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公开(公告)号：US11682878B2
公开(公告)日：2023-06-20
申请号：US16987126
申请日：2020-08-06
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng Lin , John Cheng , Ziliang Cai
CPC classification number: H01S3/0405 , H04B10/40 , H04B10/503
Abstract: The present disclosure is generally directed to techniques for thermal management within optical subassembly modules that include thermally coupling heat-generating components, such as laser assemblies, to a temperature control device, such as a thermoelectric cooler, without the necessity of disposing the heat-generating components within a hermetically-sealed housing. Accordingly, this arrangement provides a thermal communication path that extends from the heat-generating components, through the temperature control device, and ultimately to a heatsink component, such as a sidewall of a transceiver housing, without the thermal communication path extending through a hermetically-sealed housing/cavity.
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2.发明授权公开(公告)号：US11057112B1
公开(公告)日：2021-07-06
申请号：US16737414
申请日：2020-01-08
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng Lin , Hao-Chiang Cheng , Hang Xie
Abstract: The present disclosure is generally directed to a monitor photodiode (MPD) submount for use in optical transceivers that includes a body with a conductive trace pattern disposed on multiple surfaces of the same to allow for vertical mounting of an associated MPD and simplified electrical interconnection with TOSA circuitry without the necessity of electrical interconnection. The MPD submount includes a body defined by a plurality of sidewalls. At least one surface of the body provides a mounting surface for coupling to and supporting an MPD. The MPD submount further includes a conductive trace pattern that provides at least one conductive path that is disposed on the mounting surface and on at least one adjoining sidewall. The portion of the at least one conductive path disposed on the adjoining sidewall extends substantially transverse relative to the surface defining the transceiver/transmitter substrate when the MPD submount is coupled to the same.
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公开(公告)号：US10193302B2
公开(公告)日：2019-01-29
申请号：US15591166
申请日：2017-05-10
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng Lin , Justin Lii , Ziliang Cai
Abstract: A light engine is disclosed that includes an optical bench with a mirror etched therefrom to form a single, unitary structure. The integrated mirror may therefore be pre-aligned with an associated light path to reduce light path alignment errors. In an embodiment, the optical bench includes a first end extending to a second end along a longitudinal axis, a laser diode disposed on a mounting surface adjacent the first end of the optical bench and configured to output laser light along a first light path that extends substantially along the longitudinal axis, and an integrated mirror device disposed along the light path to receive and direct the laser light along a second light path to optically couple the laser light to a photonically-enabled complementary metal-oxide semiconductor (CMOS) die, the second light path being substantially orthogonal relative to the first light path.
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公开(公告)号：US11698497B2
公开(公告)日：2023-07-11
申请号：US17192062
申请日：2021-03-04
Applicant: Applied Optoelectronics, Inc.
Inventor： Hao-Chiang Cheng , Kai-Sheng Lin
CPC classification number: G02B6/4209 , G02B6/4215 , G02B6/4246 , H04B10/40 , H04B10/60
Abstract: An optical fiber holder is disclosed herein that includes at least one confinement slot for routing intermediate optical fibers within a housing of an optical assembly module, and preferably, a plurality of confinement slots for maintaining a target/nominal fiber bending radius for one or more intermediate optical fibers within the housing. Preferably, the optical fiber holder is disposed within the housing of an optical subassembly between an optical component, e.g., a TOSA arrangement and/or ROSA arrangement, and optical coupling receptacles, e.g., LC coupling receptacles, for optically coupling with external fibers for sending and/or receiving optical signals.
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公开(公告)号：US11411650B2
公开(公告)日：2022-08-09
申请号：US16751817
申请日：2020-01-24
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng Lin , Kevin Liu , Hao-Chiang Cheng
Abstract: The present disclosure is generally directed to a component bridge that couples to a feedthrough device to provide additional component mounting surface area within a TOSA housing, and preferably, within a hermetically-sealed TOSA housing. The component bridge includes a body that defines a component mounting surface to couple to electrical components, e.g., one or more filtering capacitors, and a notched portion to provide an accommodation groove. The component bridge includes at least one projection/leg for coupling to a mounting surface of a feedthrough device. The accommodation groove of the component bridge allows for other electrical components, e.g., RF traces, to be patterned/disposed on to the mounting surface and extend at least partially through the accommodation groove while remaining electrically isolated from the same. Accordingly, the component bridge further increases available component mounting surface area for existing feedthrough devices without necessity of re-design and/or modification.
