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公开(公告)号：US20230223204A1
公开(公告)日：2023-07-13
申请号：US17572053
申请日：2022-01-10
Applicant: Apple Inc.
Inventor： Gang Ning , Jiaqing Xi , Felix Ren
CPC classification number: H01G9/0425 , H01G9/008 , H01G9/15
Abstract: Many electronic devices may employ electrolytic polymer capacitors in their power supplies for noise filtering, decoupling/bypassing, frequency conversion and DC-DC and AC-DC conversion. However, some polymer capacitors exhibit an anomalous charging current phenomenon, which may prevent proper charging and cause failure in power circuits of the electronic devices. Disclosed herein are polymer capacitors that have a wide band gap material layer between an insulator/dielectric and a polymer cathode, a charge depletion region in the insulator/dielectric, or both, that may mitigate the anomalous charging current.
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公开(公告)号：US20200066457A1
公开(公告)日：2020-02-27
申请号：US16112500
申请日：2018-08-24
Applicant: Apple Inc.
Inventor： Ching Yu John Tam , James John Ashe , Gang Ning , Won Seop Choi , Meng Chi Lee , Parin Patel , Samuel Benjamin Schaevitz , Derek J. DiCarlo
Abstract: Capacitors, including multilayer ceramic capacitors, may be subject to faults and failures that create short circuits between their dielectrics. Capacitors having fuses that protect the capacitors or the electrical devices using the capacitors when such faults occur are described herein. Embodiments include the presence of monolithic and non-monolithic structures including the fuse. Embodiments also include capacitors with multiple fuses that may prevent or mitigate capacitor failure. Methods for manufacturing and using the capacitors are also described.
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公开(公告)号：US10811192B2
公开(公告)日：2020-10-20
申请号：US16146042
申请日：2018-09-28
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Won Seop Choi , Gang Ning , Chirag V. Shah , Martin Schauer , Curtis C. Mead , Ming Yuan Tsai , Albert Wang
Abstract: Multilayer ceramic capacitor structures may include structural arrangements, materials, and/or substrate modifications that can improve the reliability of the capacitor for long-term usage when faced with environmental stress. Embodiments may implement reduced entryways in the termination patterns of the capacitor to decrease damage potential due to exposure of moisture. Embodiments may implement structures that decrease interfaces with different physical characteristics, which may lead to a reduction in the formation of micro-fractures during regular usage. Methods of manufacture for the features that improve reliability are also detailed.
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公开(公告)号：US20200105473A1
公开(公告)日：2020-04-02
申请号：US16146042
申请日：2018-09-28
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Won Seop Choi , Gang Ning , Chirag V. Shah , Martin Schauer , Curtis C. Mead , Ming Yuan Tsai , Albert Wang
Abstract: Multilayer ceramic capacitor structures may include structural arrangements, materials, and/or substrate modifications that can improve the reliability of the capacitor for long-term usage when faced with environmental stress. Embodiments may implement reduced entryways in the termination patterns of the capacitor to decrease damage potential due to exposure of moisture. Embodiments may implement structures that decrease interfaces with different physical characteristics, which may lead to a reduction in the formation of micro-fractures during regular usage. Methods of manufacture for the features that improve reliability are also detailed.
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公开(公告)号：US09287049B2
公开(公告)日：2016-03-15
申请号：US13872000
申请日：2013-04-26
Applicant: Apple Inc.
Inventor： Gang Ning , Shawn Xavier Arnold , Jeffrey M. Thoma , Henry H. Yang
CPC classification number: H01G4/35 , H01G4/2325 , H01G4/30 , H05K3/3442 , H05K2201/10015
Abstract: The described embodiments relate generally to a capacitor assembly for mounting on a printed circuit board (PCB) and more specifically to designs for mechanically isolating the capacitor assembly from the PCB to reduce an acoustic noise produced when the capacitor imparts a piezoelectric force on the PCB. Termination elements in the capacitor assembly, including a porous conductive layer in the capacitor assembly may reduce an amount of vibrational energy transferred from the capacitor to the PCB. Termination elements including a soft contact layer may also reduce the amount of vibrational energy transferred to the PCB. Further, capacitor assemblies having thickened dielectric material may reduce the amount of vibrational energy transferred to the PCB.
Abstract translation: 所描述的实施例通常涉及用于安装在印刷电路板（PCB）上的电容器组件，更具体地涉及用于将电容器组件与PCB机械隔离的设计，以减少当电容器在PCB上施加压电力时产生的声学噪声。 电容器组件中的终端元件，包括电容器组件中的多孔导电层可以减少从电容器传递到PCB的振动能量。 包括软接触层的端接元件也可以减少传递到PCB的振动能量。 此外，具有增厚的介电材料的电容器组件可以减少传递到PCB的振动能量。
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Patent Agency Ranking
公开(公告)号：US20150364255A1
公开(公告)日：2015-12-17
申请号：US14500786
申请日：2014-09-29
Applicant: Apple Inc.
