公开(公告)号：US20230335328A1

公开(公告)日：2023-10-19

申请号：US17723260

申请日：2022-04-18

Applicant: Analog Devices, Inc.

Inventor： Steve Hawley ,  George Anthony Serpa ,  John David Brazzle ,  Jim Yang

IPC: H01F27/26 ,  H01F41/02

CPC classification number: H01F27/26 ,  H01F41/0206

Abstract: A low-profile coupled inductor is disclosed to provide compact and high performance magnetic coupling. The low-profile coupled inductor has an asymmetrical geometry, having a pair of complementary ferrite cores supporting a pair of conducting strips in an alternating serpentine pattern. One or more core gaps exist between the cores to create a strong flux coupling between adjacent magnetic fields of either conducting strip. The alternating serpentine conductors and core gaps serve to increase energy transfer between the magnetic fields and improve the overall power density of the low-profile coupled inductor.

公开(公告)号：US11270986B2

公开(公告)日：2022-03-08

申请号：US16998666

申请日：2020-08-20

Applicant: Analog Devices, Inc.

Inventor： Ahmadreza Odabaee ,  John David Brazzle ,  Zafer Kutlu ,  Zhengyang Liu ,  George Anthony Serpa

IPC: H01L25/16 ,  H01F27/28 ,  H02M3/04 ,  H01L23/00

Abstract: This disclosure describes techniques to provide a regulator circuit using a component-on-top (CoP) package. The CoP package comprising a system-in-package (SIP) comprising regulator circuitry, the SIP having a top portion and a first side portion; and an inductor on the top portion of the SIP, wherein: the inductor is coupled to the regulator circuitry via the top portion of the SIP; and a first end of the inductor extends beyond the first side portion of the SIP.

公开(公告)号：US20240096775A1

公开(公告)日：2024-03-21

申请号：US17932913

申请日：2022-09-16

Applicant: Analog Devices, Inc.

Inventor： Hien Minh Pham ,  Melvin Sto Domingo Nava ,  John David Brazzle

IPC: H01L23/498 ,  G01R31/28 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L25/16

CPC classification number: H01L23/49838 ,  G01R31/2884 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/4839 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49861 ,  H01L24/40 ,  H01L24/41 ,  H01L25/16 ,  H01L2224/4001 ,  H01L2224/40095 ,  H01L2224/40145 ,  H01L2224/4112 ,  H01L2924/1427 ,  H01L2924/19042

Abstract: Methods, and systems, are presented for a Structural Bridge for Electrically Isolated Metal Clips by mounting on a substrate a first and a second circuit. These first and second circuits can include Component on Package (CoP) electronic parts that are electrically contacted to the substrate with metal clips mounted on the surface of the substrate. The metal clips are electrically connected to respective circuit first and second circuits by an electrical connection on or in the substrate. The metal clips are folded over the respective first and second circuits. The folded-over portion of the first metal clip and the folded-over portion of the second metal clip are electrically isolated from each other. A third circuit package that is mounted on and electrically connected to a folded-over portion of the first metal clip and to a folded-over portion of the second metal clip.

公开(公告)号：US20210358895A1

公开(公告)日：2021-11-18

申请号：US16998666

申请日：2020-08-20

Applicant: Analog Devices, Inc.

Inventor： Ahmadreza Odabaee ,  John David Brazzle ,  Zafer Kutlu ,  Zhengyang Liu ,  George Anthony Serpa

IPC: H01L25/16 ,  H01F27/28 ,  H02M3/04 ,  H01L23/00

Abstract: This disclosure describes techniques to provide a regulator circuit using a component-on-top (CoP) package. The CoP package comprising a system-in-package (SIP) comprising regulator circuitry, the SIP having a top portion and a first side portion; and an inductor on the top portion of the SIP, wherein: the inductor is coupled to the regulator circuitry via the top portion of the SIP; and a first end of the inductor extends beyond the first side portion of the SIP.