公开(公告)号：US11600507B2

公开(公告)日：2023-03-07

申请号：US17016030

申请日：2020-09-09

Applicant: Applied Materials, Inc.

Inventor： Bhaskar Prasad ,  Kirankumar Neelasandra Savandaiah ,  Srinivasa Rao Yedla ,  Nitin Bharadwaj Satyavolu ,  Thomas Brezoczky

IPC: H01L21/683 ,  H01L21/68 ,  B65G47/92 ,  H01L21/687 ,  H01L21/67

Abstract: A pedestal assembly for a processing region and comprising first pins coupled to a substrate support, configured to mate with first terminals of an electrostatic chuck, and are configured to be coupled to a first power source. Each of the first pins comprises an interface element, and a compliance element supporting the interface element. Second pins are coupled to the substrate support, configured to mate with second terminals of the electrostatic chuck, and configured to couple to a second power source. Alignment elements are coupled to the substrate support and are configured to interface with centering elements of the electrostatic chuck. The flexible element is coupled to the substrate support, configured to interface with a passageway of the electrostatic chuck, and configured to be coupled to a gas source.

公开(公告)号：US12266551B2

公开(公告)日：2025-04-01

申请号：US18317347

申请日：2023-05-15

Applicant: Applied Materials, Inc.

Inventor： Bhaskar Prasad ,  Kirankumar Neelasandra Savandaiah ,  Thomas Brezoczky ,  Srinivasa Rao Yedla

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/683

Abstract: Embodiments of the present disclosure relate to apparatus, systems and methods for substrate processing. A detachable substrate support is disposed within a processing volume of a processing chamber and the substrate support includes a substrate interfacing surface and a back surface. The pedestal hub has a supporting surface removably coupled to the substrate support. A hub volume of the pedestal hub includes temperature measuring assembly disposed therein positioned to receive electromagnetic energy emitted from the back surface of the substrate support. The temperature measuring assembly measures an intensity of the electromagnetic energy entering the assembly and generates intensity signals. An apparent temperature of the substrate is determined based on the intensity signals.

公开(公告)号：US12217982B2

公开(公告)日：2025-02-04

申请号：US18585505

申请日：2024-02-23

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra Savandaiah ,  Nitin Bharadwaj Satyavolu ,  Srinivasa Rao Yedla ,  Bhaskar Prasad ,  Thomas Brezoczky

IPC: H01L21/67 ,  C23C14/35 ,  C23C14/50 ,  H01J37/32 ,  H01J37/34

Abstract: A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed. A seal ring assembly is coupled to the support chuck. The seal ring assembly includes an inner assembly, an assembly bellows circumscribing the inner assembly, and a bellows disposed between the inner and outer platform. An inner ring is disposed between inner assembly of the seal ring assembly and the bottom surface of the support chuck. An outer ring disposed between the seal ring assembly and the lower sealing surface of the process chamber wall. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using the bellows, the inner ring, and the outer ring.

公开(公告)号：US11817331B2

公开(公告)日：2023-11-14

申请号：US16940058

申请日：2020-07-27

Applicant: Applied Materials, Inc.

Inventor： Srinivasa Rao Yedla ,  Kirankumar Neelasandra Savandaiah ,  Thomas Brezoczky ,  Bhaskar Prasad ,  Nitin Bharadwaj Satyavolu

IPC: H01L21/67 ,  B65G29/00 ,  B25J15/00

CPC classification number: H01L21/67196 ,  B25J15/009 ,  B25J15/0019 ,  B65G29/00 ,  H01L21/67167 ,  B65G2201/0297 ,  B65G2814/0313

Abstract: A shutter disc for use in a cluster tool assembly having a processing chamber and a transfer arm includes an inner disc and an outer disc configured to be disposed on the inner disc. The inner disc includes a plurality of locating features configured to mate with locating pins of a transfer arm of a cluster tool assembly and a plurality of centering features configured to mate with alignment elements of a substrate support disposed in the processing chamber of the cluster tool assembly.

公开(公告)号：US11749542B2

公开(公告)日：2023-09-05

申请号：US16939629

申请日：2020-07-27

Applicant: Applied Materials, Inc.

Inventor： Bhaskar Prasad ,  Kirankumar Neelasandra Savandaiah ,  Thomas Brezoczky ,  Srinivasa Rao Yedla

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/683

CPC classification number: H01L21/67248 ,  H01L22/12 ,  H01L21/6833

Abstract: Embodiments of the present disclosure relate to apparatus, systems and methods for substrate processing. A detachable substrate support is disposed within a processing volume of a processing chamber and the substrate support includes a substrate interfacing surface and a back surface. The pedestal hub has a supporting surface removably coupled to the substrate support. A hub volume of the pedestal hub includes temperature measuring assembly disposed therein positioned to receive electromagnetic energy emitted from the back surface of the substrate support. The temperature measuring assembly measures an intensity of the electromagnetic energy entering the assembly and generates intensity signals. An apparent temperature of the substrate is determined based on the intensity signals.

公开(公告)号：US12195314B2

公开(公告)日：2025-01-14

申请号：US17165427

申请日：2021-02-02

Applicant: Applied Materials, Inc.