Inventor： Gang Ning , Pradeep Vengavasi , Linda Y. Dunn , Yonas A. Hartanto , Shawn X. Arnold
Abstract: This disclosure describes methods and systems for minimizing electromagnetic interference (EMI) noise emanating from a ceramic capacitor. The ceramic capacitor may include several terminations are on a bottom portion of the capacitor. The capacitor may be designed to include several capacitors formed from electrode layers. The capacitor may include a conductive coating on an outer peripheral portion. The coating may include conductive materials such as Cu, Ni, Ag, and/or graphite. Alternatively, some regions of the capacitor may include electrode layers built into the capacitor that are not associated with capacitors. In this manner, the ceramic capacitor may be free of the conductive coating to locations proximate to the described electrode layers not associated with capacitors. The conductive coating can act as an electromagnetic shielding to prevent the EMI noise from emanating outside the electromagnetic shielding. Also, the conductive coating can be electrically grounded (e.g., to printed circuit board) via terminals.
Abstract translation: 本公开描述了用于最小化从陶瓷电容器发出的电磁干扰（EMI）噪声的方法和系统。 陶瓷电容器可以包括位于电容器底部的多个端子。 电容器可以被设计成包括由电极层形成的多个电容器。 电容器可以包括外周部分上的导电涂层。 涂层可以包括诸如Cu，Ni，Ag和/或石墨的导电材料。 或者，电容器的一些区域可以包括内置于不与电容器相关联的电容器中的电极层。 以这种方式，陶瓷电容器可以没有导电涂层到靠近所描述的与电容器不相关的电极层的位置。 导电涂层可以作为电磁屏蔽，以防止EMI噪声发散在电磁屏蔽外。 此外，导电涂层可以通过端子电接地（例如，到印刷电路板）。
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公开(公告)号：US12287680B1
公开(公告)日：2025-04-29
申请号：US18660116
申请日：2024-05-09
Applicant: Apple Inc.
Inventor： Supratik Datta , Karan S. Jain , Ehsan Khajeh , Arash Akhavan Fomani , Daniel P Kumar , Eng Eow Goh , Meng Chi Lee , Gang Ning , Andrew W. Joyce , Chengrui Zhang , Stephen T. Schooley , Timothy C. Wulff , Ross D. Arriens , Hao Dong , Michael Sipper , Jenna Dancy , Deepak Sharma , Parin Patel
Abstract: A case for an electronic device can include a case body including an exterior surface and an interior surface, the interior surface being positioned opposite the exterior surface. The case can additionally include a button body positioned at least partially within the case body between the exterior surface and the interior surface, the button body being movable inward and outward relative to the case body along an axis of button travel. The case can further include a biasing structure having a contact surface configured to contact the button body, the biasing structure configured to bias the button body toward the interior surface along the axis of button travel.
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公开(公告)号：US11705288B1
公开(公告)日：2023-07-18
申请号：US17572053
申请日：2022-01-10
Applicant: Apple Inc.
Inventor： Gang Ning , Jiaqing Xi , Felix Ren
CPC classification number: H01G9/07 , H01G9/0425 , H01G9/15
Abstract: Many electronic devices may employ electrolytic polymer capacitors in their power supplies for noise filtering, decoupling/bypassing, frequency conversion and DC-DC and AC-DC conversion. However, some polymer capacitors exhibit an anomalous charging current phenomenon, which may prevent proper charging and cause failure in power circuits of the electronic devices. Disclosed herein are polymer capacitors that have a wide band gap material layer between an insulator/dielectric and a polymer cathode, a charge depletion region in the insulator/dielectric, or both, that may mitigate the anomalous charging current.
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公开(公告)号：US09859057B2
公开(公告)日：2018-01-02
申请号：US14830598
申请日：2015-08-19
Applicant: Apple Inc.
Inventor： Gang Ning , Raul A. Perez , Parin Patel
IPC: H01G5/38 , H01G4/228 , H01G4/10 , H01G4/33 , H01G13/00 , H01G2/06 , H01G2/10 , H01G4/224 , H05K3/34 , H05K1/14 , H05K3/36
CPC classification number: H01G4/228 , H01G2/06 , H01G2/10 , H01G4/10 , H01G4/224 , H01G4/33 , H01G13/006 , H05K1/144 , H05K1/145 , H05K3/3447 , H05K3/366 , H05K2201/10015
Abstract: This application includes multiple embodiments related to capacitors. In some embodiments, capacitors are set forth as having terminal leads that extend in parallel and opposing axial directions. The embodiments discussed herein relate to a capacitor module including one or more anodized pellets for providing a charge storage within the capacitor module. The capacitor module can be configured as a surface mounted or non-surface mounted capacitor module. The capacitor module can include an array of anodized pellets arranged in multiple rows or columns of anodized pellets connected by conductive trace included in the capacitor module. In a non-surface mounted embodiment of the capacitor module, the capacitor module can include cathode and anode connections that are exclusively on the side surfaces of the capacitor module.
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公开(公告)号：US20170207024A1
公开(公告)日：2017-07-20
申请号：US15409217
申请日：2017-01-18
Applicant: Apple Inc.
Inventor： Paul A. Martinez , Gang Ning , Curtis C. Mead , Ming Y. Tsai , Albert Wang
CPC classification number: H01G4/30 , H01G2/06 , H01G4/012 , H01G4/12 , H01G4/232 , H01G4/35 , H01G4/40
Abstract: Methods and devices related to fabrication and utilization of multilayer capacitors presenting low equivalent series resistance (ESR) is illustrated. The capacitors may present electrodes that are coupled to metallic terminations at the bottom and/or at the side of the capacitor. The position of the electrode coupling may lead to smaller current paths in the MLCC electrode, which may decrease line inductances. Methods and systems for fabrication of the capacitors described are also discussed.
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