公开(公告)号：US20190279893A1

公开(公告)日：2019-09-12

申请号：US16421301

申请日：2019-05-23

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Konstantin Makhratchev ,  Jason Della Rosa ,  Hamid Noobakhsh ,  Brad L. Mays ,  Douglas A. Buchberger, JR.

IPC: H01L21/683 ,  H01L21/67

Abstract: A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to the ceramic puck. The thermally conductive base includes a plurality of thermal zones and a thermally managed material embedded in the thermally conductive base at the upper surface of the thermally conductive base in one or more of the plurality of thermal zones. The thermally managed material has different thermal conductive properties along a first direction and a second direction. The thermally conductive base further includes a plurality of thermal isolators that extend from the upper surface of the thermally conductive base towards a lower surface of the thermally conductive base between two or more of the plurality of thermal zones without contacting the lower surface of the thermally conductive base. Each of the plurality of thermal isolators provides a degree of thermal isolation.

公开(公告)号：US10460916B2

公开(公告)日：2019-10-29

申请号：US15979787

申请日：2018-05-15

Applicant: Applied Materials, Inc.

Inventor： Wendell Glenn Boyd, Jr. ,  Vijay D. Parkhe ,  Matthew James Busche ,  Konstantin Makhratchev ,  Masanori Ono ,  Senh Thach

IPC: H05B33/00 ,  H01J37/32 ,  H01L21/683 ,  H01L21/66 ,  H01L21/67 ,  H01L21/687

Abstract: Embodiments disclosed herein include a method for minimizing chucking forces on a workpiece disposed on a electrostatic chuck within a plasma processing chamber. The method begins by placing a workpiece on an electrostatic chuck in a processing chamber. A plasma is struck within the processing chamber. A deflection force is monitored on the workpiece. A chucking voltage is applied at a minimum value. A backside gas pressure is applied at a minimum pressure. The chucking voltage and or backside gas pressure is adjusted such that the deflection force is less than a threshold value. And the chucking voltage and the backside gas pressure are simultaneously ramped up.

公开(公告)号：US09875923B2

公开(公告)日：2018-01-23

申请号：US15385441

申请日：2016-12-20

Applicant: Applied Materials, Inc.

Inventor： Wendell Boyd, Jr. ,  Vijay D. Parkhe ,  Matthew James Busche ,  Konstantin Makhratchev ,  Masanori Ono ,  Senh Thach

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67288

Abstract: A control system that includes deflection sensors which can control clamping forces applied by electrostatic chucks, and related methods are disclosed. By using a sensor to determine a deflection of a workpiece supported by an electrostatic chuck, a control system may use the deflection measured to control a clamping force applied to the workpiece by the electrostatic chuck. The control system applies a clamping voltage to the electrostatic chuck so that the clamping force reaches and maintains a target clamping force. In this manner, the clamping force may secure the workpiece to the electrostatic chuck to enable manufacturing operations to be performed while preventing workpiece damage resulting from unnecessary higher values of the clamping force.

公开(公告)号：US20170250100A1

公开(公告)日：2017-08-31

申请号：US15595870

申请日：2017-05-15

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Konstantin Makhratchev ,  Jason Della Rosa ,  Hamid Noorbakhsh ,  Brad L. Mays ,  Douglas A. Buchberger, JR.

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/6831 ,  Y10T156/10

Abstract: A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to a lower surface of the ceramic puck. The thermally conductive base includes a plurality of thermal zones and a plurality of thermal isolators that extend from the upper surface of the thermally conductive base towards a lower surface of the thermally conductive base, wherein each of the plurality of thermal isolators provides approximate thermal isolation between two of the plurality of thermal zones at the upper surface of the thermally conductive base.

公开(公告)号：US08941969B2

公开(公告)日：2015-01-27

申请号：US13725449

申请日：2012-12-21

Applicant: Applied Materials, Inc.

Inventor： Senh Thach ,  Dmitry Lubomirsky ,  Jennifer Y. Sun ,  Konstantin Makhratchev

IPC: H01T23/00 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67103 ,  H01L21/67109 ,  H01L21/6831 ,  Y10T29/49002

Abstract: An electrostatic chuck includes a thermally conductive base having a plurality of heating elements disposed therein. A metal layer covers at least a portion of the thermally conductive base, wherein the metal layer shields the plurality of heating elements from radio frequency (RF) coupling and functions as an electrode for the electrostatic chuck. A plasma resistant dielectric layer covers the metal layer.

