公开(公告)号：USD884855S1

公开(公告)日：2020-05-19

申请号：US29711377

申请日：2019-10-30

Applicant: Applied Materials, Inc.

Designer： Mahesh Ramakrishna ,  Naman Apurva

公开(公告)号：USD1066620S1

公开(公告)日：2025-03-11

申请号：US29770566

申请日：2021-02-12

Applicant: Applied Materials, Inc.

Designer： Mahesh Ramakrishna

公开(公告)号：USD1035598S1

公开(公告)日：2024-07-16

申请号：US29749079

申请日：2020-09-02

Applicant: Applied Materials, Inc.

Designer： Mahesh Ramakrishna ,  Yury Shustrov

Abstract: FIG. 1 is an isometric view of a gas distribution plate for a semiconductor processing chamber showing our new design;
FIG. 2 is a front elevational view of the gas distribution plate for a semiconductor processing chamber of FIG. 1, the rear elevational view being a mirror image;
FIG. 3 is a side sectional view of the gas distribution plate for a semiconductor processing chamber along lines 3-3 of FIG. 2;
FIG. 4 is an enlarged sectional view of a portion of the gas distribution plate for a semiconductor processing chamber of FIG. 3 showing details of an edge and an opening formed therethrough typical of all of the openings in the gas distribution plate for a semiconductor processing chamber; and,
FIG. 5 is an enlarged view of a portion of the gas distribution plate of FIG. 2 showing details of openings formed therethrough typical of all of the openings in the gas distribution plate for a semiconductor processing chamber.

公开(公告)号：US12110585B2

公开(公告)日：2024-10-08

申请号：US17167469

申请日：2021-02-04

Applicant: APPLIED MATERIALS, INC.

Inventor： Naman Apurva ,  Lara A. Hawrylchak ,  Mahesh Ramakrishna ,  Sriharish Srinivasan ,  Prashant Agarwal

IPC: C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  H01J37/32 ,  H01L21/67

CPC classification number: C23C16/4412 ,  C23C16/45517 ,  C23C16/45591 ,  C23C16/4585 ,  C23C16/45565 ,  H01J37/3244 ,  H01J37/32633 ,  H01J37/32834 ,  H01L21/67069

Abstract: Embodiments of exhaust liner systems are provided herein. In some embodiments, an exhaust liner system for use in a process chamber includes a lower exhaust liner having an annular body with a central opening; an upper flange, a central flange, and a lower flange extending outward from the annular body, wherein the lower flange and the central flange partially define a first plenum, and wherein the central flange and the upper flange partially define a second plenum; a plurality of exhaust holes from the central opening to the first plenum; and at least one cutout in the central flange to provide a flow path from the first plenum to the second plenum, wherein the lower exhaust liner defines a gas flow path from the central opening to the first plenum via the plurality of exhaust holes and from the first plenum to the second plenum via the least one cutout.

公开(公告)号：US10763141B2

公开(公告)日：2020-09-01

申请号：US15461952

申请日：2017-03-17

Applicant: Applied Materials, Inc.

Inventor： Niraj Merchant ,  Lara Hawrylchak ,  Mehran Behdjat ,  Dietrich Gage ,  Christopher Dao ,  Binh Nguyen ,  Michael P. Kamp ,  Mahesh Ramakrishna

IPC: H01L21/67 ,  G01J5/00 ,  G01J5/34 ,  G01R35/00 ,  H01L21/66 ,  H05B1/02 ,  H05B3/00

Abstract: Embodiments of the disclosure relate to methods for measuring temperature and a tool for calibrating temperature control of a substrate support in a processing chamber without contact with a surface of the substrate support. In one embodiment, a test fixture with a temperature sensor is removably mounted to an upper surface of a chamber body of the processing chamber such that the temperature sensor has a field of view including an area of the substrate support that is adjacent to a resistive coil disposed in the substrate support. One or more calibration temperature measurements of the area of the substrate support are taken by the temperature sensor and simultaneously one or more calibration resistance measurements of the resistive coil are taken corresponding to each calibration temperature measurement. Temperature control of a heating element disposed in the substrate support is calibrated based on the calibration temperature and calibration resistance measurements.