公开(公告)号：US11469124B2

公开(公告)日：2022-10-11

申请号：US16752502

申请日：2020-01-24

Applicant: Applied Materials, Inc.

Inventor： Shreyas Patil Shanthaveeraswamy ,  Ribhu Gautam ,  Kumaresan Nagarajan ,  Vijay Singh ,  Andrew J. Constant ,  Michael P. Karazim ,  Kim Ramkumar Vellore

IPC: H01L21/673 ,  H01L21/67

Abstract: Embodiments of the present disclosure relate to a substrate transfer device having a contactless latch and contactless coupling providing the ability to lock and unlock the substrate transfer device at atmospheric and vacuum pressure with without particle generation at a base of the substrate transfer device, the contactless latch, and the contactless coupling. The substrate transfer device includes a lid having one or more lid grooves, a base having one or more base grooves, and a rotation member rotatably coupled to the lid. Each flange of one or more flanges of the substrate transfer device is rotatable in aligned lid grooves and base grooves, and each flange of the one or more flanges has an arm with a ferromagnetic material coupled thereto. The base is coupled to the lid when the ferromagnetic material of the arm is aligned and spaced from a magnetic material of a slot of the one or more base grooves.

公开(公告)号：US12230521B2

公开(公告)日：2025-02-18

申请号：US16885909

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Kim Ramkumar Vellore ,  Leonid M. Tertitski ,  Matthew D. Scotney-Castle

IPC: H01L21/67 ,  G01J5/00 ,  G01J5/48 ,  H04N5/33

Abstract: A method and apparatus for measuring a temperature of a substrate located in a semiconductor processing environment is disclosed. The substrate has a top surface and an edge surface, and is positioned in a prescribed location within the semiconductor processing environment. An infrared camera oriented to view one side of the edge surface of the substrate is triggered to obtain an infrared image of the one side of the edge surface of the substrate. The infrared image is processed to obtain a temperature profile of the substrate.

公开(公告)号：US11538706B2

公开(公告)日：2022-12-27

申请号：US16848645

申请日：2020-04-14

Applicant: Applied Materials, Inc.

Inventor： Alexander N. Lerner ,  Michael P. Karazim ,  Andrew J. Constant ,  Jeffrey A. Brodine ,  Kim Ramkumar Vellore ,  Kevin Moraes ,  Roey Shaviv

IPC: H01L21/68 ,  H01J37/32 ,  H01L21/673 ,  H01L21/677 ,  C23C16/04

Abstract: An alignment module for positioning a mask on a substrate comprises a mask stocker, an alignment stage, and a transfer robot. The mask stocker houses a mask cassette that stores a plurality of masks. The alignment stage is configured to support a carrier and a substrate. The transfer robot is configured to transfer one of the one or more masks from the mask stocker to the alignment stage and position the mask over the substrate. The alignment module may be part of an integrated platform having one or more transfer chambers, a factory interface having a substrate carrier chamber and one or more processing chambers. A carrier may be coupled to a substrate within the substrate carrier chamber and moved between the processing chambers to generate a semiconductor device.

公开(公告)号：US11196360B2

公开(公告)日：2021-12-07

申请号：US16655168

申请日：2019-10-16

Applicant: Applied Materials, Inc.

Inventor： Alexander N. Lerner ,  Kim Ramkumar Vellore ,  Steven Trey Tindel

IPC: H02N13/00 ,  C23C16/458 ,  H01L51/56 ,  H01L51/00 ,  H01L21/683 ,  H01L21/67

Abstract: A chucking station comprises a chuck, a power supply, and one or more pumping elements. The chuck comprises a plurality of first vacuum ports configured to interface with a surface of a substrate and a plurality of second vacuum ports configured to interface with a surface of a carrier. The chuck further comprises a first electrical pin configured to be in electrical communication with a first electrode of the carrier, and a second electrical pin configured to be in electrical communication with a second electrode of the carrier. The power supply is configured to apply a chucking voltage and a de-chucking voltage to the first and second electrical pins. The one or more pumping elements is coupled to the first and second vacuum ports and configured to generate a vacuum between the substrate and the chuck and a vacuum between the carrier and the chuck.

公开(公告)号：US10916464B1

公开(公告)日：2021-02-09

申请号：US16552967

申请日：2019-08-27

Applicant: Applied Materials, Inc.

Inventor： Kim Ramkumar Vellore ,  Alexander N. Lerner ,  Steven Trey Tindel

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/677 ,  H01L21/673 ,  H01L21/683 ,  H01L21/687

Abstract: A method includes aligning and positioning a carrier in a predetermined orientation and location within a first front opening pod (FOUP) of a cluster tool, transferring the carrier to a charging station of the cluster tool, transferring a substrate from a second front opening pod (FOUP) of the cluster tool to the charging station and chucking the substrate onto the carrier, transferring the carrier having the substrate thereon from the charging station to a factory interface of the cluster tool, aligning the carrier having the substrate thereon in the factory interface of the cluster tool such that during substrate processing within a processing platform of the cluster tool the carrier is properly oriented and positioned relative to components of the processing platform, where the processing platform comprises one or more processing chambers, transferring the aligned carrier having the substrate thereon from the factory interface to the processing platform of the cluster tool for substrate processing, and transferring the aligned carrier having the processed substrate thereon from the processing platform to the factory interface.