Inventor： Bhaskar Prasad ,  Kirankumar Neelasandra Savandaiah ,  Thomas Brezoczky ,  Srinivasa Rao Yedla

IPC: B66F3/36 ,  B66F3/24 ,  B66F13/00 ,  H01J37/02

Abstract: A method and apparatus for lifting a process station from a processing module is described herein. The apparatus includes a lift assembly disposed on the processing module, a lift cage, and one or more guide pins. The lift assembly is disposed to be capable of reaching each of the process stations disposed within the processing module. The lift assembly is used for replacement and maintenance of the process stations and further enables the automated removal and placement of the process stations within the processing module. Maintenance methods enabled by the lift assembly are additionally disclosed herein.

公开(公告)号：US11955355B2

公开(公告)日：2024-04-09

申请号：US17185360

申请日：2021-02-25

Applicant: Applied Materials, Inc.

Inventor： Kirankumar Neelasandra Savandaiah ,  Nitin Bharadwaj Satyavolu ,  Srinivasa Rao Yedla ,  Bhaskar Prasad ,  Thomas Brezoczky

IPC: H01L21/67 ,  C23C14/35 ,  C23C14/50 ,  H01J37/32 ,  H01J37/34

CPC classification number: H01L21/67126 ,  C23C14/35 ,  C23C14/50 ,  H01J37/32513 ,  H01J37/32715 ,  H01J37/3405 ,  H01J37/3426 ,  H01J2237/2007 ,  H01J2237/332 ,  H01L21/67167 ,  H01L21/67207

Abstract: A method and apparatus for substrate processing and a cluster tool including a transfer chamber assembly and a plurality of processing assemblies. Processing chamber volumes are sealed from the transfer chamber volume using a support chuck on which a substrate is disposed. A seal ring assembly is coupled to the support chuck. The seal ring assembly includes an inner assembly, an assembly bellows circumscribing the inner assembly, and a bellows disposed between the inner and outer platform. An inner ring is disposed between inner assembly of the seal ring assembly and the bottom surface of the support chuck. An outer ring disposed between the seal ring assembly and the lower sealing surface of the process chamber wall. The support chuck is raised to form an isolation seal between the processing chamber volume and the transfer chamber volume using the bellows, the inner ring, and the outer ring.

公开(公告)号：US12100614B2

公开(公告)日：2024-09-24

申请号：US17233213

申请日：2021-04-16

Applicant: Applied Materials, Inc.

Inventor： Anubhav Srivastava ,  Bhaskar Prasad ,  Kirankumar Neelasandra Savandaiah ,  Thomas Brezoczky ,  Nitin Bharadwaj Satyavolu

IPC: H01L21/687

CPC classification number: H01L21/68742

Abstract: Embodiments of the present disclosure generally relate to lift pins and to apparatus for controlling lift pin movement. In an embodiment, an apparatus for positioning a substrate in a chamber is provided. The apparatus includes a chamber component, a lift pin having a top surface for supporting the substrate and a lift pin shaft and a stopper. The apparatus further includes a compressible element positioned between the chamber component and the stopper, the compressible element further positioned around the lift pin shaft, the lift pin being moveable relative to a substrate transfer plane by movement of a substrate support in contact with the compressible element.

公开(公告)号：US11646217B2

公开(公告)日：2023-05-09

申请号：US17230775

申请日：2021-04-14

Applicant: Applied Materials, Inc.

Inventor： Anubhav Srivastava ,  Bhaskar Prasad ,  Kirankumar Neelasandra Savandaiah ,  Thomas Brezoczky ,  Srinivasa Rao Yedla ,  Lakshmikanth Krishnamurthy Shirahatti

IPC: H01L21/683 ,  H01L21/677

CPC classification number: H01L21/6833 ,  H01L21/67742

Abstract: Embodiments of the present disclosure generally relate to methods and apparatus for processing substrates. More specifically, embodiments of the present disclosure relate to transfer apparatus and substrate-supporting members. In an embodiment, an apparatus for transferring a substrate is provided. The apparatus includes a hub and a plurality of transfer arms extending from the hub. The apparatus further includes a plurality of substrate-supporting members, wherein each of the transfer arms has a first end coupled to the hub and a second end coupled to a respective one of the plurality of substrate-supporting members. The apparatus further includes a first electrical interface connection for electrostatically chucking a substrate and located at a first position on each substrate-supporting member, and a second electrical interface connection for electrostatically chucking the substrate and located at a second position on each substrate-supporting member. Substrate processing modules are also described.

公开(公告)号：US11610799B2

公开(公告)日：2023-03-21

申请号：US17024802

申请日：2020-09-18

Applicant: Applied Materials, Inc.

Inventor： Bhaskar Prasad ,  Kirankumar Neelasandra Savandaiah ,  Srinivasa Rao Yedla ,  Nitin Bharadwaj Satyavolu ,  Hari Prasath Rajendran ,  Lakshmikanth Krishnamurthy Shirahatti ,  Thomas Brezoczky

IPC: H01T23/00 ,  H01L21/683 ,  H01L21/67

Abstract: In one example, an electrostatic chuck comprises a chuck body having a top surface configured to support a substrate and a bottom surface opposite the top surface. The chuck body comprises one or more chucking electrodes, and one or more heating elements. The chuck body further comprises first terminals disposed on the bottom surface of the chuck body and coupled with the one or more heating elements, second terminals disposed on the bottom surface of the chuck body and coupled with the one or more chucking electrodes, and third terminals disposed on the bottom first surface of the chuck body and coupled with the one or more chucking electrodes.