公开(公告)号：US20180304441A1

公开(公告)日：2018-10-25

申请号：US16017689

申请日：2018-06-25

Applicant: Applied Materials, Inc.

Inventor： Hung Chih Chen ,  Mario David Silvetti ,  Yin Yuan ,  Samuel Chu-Chiang Hsu ,  Huanbo Zhang ,  Gautam Shashank Dandavate

IPC: B24B41/06 ,  B24B37/32

CPC classification number: B24B41/06 ,  B24B37/32 ,  B24B41/067

Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.

公开(公告)号：US11173579B2

公开(公告)日：2021-11-16

申请号：US16017689

申请日：2018-06-25

Applicant: Applied Materials, Inc.

Inventor： Hung Chih Chen ,  Mario David Silvetti ,  Yin Yuan ,  Samuel Chu-Chiang Hsu ,  Huanbo Zhang ,  Gautam Shashank Dandavate

IPC: B24B41/06 ,  B24B37/32

Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.

公开(公告)号：US10022837B2

公开(公告)日：2018-07-17

申请号：US14958814

申请日：2015-12-03

Applicant: Applied Materials, Inc.

Inventor： Hung Chih Chen ,  Yin Yuan ,  Samuel Chu-Chiang Hsu ,  Huanbo Zhang ,  Gautam Shashank Dandavate

IPC: B24B37/32 ,  B24B41/06

Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.

公开(公告)号：US20160082571A1

公开(公告)日：2016-03-24

申请号：US14958814

申请日：2015-12-03

Applicant: Applied Materials, Inc.

Inventor： Hung Chih Chen ,  Yin Yuan ,  Samuel Chu-Chiang Hsu ,  Huanbo Zhang ,  Gautam Shashank Dandavate

IPC: B24B41/06

CPC classification number: B24B41/06 ,  B24B37/32 ,  B24B41/067

Abstract: A carrier head for a chemical mechanical polisher includes a base, a substrate mounting surface, an annular inner ring and an outer ring. The inner ring has a lower surface configured to contact an upper surface of a substrate positioned on the substrate mounting surface, an outer surface, and an inwardly facing surface extending downwardly from the lower surface and is configured to circumferentially surround the edge of the substrate, the inner ring vertically movable relative to the substrate mounting surface. The outer ring has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad, and the outer ring is vertically movable relative to and independently of the substrate mounting surface and the inner ring.

Abstract translation: 用于化学机械抛光机的载体头包括基底，基底安装表面，环形内环和外环。 所述内环具有被配置为接触位于所述基板安装表面上的基板的上表面的下表面，外表面和从所述下表面向下延伸的面向内的表面，并且构造成周向地围绕所述基板的边缘， 所述内环可相对于所述基板安装表面垂直移动。 外环具有周向包围内环的内表面，外表面和与抛光垫接触的下表面，并且外环可相对于基板安装表面和内环而垂直地可移动。

公开(公告)号：US08840446B2

公开(公告)日：2014-09-23

申请号：US13762963

申请日：2013-02-08

Applicant: Applied Materials, Inc.

Inventor： Hung Chih Chen ,  Samuel Chu-Chiang Hsu ,  Yin Yuan ,  Huanbo Zhang ,  Gautam Shashank Dandavate

IPC: B24B29/00

CPC classification number: B24B41/06 ,  B24B37/32 ,  B24B41/067

Abstract: An inner ring for a carrier head has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. An outer ring for a carrier head has an inner surface circumferentially surrounding the inner ring, an outer surface, and a lower surface to contact the polishing pad.

Abstract translation: 用于承载头的内圈具有内表面，该内表面被构造成周向地围绕位于基板安装表面上的基板的边缘，外表面和下表面以接触抛光垫。 用于承载头的外圈具有周向围绕内圈的外表面，外表面和与抛光垫接触的下表面。