公开(公告)号：US12134835B2

公开(公告)日：2024-11-05

申请号：US17464657

申请日：2021-09-01

Applicant: Applied Materials, Inc.

Inventor： Kim Ramkumar Vellore

IPC: C30B25/12 ,  C30B25/10 ,  G01J5/08 ,  H01L21/687

Abstract: The present disclosure generally relates to a substrate support for processing of semiconductor substrates. In one example, the substrate support has a body. The body has a top surface configured to support a substrate thereon. The body has a bottom surface opposite the top surface. The body has an upper portion disposed at the top surface and a lower portion disposed at the bottom surface. An IR blocking material is encased by the upper portion and the lower portion, wherein the IR blocking material is an optically opaque at IR wavelengths and the lower portion is optically transparent at IR wavelengths.

公开(公告)号：US11756816B2

公开(公告)日：2023-09-12

申请号：US16568910

申请日：2019-09-12

Applicant: Applied Materials, Inc.

Inventor： Steven Trey Tindel ,  Alexander N. Lerner ,  Kim Ramkumar Vellore

IPC: H01L21/68 ,  H01L21/673

CPC classification number: H01L21/67386 ,  H01L21/67346 ,  H01L21/67363 ,  H01L21/67383 ,  H01L21/68

Abstract: A carrier FOUP and a method of placing a carrier are provided. The carrier FOUP includes a body and a door. The body includes a plurality of chamfers, and one or more carriers are placed on, and supported by, the plurality of chamfers. The method of placing a carrier includes placing the carrier in the carrier FOUP and closing the door of the carrier FOUP. When the door is closed, the door pushes against the carrier and aligns the carrier with the alignment feature. The alignment features align the carrier, removing the need to be aligned by the factory interface robot when placing or removing the carrier from the carrier FOUP.

公开(公告)号：US11637004B2

公开(公告)日：2023-04-25

申请号：US16848614

申请日：2020-04-14

Applicant: Applied Materials, Inc.

Inventor： Alexander N. Lerner ,  Michael P. Karazim ,  Andrew J. Constant ,  Jeffrey A. Brodine ,  Kim Ramkumar Vellore ,  Kevin Moraes ,  Roey Shaviv

IPC: H01L21/67 ,  H01J37/32 ,  C23C16/04 ,  H01L21/673 ,  H01L21/677 ,  H01L21/68

Abstract: An alignment module for housing and cleaning masks. The alignment module comprises a mask stocker, a cleaning chamber, an alignment chamber, an alignment stage a transfer robot. The mask stocker is configured to house a mask cassette configured to store a plurality of masks. The cleaning chamber is configured to clean the plurality of masks by providing one or more cleaning gases into a chamber after a mask is inserted into the cleaning chamber. The alignment stage is configured to support a carrier and a substrate. The transfer robot is configured to transfer a mask from one or more of the alignment stage and the mask stocker to the cleaning chamber.

公开(公告)号：US20230066087A1

公开(公告)日：2023-03-02

申请号：US17464657

申请日：2021-09-01

Applicant: Applied Materials, Inc.

Inventor： Kim Ramkumar Vellore

IPC: C30B25/12 ,  C30B25/10 ,  G01J5/08 ,  H01L21/687

Abstract: The present disclosure generally relates to a substrate support for processing of semiconductor substrates. In one example, the substrate support has a body. The body has a top surface configured to support a substrate thereon. The body has a bottom surface opposite the top surface. The body has an upper portion disposed at the top surface and a lower portion disposed at the bottom surface. An IR blocking material is encased by the upper portion and the lower portion, wherein the IR blocking material is an optically opaque at IR wavelengths and the lower portion is optically transparent at IR wavelengths.

公开(公告)号：US11414740B2

公开(公告)日：2022-08-16

申请号：US16864949

申请日：2020-05-01

Applicant: Applied Materials, Inc.

Inventor： Alexander N. Lerner ,  Roey Shaviv ,  Michael P. Karazim ,  Kevin Vincent Moraes ,  Steven V. Sansoni ,  Andrew J. Constant ,  Jeffrey Allen Brodine ,  Kim Ramkumar Vellore ,  Amikam Sade ,  Niranjan Kumar

IPC: C23C14/04 ,  C23C14/02 ,  C23C14/08 ,  H01L51/00 ,  C23C14/12 ,  H01L51/44

Abstract: Embodiments of the present disclosure generally relate to a processing system for forming one or more layers of a photodiode. In one embodiment, the processing system includes a transfer chamber, a plurality of processing chambers, and a controller configured to cause a process to be performed in the processing system. The process includes performing a pre-clean process on a substrate, aligning and placing a first mask on the substrate, depositing a first layer on the substrate, and depositing a second layer on the substrate. The processing system can form layers of a photodiode in a low defect, cost effective, and high utilization manner.