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公开(公告)号：US12033875B2
公开(公告)日：2024-07-09
申请号：US17824785
申请日：2022-05-25
Applicant: Applied Materials, Inc.
Inventor： Ramesh Gopalan
IPC: H01L21/67 , H01J37/32 , H01L21/683
CPC classification number: H01L21/67253 , H01J37/32715 , H01L21/6833 , H01L21/6838
Abstract: Embodiments disclosed herein include an apparatus for measuring chucking force and methods of using such apparatuses. In an embodiment, the apparatus for measuring a chucking force comprises a substrate having a chucking surface, where the chucking surface is the surface that is supported by a chuck. In an embodiment, the apparatus further comprises a plurality of sensors over the chucking surface, where the plurality of sensors are thin film sensors with a thickness that is less than a thickness of the substrate. In an embodiment, the apparatus further comprises a wireless communication module electrically coupled to each of the plurality of sensors.
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公开(公告)号：US10513008B2
公开(公告)日：2019-12-24
申请号：US15699645
申请日：2017-09-08
Applicant: Applied Materials, Inc.
Inventor： Zubin Huang , Stephen A. Wells , Ramesh Gopalan , Gangadhar Sheelavant , Simon Yavelberg
Abstract: Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, and a sensor assembly. The retaining ring is coupled to the body. The sensor assembly is positioned at least partially in the body. The sensor assembly includes a transmitter, an antenna, and a vibrational sensor. The transmitter has a first end and a second end. The antenna is coupled to the first end of the transmitter. The vibrational sensor is coupled to the second end. The vibrational sensor is configured to detect vibration during chemical mechanical processes with respect to radial, azimuthal, and angular axes of the carrier head.
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公开(公告)号：US10685819B2
公开(公告)日：2020-06-16
申请号：US15975576
申请日：2018-05-09
Applicant: Applied Materials, Inc.
Inventor： Ramesh Gopalan , Tom K. Cho , George Alajajian , Michael J. Mark
IPC: H01J37/32 , G01N21/31 , G01N21/64 , G01N21/85 , G01N21/62 , G01N21/84 , H01L21/67 , H01L21/66 , G01N21/03 , G01N21/17
Abstract: An apparatus includes a reactive species source, a spectral measurement volume, a light source to emit a light beam into the spectral measurement volume, a spectrometer to receive the light beam from the spectral measurement volume. The apparatus includes an a controller configured to, when a reactive species is present in the spectral measurement volume, control the light source to emit the light beam into the spectral measurement volume and the spectrometer to determine an environment spectrum using the light beam, and when the reactive species is not present in the spectral measurement volume, control the light source to emit the light beam into the spectral measurement volume and the spectrometer to determine a baseline spectrum using the light beam, calculate a net spectrum based on a difference between the environment spectrum and the baseline spectrum, and estimate a concentration of the reactive species based on the net spectrum.
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公开(公告)号：US10094788B2
公开(公告)日：2018-10-09
申请号：US15000092
申请日：2016-01-19
Applicant: Applied Materials, Inc.
Inventor： Ramesh Gopalan , Simon Yavelberg , Zubin Huang
Abstract: The implementations described herein generally relate to a sensing device for use in the semiconducting industry which sense process parameters to control semiconductor processes. More specifically, the implementations relate to packaging for a surface acoustic wave (SAW) based devices or wireless or RF-responsive sensors for use in the harsh processing environments of a semiconductor processing chamber such that the neither the sensor and its components nor the chamber components interfere with or contaminate one another. The sensor packaging may include various packaging layers with or without protective coatings and a waveguide. The packaging may have a thickness chosen such that the thickness is less than the electromagnetic wavelength of a SAW sensor radio wave. The sensing devices may be disposed in cavities of the chamber, the processing volume, on chamber components, and/or on the substrate.
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公开(公告)号：US20220285185A1
公开(公告)日：2022-09-08
申请号：US17824785
申请日：2022-05-25
Applicant: Applied Materials, Inc.
Inventor： Ramesh Gopalan
IPC: H01L21/67 , H01L21/683 , H01J37/32
Abstract: Embodiments disclosed herein include an apparatus for measuring chucking force and methods of using such apparatuses. In an embodiment, the apparatus for measuring a chucking force comprises a substrate having a chucking surface, where the chucking surface is the surface that is supported by a chuck. In an embodiment, the apparatus further comprises a plurality of sensors over the chucking surface, where the plurality of sensors are thin film sensors with a thickness that is less than a thickness of the substrate. In an embodiment, the apparatus further comprises a wireless communication module electrically coupled to each of the plurality of sensors.
