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公开(公告)号:US11422096B2
公开(公告)日:2022-08-23
申请号:US17106555
申请日:2020-11-30
Applicant: Applied Materials, Inc.
Inventor: Weimin Li , Wen Xiao , Vibhu Jindal , Sanjay Bhat
IPC: G01N21/956 , G03F1/24 , G03F7/20
Abstract: Apparatus and methods for measuring surface topography are described. The analysis apparatus and methods detect light reflected from the reflective backside of a cantilever assembly including a tip, calculate a background level (BGL) value obtained from an optical scan of a reference sample using a power spectral density (PSD) value obtained from a topographical scan of a reference sample to generate a correlational coefficient between the BGL and the PSD values. The correlational coefficient between the BGL and PSD values is used to measure the BGL value of additional EUV mask blanks by a topographical scan of the EUV mask blanks using the same tip mounted to the cantilever.
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公开(公告)号:US20210333703A1
公开(公告)日:2021-10-28
申请号:US17234996
申请日:2021-04-20
Applicant: Applied Materials, Inc
Inventor: Wen Xiao , Vibhu Jindal , Weimin Li , Sanjay Bhat , Azeddine Zerrade
IPC: G03F1/24
Abstract: Extreme ultraviolet (EUV) mask blanks and methods for their manufacture, and production systems therefor are disclosed. The method for forming an EUV mask blank comprises smoothing out surface defects on a surface of a substrate.
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公开(公告)号:US20200333700A1
公开(公告)日:2020-10-22
申请号:US16850665
申请日:2020-04-16
Applicant: Applied Materials, Inc.
Inventor: Wen Xiao , Vibhu Jindal , Weimin Li , Shuwei Liu
Abstract: A multilayer stack in the form of a Bragg reflector comprising a graded interfacial layer and a method of manufacturing are disclosed. The graded interfacial layer eliminates the formation of low-reflectivity interfaces in a multilayer stack and reduces roughness of interfaces in a multilayer stack.
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公开(公告)号:US20220221786A1
公开(公告)日:2022-07-14
申请号:US17708593
申请日:2022-03-30
Applicant: Applied Materials, Inc.
Inventor: Wen Xiao , Vibhu Jindal , Weimin Li , Shuwei Liu
Abstract: A multilayer stack in the form of a Bragg reflector comprising a graded interfacial layer and a method of manufacturing are disclosed. The graded interfacial layer eliminates the formation of low-reflectivity interfaces in a multilayer stack and reduces roughness of interfaces in a multilayer stack.
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公开(公告)号:US11789358B2
公开(公告)日:2023-10-17
申请号:US17234996
申请日:2021-04-20
Applicant: Applied Materials, Inc.
Inventor: Wen Xiao , Vibhu Jindal , Weimin Li , Sanjay Bhat , Azeddine Zerrade
IPC: G03F1/24
CPC classification number: G03F1/24
Abstract: Extreme ultraviolet (EUV) mask blanks and methods for their manufacture, and production systems therefor are disclosed. The method for forming an EUV mask blank comprises smoothing out surface defects on a surface of a substrate.
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公开(公告)号:US11720013B2
公开(公告)日:2023-08-08
申请号:US17708593
申请日:2022-03-30
Applicant: Applied Materials, Inc.
Inventor: Wen Xiao , Vibhu Jindal , Weimin Li , Shuwei Liu
CPC classification number: G03F1/24 , G02B5/0891 , G03F7/7015 , G03F7/70316
Abstract: A multilayer stack in the form of a Bragg reflector comprising a graded interfacial layer and a method of manufacturing are disclosed. The graded interfacial layer eliminates the formation of low-reflectivity interfaces in a multilayer stack and reduces roughness of interfaces in a multilayer stack.
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公开(公告)号:US11327394B2
公开(公告)日:2022-05-10
申请号:US16850665
申请日:2020-04-16
Applicant: Applied Materials, Inc.
Inventor: Wen Xiao , Vibhu Jindal , Weimin Li , Shuwei Liu
Abstract: A multilayer stack in the form of a Bragg reflector comprising a graded interfacial layer and a method of manufacturing are disclosed. The graded interfacial layer eliminates the formation of low-reflectivity interfaces in a multilayer stack and reduces roughness of interfaces in a multilayer stack.
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公开(公告)号:US11604151B2
公开(公告)日:2023-03-14
申请号:US17747639
申请日:2022-05-18
Applicant: Applied Materials, Inc.
Inventor: Weimin Li , Wen Xiao , Vibhu Jindal , Sanjay Bhat
IPC: G01N21/956 , G03F7/20 , G03F1/24
Abstract: Apparatus and methods for measuring surface topography are described. The analysis apparatus and methods detect light reflected from the reflective backside of a cantilever assembly including a tip, calculate a background level (BGL) value obtained from an optical scan of a reference sample using a power spectral density (PSD) value obtained from a topographical scan of a reference sample to generate a correlational coefficient between the BGL and the PSD values. The correlational coefficient between the BGL and PSD values is used to measure the BGL value of additional EUV mask blanks by a topographical scan of the EUV mask blanks using the same tip mounted to the cantilever.
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公开(公告)号:US20220170866A1
公开(公告)日:2022-06-02
申请号:US17106555
申请日:2020-11-30
Applicant: Applied Materials, Inc.
Inventor: Weimin Li , Wen Xiao , Vibhu Jindal , Sanjay Bhat
IPC: G01N21/956 , G03F1/24 , G03F7/20
Abstract: Apparatus and methods for measuring surface topography are described. The analysis apparatus and methods detect light reflected from the reflective backside of a cantilever assembly including a tip, calculate a background level (BGL) value obtained from an optical scan of a reference sample using a power spectral density (PSD) value obtained from a topographical scan of a reference sample to generate a correlational coefficient between the BGL and the PSD values. The correlational coefficient between the BGL and PSD values is used to measure the BGL value of additional EUV mask blanks by a topographical scan of the EUV mask blanks using the same tip mounted to the cantilever.
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