公开(公告)号：US09643272B2

公开(公告)日：2017-05-09

申请号：US14460296

申请日：2014-08-14

Applicant: Apple Inc.

Inventor： Chiu-Yu Tang ,  Ibuki Kamei ,  Timothy J. Rasmussen

IPC: H01R13/40 ,  H05K3/28 ,  B23K1/20 ,  B23K1/00 ,  B23K3/047 ,  H05K3/34

CPC classification number: B23K1/20 ,  B23K1/0016 ,  B23K3/0471 ,  H05K3/284 ,  H05K3/34 ,  H05K3/3494 ,  H05K2201/10287 ,  H05K2203/1322 ,  H05K2203/304

Abstract: A method for connecting or terminating wires to a printed circuit is disclosed. The method includes applying layers, such as a first layer and a second layer, to the printed circuit. The first layer is applied over several active components on the printed circuit, and provides a sealant against ingress of contaminants in the active components. The second layer is a rigid layer applied over the first layer. When the printed circuit is placed in a fixture, a metallic element, such as a thermode or hot bar, presses against the wires to hold the wires against several terminals on the printed circuit. The metallic element is heated to melt solder between the wires and the terminals. The second layer is configured to resist compressive forces from the metallic element and the fixture, such that the printed circuit and the active components are not damaged during the connection process.

公开(公告)号：US20160050763A1

公开(公告)日：2016-02-18

申请号：US14460296

申请日：2014-08-14

Applicant: Apple Inc.

Inventor： Chiu-Yu Tang ,  Ibuki Kamei ,  Timothy J. Rasmussen

IPC: H05K3/28 ,  H05K1/11 ,  B23K1/20 ,  H05K3/34 ,  H05K13/04 ,  B23K1/00 ,  H05K1/18 ,  H05K1/02

CPC classification number: B23K1/20 ,  B23K1/0016 ,  B23K3/0471 ,  H05K3/284 ,  H05K3/34 ,  H05K3/3494 ,  H05K2201/10287 ,  H05K2203/1322 ,  H05K2203/304

Abstract: A method for connecting or terminating wires to a printed circuit is disclosed. The method includes applying layers, such as a first layer and a second layer, to the printed circuit. The first layer is applied over several active components on the printed circuit, and provides a sealant against ingress of contaminants in the active components. The second layer is a rigid layer applied over the first layer. When the printed circuit is placed in a fixture, a metallic element, such as a thermode or hot bar, presses against the wires to hold the wires against several terminals on the printed circuit. The metallic element is heated to melt solder between the wires and the terminals. The second layer is configured to resist compressive forces from the metallic element and the fixture, such that the printed circuit and the active components are not damaged during the connection process.

Abstract translation: 公开了一种用于将电线连接或接线到印刷电路的方法。 该方法包括将诸如第一层和第二层的层施加到印刷电路。 第一层施加在印刷电路上的几个活性组分上，并且提供了防止活性组分中的污染物侵入的密封剂。 第二层是施加在第一层上的刚性层。 当印刷电路放置在固定装置中时，诸如热电极或热棒之类的金属元件压在电线上，以将电线固定在印刷电路上的几个端子上。 金属元件被加热以在焊丝和端子之间熔化焊料。 第二层被配置为抵抗来自金属元件和夹具的压缩力，使得印刷电路和有源部件在连接过程中不被损坏。