公开(公告)号：US11667111B2

公开(公告)日：2023-06-06

申请号：US16628483

申请日：2018-06-19

Applicant: Ares Materials Inc.

Inventor： Radu Reit ,  Adrian Avendano-Bolivar ,  Apostolos Voutsas ,  David Arreaga-Salas

IPC: B32B27/28 ,  G02B1/14 ,  C09D7/41 ,  B29D11/00 ,  C08G75/045 ,  C08K5/00 ,  C09D181/02 ,  C08G18/64 ,  C08G18/38 ,  B29K81/00 ,  C08K5/132 ,  C08K5/46

CPC classification number: B32B27/286 ,  B29D11/00009 ,  B32B27/28 ,  C08G18/3855 ,  C08G18/3876 ,  C08G18/6453 ,  C08G75/045 ,  C08K5/0041 ,  C09D7/41 ,  C09D181/02 ,  G02B1/14 ,  B29K2081/04 ,  C08K5/132 ,  C08K5/46

Abstract: Display modules typically incorporate a transparent hard material such as glass on the outside of the module in order to better protect the display stack from scratches, dents, and other mechanical deformations. However, as displays move to novel form factors such as bendable, foldable, and reliable display modules, these transparent hard materials (e.g., glass) may not be used due to their limited flexibility. Therefore, it is desirable that replacement materials be sufficiently flexible while maintaining the desirable optical (e.g., >90% transmission and low yellow index) and mechanical properties (e.g., pencil hardness>H) that comparable glass hard materials offer.

公开(公告)号：US12221515B2

公开(公告)日：2025-02-11

申请号：US16973540

申请日：2019-12-09

Applicant: Ares Materials Inc.

Inventor： Kejia Yang ,  Radu Reit

IPC: C08G75/04 ,  C08G75/045 ,  C08J5/18 ,  C08K5/13 ,  C08K5/523

Abstract: A photocurable resin composition for forming an optically clear film. The photocurable resin composition includes a polyfunctional thiol monomer comprising 2 thiol functional groups, a polyfunctional (meth)acrylate monomer comprising 2 (meth)acryloyl functional groups, a photo-initiator present in a concentration of about 1 parts per hundred (phr) or less, a sterically hindered phenolic antioxidant present in a concentration of about 5 phr or less, and a phosphite antioxidant present in a concentration of about 5 phr or less.

公开(公告)号：US10736212B2

公开(公告)日：2020-08-04

申请号：US15698426

申请日：2017-09-07

Applicant: Ares Materials, Inc.

Inventor： Radu Reit ,  David Arreaga-Salas

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H01L51/00 ,  H05K1/18 ,  H01L27/12

Abstract: A bulk substrate for stretchable electronics. The bulk substrate is manufactured with a process that forms a soft-elastic region of the bulk substrate. The soft-elastic region includes a strain capacity of greater than or equal to 25% and a first Young's modulus below 10% of a maximum local modulus of the bulk substrate. The process also forms a stiff-elastic region of the bulk substrate. The stiff-elastic region includes a strain capacity of less than or equal to 5% and a second Young's modulus greater than 10% of the maximum local modulus of the bulk substrate.

公开(公告)号：US12264268B2

公开(公告)日：2025-04-01

申请号：US16756081

申请日：2017-10-17

Applicant: Ares Materials Inc.

Inventor： Radu Reit ,  Jesus Espinoza Diaz ,  Adrian Avendano-Bolivar ,  Apostolos Voutsas ,  David Arreaga-Salas

IPC: B05D5/10 ,  B05D5/00 ,  B32B7/12 ,  C09D4/00 ,  C09J5/06 ,  C09J181/04

Abstract: Provided are semi -interpenetrating optically clear adhesives, methods of use, and methods of manufacture. An example semi-interpenetrating optically clear adhesive comprises a transparent polymer network comprised of at least two or more interpenetrating polymer networks, wherein at least one polymer network is a thermoset material and at least one other polymer network is a thermoplastic material, yielding an optically clear adhesive with a transparency above 80% and an elastic toughness above 1 MJ/m3.

公开(公告)号：US12071533B2

公开(公告)日：2024-08-27

申请号：US16606570

申请日：2018-04-13

Applicant: Ares Materials Inc.

Inventor： Radu Reit ,  Adrian Avendano-Bolivar ,  David Arreaga-Salas

IPC: C08G73/10 ,  B05D3/06 ,  B05D3/12 ,  C08L101/12 ,  G02F1/1333 ,  G03F7/09 ,  H01L27/12

CPC classification number: C08L101/12 ,  B05D3/067 ,  B05D3/12 ,  G02F1/133305 ,  G03F7/09 ,  H01L27/1218 ,  H01L27/1262 ,  C08G73/1028 ,  C08L2203/20

Abstract: Provided are methods for selecting a polymer for use as a flexible electronics substrate. An example method includes selecting a thermosetting polymer from a plurality of polymers, wherein the thermosetting polymer: undergoes a thermomechanical transition at a transition temperature between room temperature and the highest temperature observed during processing from the glassy to the rubbery regime; wherein the thermosetting polymer has a Young's modulus below 3 GPa in the glassy regime and wherein the thermosetting polymer has a Young's modulus above 0.3 MPa in the rubbery regime. The method further includes producing a flexible electronic substrate from the selected polymer.

公开(公告)号：US11427684B2

公开(公告)日：2022-08-30

申请号：US16629869

申请日：2018-06-20

Applicant: Ares Materials Inc.

Inventor： Radu Reit ,  Adrian Avendano-Bolivar ,  Apostolos Voutsas ,  David Arreaga-Salas

IPC: C08G75/045 ,  H01L21/768 ,  G03F7/038 ,  G03F7/09

Abstract: Provided is a method for forming an organic planarization layer. The method includes forming lithographically-patterned arrays atop a substrate; disposing a thiol-based photocurable resin on to the lithographically-patterned arrays to form a photocurable planarization layer; and curing the photocurable planarization layer to form a flat surface above the lithographically-patterned array.