Jig structure for manufacturing heat dissipation unit

    公开(公告)号:US11033989B2

    公开(公告)日:2021-06-15

    申请号:US16041829

    申请日:2018-07-22

    Inventor: Chih-Yeh Lin

    Abstract: A jig structure for manufacturing heat dissipation unit includes a main body, which internally defines a chamber and has a top forming an upper side thereof. The top defines at least one opening, on which at least one silicon dioxide layer is provided. The chamber is in a vacuum-tight state or maintains a positive pressure inert gas atmosphere therein. The jig structure for manufacturing heat dissipation unit can be used with a laser machining tool to provide a better environment and increased flexibility for laser machining or laser welding in manufacturing a heat dissipation unit.

    SUPPORT STRUCTURE FOR HEAT DISSIPATION UNIT
    2.
    发明申请
    SUPPORT STRUCTURE FOR HEAT DISSIPATION UNIT 有权
    散热装置支撑结构

    公开(公告)号:US20150000866A1

    公开(公告)日:2015-01-01

    申请号:US13933088

    申请日:2013-07-01

    Abstract: A support structure for heat dissipation unit includes at least one main body and an oxide coating. Multiple grooves are formed on an outer circumference of the main body. The oxide coating is coated on the outer circumference of the main body and the surfaces of the grooves. The sintered powder body can be replaced with the support structure with the directional oxide coating coated on the outer circumference of the main body and the surfaces of the grooves to greatly speed the vapor-liquid circulation of the working fluid in the chamber of the heat dissipation unit so as to enhance the heat dissipation performance.

    Abstract translation: 散热单元的支撑结构包括至少一个主体和氧化物涂层。 在主体的外周形成有多个槽。 氧化物涂层涂覆在主体的外周和凹槽的表面上。 烧结粉末体可以用支撑结构代替,其中定向氧化物涂层涂覆在主体的外周和槽的表面上,以极大地加速腔室内的工作流体的蒸气 - 液体循环的散热 单元,以增强散热性能。

    Heat Dissipation Device
    3.
    发明申请
    Heat Dissipation Device 审中-公开
    散热装置

    公开(公告)号:US20150219406A1

    公开(公告)日:2015-08-06

    申请号:US14169426

    申请日:2014-01-31

    Abstract: A heat dissipation device includes a main body and a radiation heat dissipation layer. The main body has a first board body and a second board body. The first and second board bodies are correspondingly mated with each other to define a receiving space. At least one capillary structure and a working fluid are disposed in the receiving space. The radiation heat dissipation layer is formed on one face of the second board body, which face is distal from the first board body. The heat dissipation device is disposed in a mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced.

    Abstract translation: 散热装置包括主体和辐射散热层。 主体具有第一板体和第二板体。 第一和第二板体相互配合以限定接收空间。 至少一个毛细结构和工作流体设置在容纳空间中。 辐射散热层形成在第二基板主体的一个面上,该表面远离第一基板主体。 散热装置设置在移动装置中,通过自然对流和辐射为移动装置的封闭空间提供非常好的散热效果。 因此,整个移动设备的散热性能大大提高。

    HEAT DISSIPATION DEVICE
    4.
    发明申请
    HEAT DISSIPATION DEVICE 审中-公开
    散热装置

    公开(公告)号:US20140174704A1

    公开(公告)日:2014-06-26

    申请号:US13723118

    申请日:2012-12-20

    Inventor: Chih-Yeh Lin

    CPC classification number: H01L23/427 F28D15/0233 H01L2924/0002 H01L2924/00

    Abstract: A heat dissipation device includes a first board body and a second board body. The first board body has a first face and a second face. The second face is formed with a rough structure. The second board body has a third face and a fourth face. The fourth face is mated with the second face and covered by the second face. The second and fourth faces together define a chamber. A working fluid is filled in the chamber. The rough structure is coated with a coating. By means of the rough structure and the coating, the cost for the heat dissipation device is reduced and the thermal resistance of the heat dissipation device is lowered.

    Abstract translation: 散热装置包括第一板体和第二板体。 第一板体具有第一面和第二面。 第二面形成为粗糙的结构。 第二板体具有第三面和第四面。 第四张脸与第二张脸相配,并被第二张脸覆盖。 第二和第四面共同限定一个室。 工作流体填充在腔室中。 粗糙结构涂覆有涂层。 通过粗糙的结构和涂层,散热装置的成本降低,散热装置的热阻降低。

    Heat dissipation component
    5.
    发明授权

    公开(公告)号:US11029097B2

    公开(公告)日:2021-06-08

    申请号:US16041830

    申请日:2018-07-22

    Inventor: Chih-Yeh Lin

    Abstract: A heat dissipation component is disclosed. The heat dissipation component has a main body. The main body has a first metal plate body and a second metal plate body. The first and second metal plate bodies together define a chamber. A capillary structure layer is disposed in the chamber and a working fluid is filled in the chamber. An outer periphery of the chamber of the main body has a flange section. The flange section has a sintered welding section. The sintered welding section is perpendicularly connected with the first and second metal plate bodies. Such that, the connection and sealing of the welded first and second metal plate bodies can be enhanced.

