公告)号：US08253430B2

公开(公告)日：2012-08-28

申请号：US12251196

申请日：2008-10-14

Applicant: Alexander Leon

Inventor： Alexander Leon

IPC: G01R31/00 ,  G01R31/02

CPC classification number: G01R1/06738 ,  G01R31/2808 ,  H05K1/0268 ,  H05K1/116 ,  H05K3/1225 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K2203/0545

Abstract: A test point of a circuit board is probed using an edge probe provided in a fixed orientation when the edge of the probe contacts a solder mound of the test point. The solder mound has an elongated shape. A length of the edge is substantially perpendicular to a length of the solder mound when the edge contacts the solder mound and is maintained in the fixed orientation.

Abstract translation: 当探头的边缘接触测试点的焊锡墩时，使用设置在固定方向的边缘探头来探测电路板的测试点。 焊锡墩具有细长的形状。 当边缘接触焊料堆并且保持在固定取向时，边缘的长度基本上垂直于焊料堆的长度。