公开(公告)号：US11697187B2

公开(公告)日：2023-07-11

申请号：US16849912

申请日：2020-04-15

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Jianshe Tang ,  Chih Chung ,  Hui Chen ,  Hari Soundararajan ,  Benjamin Cherian

IPC: B24B1/00 ,  B24B57/02 ,  H01L21/304 ,  B24B37/04 ,  B24B37/015 ,  B24B37/10 ,  B24B37/22 ,  B24B37/34 ,  B24B55/02 ,  B24B53/017 ,  B24B49/14

CPC classification number: B24B57/02 ,  B24B37/015 ,  B24B37/042 ,  B24B37/105 ,  B24B37/22 ,  B24B37/34 ,  B24B55/02 ,  H01L21/304 ,  B24B49/14 ,  B24B53/017

Abstract: A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a rotatable carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid supply port to supply a polishing liquid to the polishing surface, a thermal control system including a movable nozzle to spray a medium onto the polishing surface to adjust a temperature of a zone on the polishing surface, an actuator to move the nozzle radially relative to an axis of rotation of the platen, and a controller configured to coordinate dispensing of the medium from the nozzle with motion of the nozzle across the polishing surface.

公开(公告)号：US20200331117A1

公开(公告)日：2020-10-22

申请号：US16849912

申请日：2020-04-15

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Jianshe Tang ,  Chih Chung ,  Hui Chen ,  Hari Soundararajan ,  Benjamin Cherian

IPC: B24B57/02 ,  B24B37/04 ,  H01L21/304

Abstract: A chemical mechanical polishing apparatus includes a rotatable platen to hold a polishing pad, a rotatable carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a polishing liquid supply port to supply a polishing liquid to the polishing surface, a thermal control system including a movable nozzle to spray a medium onto the polishing surface to adjust a temperature of a zone on the polishing surface, an actuator to move the nozzle radially relative to an axis of rotation of the platen, and a controller configured to coordinate dispensing of the medium from the nozzle with motion of the nozzle across the polishing surface.

公开(公告)号：US20200331114A1

公开(公告)日：2020-10-22

申请号：US16849884

申请日：2020-04-15

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Jianshe Tang ,  Chih Chung ,  Hui Chen ,  Hari Soundararajan ,  Benjamin Cherian

IPC: B24B37/015 ,  B24B37/10 ,  B24B37/22 ,  B24B55/02 ,  B24B37/34

Abstract: A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier laterally movable by an actuator across the polishing pad to hold a substrate against a polishing surface of the polishing pad during a polishing process, a thermal control system including a plurality of independently controllable heaters and coolers to independently control temperatures of a plurality of zones on the polishing pad, and a controller configured to cause the thermal control system to generate a first zone having a first temperature and a second zone having a different second temperature on the polishing pad.