公开(公告)号：US20200152783A1

公开(公告)日：2020-05-14

申请号：US16741628

申请日：2020-01-13

Applicant: Applejack 199 L.P.

Inventor： Oanh Nguyen ,  Wojciech Jan Walecki

IPC: H01L29/786 ,  H01L21/48 ,  H01L27/12 ,  H01L21/66 ,  H01L21/16 ,  G01R31/26

Abstract: A method for non-contact measurement of stress in a thin-film deposited on a substrate is disclosed. The method may include measuring first topography data of a substrate having a thin-film deposited thereupon. The method may also include comparing the first topography data with second topography data of the substrate that is measured prior to thin-film deposition. The method may further include obtaining a vertical displacement of the substrate based on the comparison between the first topography data and the second topography data. The method may also include detecting a stress value in the thin-film deposited on the substrate based on a fourth-order polynomial equation and the vertical displacement.

公开(公告)号：US10553623B2

公开(公告)日：2020-02-04

申请号：US15722645

申请日：2017-10-02

Applicant: Applejack 199 L.P.

Inventor： Wojciech Jan Walecki ,  Oanh Nguyen

IPC: H01L27/12 ,  G01B11/30 ,  G01B11/24 ,  G01B11/16 ,  G01M11/08 ,  G01L1/24 ,  H01L21/66

Abstract: A method for non-contact measurement of stress in a thin-film deposited on a substrate is disclosed. The method may include measuring first topography data of a substrate having a thin-film deposited thereupon. The method may also include comparing the first topography data with second topography data of the substrate that is measured prior to thin-film deposition. The method may further include obtaining a vertical displacement of the substrate based on the comparison between the first topography data and the second topography data. The method may also include detecting a stress value in the thin-film deposited on the substrate based on a fourth-order polynomial equation and the vertical displacement.

公开(公告)号：US10964730B2

公开(公告)日：2021-03-30

申请号：US16741628

申请日：2020-01-13

Applicant: Applejack 199 L.P.

Inventor： Oanh Nguyen ,  Wojciech Jan Walecki

IPC: H01L27/12 ,  G01B11/30 ,  G01B11/24 ,  G01B11/16 ,  G01M11/08 ,  G01L1/24 ,  H01L21/66 ,  H01L21/48 ,  G01B11/06 ,  G01R31/26 ,  H01L21/16 ,  H01L29/786

Abstract: A method for non-contact measurement of stress in a thin-film deposited on a substrate is disclosed. The method may include measuring first topography data of a substrate having a thin-film deposited thereupon. The method may also include comparing the first topography data with second topography data of the substrate that is measured prior to thin-film deposition. The method may further include obtaining a vertical displacement of the substrate based on the comparison between the first topography data and the second topography data. The method may also include detecting a stress value in the thin-film deposited on the substrate based on a fourth-order polynomial equation and the vertical displacement.

公开(公告)号：US20180308971A1

公开(公告)日：2018-10-25

申请号：US15722645

申请日：2017-10-02

Applicant: Applejack 199 L.P.

Inventor： Wojciech Jan Walecki ,  Oanh Nguyen

IPC: H01L29/786 ,  G01R31/26 ,  H01L21/16 ,  H01L21/48 ,  H01L21/66 ,  H01L27/12

Abstract: A method for non-contact measurement of stress in a thin-film deposited on a substrate is disclosed. The method may include measuring first topography data of a substrate having a thin-film deposited thereupon. The method may also include comparing the first topography data with second topography data of the substrate that is measured prior to thin-film deposition. The method may further include obtaining a vertical displacement of the substrate based on the comparison between the first topography data and the second topography data. The method may also include detecting a stress value in the thin-film deposited on the substrate based on a fourth-order polynomial equation and the vertical displacement.