Abstract translation: 静电卡盘包括其中布置有多个加热元件的导热基座。 金属层覆盖导热基体的至少一部分，其中金属层将多个加热元件与射频（RF）耦合屏蔽，并用作静电卡盘的电极。 等离子体电介质层覆盖金属层。

公开(公告)号：US12009244B2

公开(公告)日：2024-06-11

申请号：US16741330

申请日：2020-01-13

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Steven E. Babayan ,  Konstantin Makhratchev ,  Zhiqiang Guo ,  Phillip R. Sommer ,  Dan A. Marohl

IPC: H01L21/683 ,  H01L21/67 ,  H05B1/02 ,  H05B3/02

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/6831 ,  H05B1/023 ,  H05B1/0233 ,  H05B3/02

Abstract: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.

公开(公告)号：US11088005B2

公开(公告)日：2021-08-10

申请号：US16421301

申请日：2019-05-23

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Konstantin Makhratchev ,  Jason Della Rosa ,  Hamid Noobakhsh ,  Brad L. Mays ,  Douglas A. Buchberger, Jr.

IPC: H01L21/683 ,  H01T23/00 ,  H01L21/67

Abstract: A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to the ceramic puck. The thermally conductive base includes a plurality of thermal zones and a thermally managed material embedded in the thermally conductive base at the upper surface of the thermally conductive base in one or more of the plurality of thermal zones. The thermally managed material has different thermal conductive properties along a first direction and a second direction. The thermally conductive base further includes a plurality of thermal isolators that extend from the upper surface of the thermally conductive base towards a lower surface of the thermally conductive base between two or more of the plurality of thermal zones without contacting the lower surface of the thermally conductive base. Each of the plurality of thermal isolators provides a degree of thermal isolation.

公开(公告)号：US10079165B2

公开(公告)日：2018-09-18

申请号：US14282503

申请日：2014-05-20

Applicant: APPLIED MATERIALS, INC.

Inventor： Vijay Parkhe ,  Konstantin Makhratchev

IPC: F28F7/00 ,  G05D13/00 ,  H01L21/67 ,  H01L21/683 ,  F28F3/12

CPC classification number: H01L21/67109 ,  F28F3/12 ,  H01L21/6831

Abstract: An electrostatic chuck is described with independent zone cooling that leads to reduced crosstalk. In one example, the chuck includes a puck to carry a substrate for fabrication processes, and a cooling plate fastened to and thermally coupled to the ceramic puck, the cooling plate having a plurality of different independent cooling channels to carry a heat transfer fluid to transfer heat from the cooling plate.

公开(公告)号：US09991148B2

公开(公告)日：2018-06-05

申请号：US15595870

申请日：2017-05-15

Applicant: Applied Materials, Inc.

Inventor： Vijay D. Parkhe ,  Konstantin Makhratchev ,  Jason Della Rosa ,  Hamid Noorbakhsh ,  Brad L. Mays ,  Douglas A. Buchberger, Jr.

IPC: H01L21/683 ,  H01T23/00 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67103 ,  H01L21/6831 ,  Y10T156/10

Abstract: A substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that is bonded to a lower surface of the ceramic puck. The thermally conductive base includes a plurality of thermal zones and a plurality of thermal isolators that extend from the upper surface of the thermally conductive base towards a lower surface of the thermally conductive base, wherein each of the plurality of thermal isolators provides approximate thermal isolation between two of the plurality of thermal zones at the upper surface of the thermally conductive base.

公开(公告)号：US09558981B2

公开(公告)日：2017-01-31

申请号：US14158112

申请日：2014-01-17

Applicant: Applied Materials, Inc.

Inventor： Wendell Boyd, Jr. ,  Vijay D. Parkhe ,  Matthew Busche ,  Konstantin Makhratchev ,  Masanori Ono ,  Senh Thach

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67288

Abstract: A control system that includes deflection sensors which can control clamping forces applied by electrostatic chucks, and related methods are disclosed. By using a sensor to determine a deflection of a workpiece supported by an electrostatic chuck, a control system may use the deflection measured to control a clamping force applied to the workpiece by the electrostatic chuck. The control system applies a clamping voltage to the electrostatic chuck so that the clamping force reaches and maintains a target clamping force. In this manner, the clamping force may secure the workpiece to the electrostatic chuck to enable manufacturing operations to be performed while preventing workpiece damage resulting from unnecessary higher values of the clamping force.

Abstract translation: 公开了一种包括能够控制由静电卡盘施加的夹持力的偏转传感器的控制系统及相关方法。 通过使用传感器来确定由静电卡盘支撑的工件的偏转，控制系统可以使用测量的偏转来控制由静电卡盘施加到工件的夹紧力。 控制系统对静电卡盘施加钳位电压，使得夹紧力达到并保持目标夹紧力。 以这种方式，夹紧力可以将工件固定到静电卡盘，以使得能够进行制造操作，同时防止由于不必要的较高的夹紧力而导致的工件损坏。