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Patent Agency Ranking
公开(公告)号：US11177887B2
公开(公告)日：2021-11-16
申请号：US16737438
申请日：2020-01-08
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng Lin , Hang Xie , Yi Wang
Abstract: The present disclosure is generally directed to a stepped profile for substrates that support “on board” optical subassembly arrangements. The stepped profile enables mounting TOSA modules to the substrate in a recessed orientation to reduce the overall distance between terminals of the substrate and associated components of the TOSA, e.g., RF terminals of the substrate and an LDD of the TOSA. In an embodiment, the stepped profile further simplifies mounting and optical alignment of TOSA modules by providing at least one mechanical stop to engage surfaces of the TOSA modules and limit travel by the same along one or more axis.
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公开(公告)号：US10983291B2
公开(公告)日：2021-04-20
申请号：US16561531
申请日：2019-09-05
Applicant: Applied Optoelectronics, Inc.
Inventor： Kevin Liu , Kai-Sheng Lin , Hsiu-Che Wang
IPC: G02B6/42
Abstract: The present disclosure is generally directed to a holder element, also generally referred to herein as a welding element, configured to couple an optical coupling receptacle to a substrate and provide an integrated optical arrangement to redirect light received from the optical coupling receptacle along a receive light path to an output light path that is offset from the receive light path.
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公开(公告)号：US10951005B2
公开(公告)日：2021-03-16
申请号：US16506587
申请日：2019-07-09
Applicant: Applied Optoelectronics, Inc.
Inventor： Chong Wang , Kai-Sheng Lin , YongXuan Liang
Abstract: In general the present disclosure is directed to a temperature control device, e.g., a TEC, that includes a top plate with at least first and second contact pads to allow for a soldering process to attach optical components to the first contact pad without causing one or more layers of the second contact pad to reflow and solidify with an uneven mounting surface. Thus, optical components such as a focus lens can be mounted to the second contact pad via, for instance, thermal epoxy. This avoids the necessity of a submount to protect the focus lens from the relatively high heat introduced during a soldering process as well as maintain the flatness of the second contact pad within tolerance so that the mounted focus lens optically aligns by virtue of its physical location/orientation with other associated optical components coupled to the first contact pad, e.g., a laser diode.
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公开(公告)号：US10859775B1
公开(公告)日：2020-12-08
申请号：US16561555
申请日：2019-09-05
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng Lin , Ziliang Cai , Hao-Chiang Cheng
IPC: G02B6/42
Abstract: In general, the present disclosure is directed to an optical turning mirror for receiving channel wavelengths along a first optical path and reflecting the same towards a fiber or photodetector (PD) without the necessity of disposing a highly reflective layer to increase reflectivity. In more detail, the optical turning mirror includes a substantially transparent body, e.g., capable of passing at least 80% of incident wavelengths, that defines an input region with integrated focus lens(es) for receiving channel wavelengths along a first optical path and a reflective surface disposed opposite the input region to direct/launch received channel wavelengths along a second optical path towards an output interface having an angled light-transmissive surface, with the second optical path extending substantially transverse relative to the first optical path.
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公开(公告)号：US10295765B2
公开(公告)日：2019-05-21
申请号：US15413514
申请日：2017-01-24
Applicant: Applied Optoelectronics, Inc.
Inventor： Kai-Sheng Lin , YongXuan Liang , Justin Lii
Abstract: A photodiode package is disclosed that includes a TO-Can style body with an exposed sensor cavity that eliminates the necessity of an encapsulant dispensing process. The TO-Can body of the photodiode package includes an integrated coupling member to allow for coupling to a ROSA housing without an intermediate member. The photodiode package includes a base portion with a cylindrical wall portion that extends therefrom to form an optical coupling cavity. A surface of the base portion provides at least one mounting surface within the optical coupling cavity for coupling to a photodiode chip. The cylindrical wall may function as an integrated coupling member and may be used to directly couple the photodiode package, e.g., without an intermediate cap/ring, into a socket of a ROSA housing. The base portion and cylindrical wall may be formed from a single piece of material, or from multiple pieces depending on a desired configuration.
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