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Patent Agency Ranking
公开(公告)号：US11373890B2
公开(公告)日：2022-06-28
申请号：US16702994
申请日：2019-12-04
Applicant: APPLIED MATERIALS, INC.
Inventor： Ramesh Gopalan
IPC: H01L21/67 , H01L21/683 , H01J37/32
Abstract: Embodiments disclosed herein include an apparatus for measuring chucking force and methods of using such apparatuses. In an embodiment, the apparatus for measuring a chucking force comprises a substrate having a chucking surface, where the chucking surface is the surface that is supported by a chuck. In an embodiment, the apparatus further comprises a plurality of sensors over the chucking surface, where the plurality of sensors are thin film sensors with a thickness that is less than a thickness of the substrate. In an embodiment, the apparatus further comprises a wireless communication module electrically coupled to each of the plurality of sensors.
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公开(公告)号：US11114326B2
公开(公告)日：2021-09-07
申请号：US16293437
申请日：2019-03-05
Applicant: Applied Materials, Inc.
Inventor： Wendell Glenn Boyd, Jr. , Jim Zhongyi He , Ramesh Gopalan , Robert T. Hirahara , Govinda Raj
IPC: H01L21/683 , H01J37/32
Abstract: Methods for chucking and de-chucking a substrate from an electrostatic chucking (ESC) substrate support to reduce scratches of the non-active surface of a substrate include simultaneously increasing a voltage applied to a chucking electrode embedded in the ESC substrate support and a backside gas pressure in a backside volume disposed between the substrate and the substrate support to chuck the substrate and reversing the process to de-chuck the substrate.
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公开(公告)号：US10656100B2
公开(公告)日：2020-05-19
申请号：US16126753
申请日：2018-09-10
Applicant: Applied Materials, Inc.
Inventor： Ramesh Gopalan , Simon Yavelberg , Zubin Huang
Abstract: The implementations described herein generally relate to a sensing device for use in the semiconducting industry, which sense process parameters to control semiconductor processes. More specifically, the implementations relate to packaging for a surface acoustic wave (SAW) based devices or wireless or RF-responsive sensors for use in the harsh processing environments of a semiconductor processing chamber such that the neither the sensor and its components nor the chamber components interfere with or contaminate one another. The sensor packaging may include various packaging layers with or without protective coatings and a waveguide. The packaging may have a thickness chosen such that the thickness is less than the electromagnetic wavelength of a SAW sensor radio wave. The sensing devices may be disposed in cavities of the chamber, the processing volume, on chamber components, and/or on the substrate.
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公开(公告)号：US20190264314A1
公开(公告)日：2019-08-29
申请号：US16274141
申请日：2019-02-12
Applicant: Applied Materials, Inc.
Inventor： Ramesh Gopalan , Yixing Lin , Tasnuva Tabassum , Siamak Salimian , Yikai Chen , Kevin Papke
Abstract: Disclosed herein is a poly-crystalline protective coating on a surface of a chamber component. The poly-crystalline protective coating may be deposited by thermal spraying and may comprise cubic yttria and monoclinic yttria. At least one of: (1) the ratio of the cubic yttria to monoclinic yttria, (2) the crystallite size of at least one of the cubic yttria or the monoclinic yttria, (3) the atomic ratio of oxygen (O) to yttria (Y), and/or (4) the dielectric properties of the poly-crystalline protective coating may be controlled to obtain consistent chamber performance when switching coated chamber components within a chamber of interest.
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公开(公告)号：US11521839B2
公开(公告)日：2022-12-06
申请号：US16697591
申请日：2019-11-27
Applicant: Applied Materials, Inc.
Inventor： Ramesh Gopalan , Siamak Salimian
Abstract: Embodiments of the present invention provide apparatus, systems and methods for measuring dissociation of a process gas generated by a RPS. In one embodiment, a method of measuring dissociation of a process gas includes receiving a process gas from a RPS, the process gas including a polyatomic molecule that dissociates into at least one free radical. The method further includes irradiating the process gas with IR radiation at one or more wavelengths, detecting the IR radiation that passes through the process gas, and determining a degree of dissociation of the polyatomic molecule in the process gas based, at least in part, on the detected IR radiation. In one embodiment, the method further comprises modifying one or more settings of the RPS, based, at least in part, on the determined degree of dissociation.
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