    HEAT DISSIPATION COMPONENT MANUFACTURING METHOD

    公开(公告)号:US20200023422A1

    公开(公告)日:2020-01-23

    申请号:US16041832

    申请日:2018-07-22

    Inventor: Chih-Yeh Lin

    Abstract: A heat dissipation component manufacturing method is disclosed. The heat dissipation component has a main body. The main body has a first metal plate body and a second metal plate body. The first and second metal plate bodies together define a chamber. A capillary structure layer is disposed in the chamber and a working fluid is filled in the chamber. An outer periphery of the chamber of the main body has a flange section. The flange section has a sintered welding section. The sintered welding section is perpendicularly connected with the first and second metal plate bodies. The heat dissipation component manufacturing method employs fillet welding to directly perpendicularly weld and connect the first and second metal plate bodies so as to enhance the connection and sealing of the welded first and second metal plate bodies.

    Support structure for heat dissipation unit
    7.
    发明授权
    Support structure for heat dissipation unit 有权
    散热单元支撑结构

    公开(公告)号:US09470459B2

    公开(公告)日:2016-10-18

    申请号:US13933088

    申请日:2013-07-01

    Abstract: A support structure for heat dissipation unit includes at least one main body and an oxide coating. Multiple grooves are formed on an outer circumference of the main body. The oxide coating is coated on the outer circumference of the main body and the surfaces of the grooves. The sintered powder body can be replaced with the support structure with the directional oxide coating coated on the outer circumference of the main body and the surfaces of the grooves to greatly speed the vapor-liquid circulation of the working fluid in the chamber of the heat dissipation unit so as to enhance the heat dissipation performance.

    Abstract translation: 散热单元的支撑结构包括至少一个主体和氧化物涂层。 在主体的外周形成有多个槽。 氧化物涂层涂覆在主体的外周和凹槽的表面上。 烧结粉末体可以用支撑结构代替,其中定向氧化物涂层涂覆在主体的外周和槽的表面上,以极大地加速腔室内的工作流体的蒸气 - 液体循环的散热 单元,以增强散热性能。

    Heat dissipation structure applied to mobile device
    8.
    发明授权
    Heat dissipation structure applied to mobile device 有权
    散热结构应用于移动设备

    公开(公告)号:US09389656B2

    公开(公告)日:2016-07-12

    申请号:US14168546

    申请日:2014-01-30

    CPC classification number: G06F1/203

    Abstract: A heat dissipation structure applied to mobile device includes a heat conduction main body. The heat conduction main body has a heat dissipation side and a heat absorption side. A radiation heat dissipation layer is formed on the heat dissipation side. The heat dissipation structure is disposed in the mobile device to provide a very good heat dissipation effect for the closed space of the mobile device by way of natural convection and radiation. Therefore, the heat dissipation performance of the entire mobile device is greatly enhanced.

    Abstract translation: 应用于移动装置的散热结构包括导热主体。 导热体具有散热侧和吸热侧。 在散热侧形成有辐射散热层。 散热结构设置在移动设备中,通过自然对流和辐射为移动设备的封闭空间提供非常好的散热效果。 因此,整个移动设备的散热性能大大提高。

    METHOD OF MANUFACTURING HEAT DISSIPATION UNIT

    公开(公告)号:US20200025461A1

    公开(公告)日:2020-01-23

    申请号:US16041835

    申请日:2018-07-22

    Inventor: Chih-Yeh Lin

    Abstract: A heat dissipation unit manufacturing method is disclosed. The heat dissipation unit has a main body formed of a first and a second metal plate member, which together define a sealed chamber between them. The chamber has a wick structure and a working fluid provided therein, and a lip portion formed along an outer peripheral edge thereof. The lip portion includes a sinter-welded section perpendicularly connects the first metal plate member to the second metal plate member. In the heat dissipation unit manufacturing method, the first and the second metal plate member are joined along their peripheral edges by lap joint laser welding, in which a laser beam directly perpendicularly passes through the first metal plate member into one third to two thirds of a thickness of the second metal plate member, so that the two metal plate members are more firmly joined to create upgraded vacuum-tightness between them.

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