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公开(公告)号：US10021813B2
公开(公告)日：2018-07-10
申请号：US14882387
申请日：2015-10-13
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor： Yuan-Yi Lin , Yen-Lin Chu
CPC classification number: H05K7/20418 , H01L23/4093
Abstract: A thermal module assembling structure includes a heat sink, at least one leaf spring, at least one holding member and a shaft rod. The heat sink has a base seat and multiple radiating fins disposed on the base seat. At least one perforation is formed on each of two opposite sides of the base seat. The heat sink is correspondingly assembled on the leaf spring. At least one engagement post is disposed on the leaf spring corresponding to the perforation. The holding member is slidably capped on the engagement post and has a first end and a second end. The second end is formed with a socket having an internal receiving space in which a raised section is formed. The engagement post is inlaid in the receiving space. The shaft rod passes through the heat sink. Two ends of the shaft rod are respectively connected with the engagement posts.
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公开(公告)号：US09625218B2
公开(公告)日：2017-04-18
申请号：US14597985
申请日：2015-01-15
Applicant: Asia Vital Components Co., Ltd.
Inventor： Sheng-Huang Lin , Yen-Lin Chu
CPC classification number: F28F9/00 , B23P15/26 , F28D15/0275 , F28F1/32 , F28F9/007 , H05K7/2049 , Y10T29/4935
Abstract: A heat dissipation device includes a mounting bracket and a thermal module. The mounting bracket has at least one retaining hole and a mounting section, and the thermal module includes a plurality of radiating fins, to which the mounting bracket is connected. On the radiating fins, at least one engaging zone is provided for correspondingly engaging with the mounting bracket, and at least one locking portion is formed for correspondingly engaging with the retaining hole. With the above structural design, the mounting bracket can be more firmly and stably connected to the thermal module and be more accurately located on the radiating fins without the need of welding, so that the manufacturing cost for welding is saved. A method of manufacturing the heat dissipation device is also disclosed.
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Patent Agency Ranking
公开(公告)号：US20220141994A1
公开(公告)日：2022-05-05
申请号：US17087627
申请日：2020-11-03
Applicant: ASIA VITAL COMPONENTS CO., LTD
Inventor： Sheng-Huang Lin , Yen-Lin Chu
IPC: H05K7/20
Abstract: A heat dissipation device includes a base having a first surface in contact with at least one heat source and an opposite second surface having a heat dissipation zone upward extended therefrom; an auxiliary heat dissipation zone horizontally extended from one of four lateral sides or directions of the heat dissipation zone; an air guiding section defined at the auxiliary heat dissipation zone; and at least one upward indented zone formed between the auxiliary heat dissipation zone and the side of the heat dissipation zone having the auxiliary heat dissipation zone sideward sidewardly extended from a higher portion thereof. With these arrangements, the heat dissipation device can guide air flow currents directly or indirectly to a plurality of heat sources located corresponding to the heat dissipation zone and the auxiliary heat dissipation zone at the same time to cool them.
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公开(公告)号：US20170105316A1
公开(公告)日：2017-04-13
申请号：US14882387
申请日：2015-10-13
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor： Yuan-Yi Lin , Yen-Lin Chu
IPC: H05K7/20
CPC classification number: H05K7/20418 , H01L23/4093
Abstract: A thermal module assembling structure includes a heat sink, at least one leaf spring, at least one holding member and a shaft rod. The heat sink has a base seat and multiple radiating fins disposed on the base seat. At least one perforation is formed on each of two opposite sides of the base seat. The heat sink is correspondingly assembled on the leaf spring. At least one engagement post is disposed on the leaf spring corresponding to the perforation. The holding member is slidably capped on the engagement post and has a first end and a second end. The second end is formed with a socket having an internal receiving space in which a raised section is formed. The engagement post is inlaid in the receiving space. The shaft rod passes through the heat sink. Two ends of the shaft rod are respectively connected with the engagement posts.
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公开(公告)号：US20150122456A1
公开(公告)日：2015-05-07
申请号：US14597985
申请日：2015-01-15
Applicant: Asia Vital Components Co., Ltd.
Inventor： Sheng-Huang Lin , Yen-Lin Chu
CPC classification number: F28F9/00 , B23P15/26 , F28D15/0275 , F28F1/32 , F28F9/007 , H05K7/2049 , Y10T29/4935
Abstract: A heat dissipation device includes a mounting bracket and a thermal module. The mounting bracket has at least one retaining hole and a mounting section, and the thermal module includes a plurality of radiating fins, to which the mounting bracket is connected. On the radiating fins, at least one engaging zone is provided for correspondingly engaging with the mounting bracket, and at least one locking portion is formed for correspondingly engaging with the retaining hole. With the above structural design, the mounting bracket can be more firmly and stably connected to the thermal module and be more accurately located on the radiating fins without the need of welding, so that the manufacturing cost for welding is saved. A method of manufacturing the heat dissipation device is also disclosed.
Abstract translation: 散热装置包括安装支架和热模块。 安装支架具有至少一个保持孔和安装部分，并且热模块包括多个散热片，安装支架与该散热片连接。 在散热片上设有至少一个接合区，用于相应地与安装支架接合，至少形成一个锁定部分以便与保持孔相配合。 通过上述结构设计，安装支架可以更加牢固和稳定地连接到热模块，并且更准确地位于散热片上而不需要焊接，从而节省了焊接的制造成本。 还公开了一种制造散热装置的方法。
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公开(公告)号：US11564329B2
公开(公告)日：2023-01-24
申请号：US17087627
申请日：2020-11-03
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor： Sheng-Huang Lin , Yen-Lin Chu
IPC: H05K7/20
Abstract: A heat dissipation device includes a base having a first surface in contact with at least one heat source and an opposite second surface having a heat dissipation zone upward extended therefrom; an auxiliary heat dissipation zone horizontally extended from one of four lateral sides or directions of the heat dissipation zone; an air guiding section defined at the auxiliary heat dissipation zone; and at least one upward indented zone formed between the auxiliary heat dissipation zone and the side of the heat dissipation zone having the auxiliary heat dissipation zone sideward sidewardly extended from a higher portion thereof. With these arrangements, the heat dissipation device can guide air flow currents directly or indirectly to a plurality of heat sources located corresponding to the heat dissipation zone and the auxiliary heat dissipation zone at the same time to cool them.
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公开(公告)号：US20200068745A1
公开(公告)日：2020-02-27
申请号：US16108099
申请日：2018-08-22
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor： Sheng-Huang Lin , Yen-Lin Chu
Abstract: A heat dissipation structure of electronic device includes a main body having a first heat pipe set and a second heat pipe set. The first heat pipe set includes at least one first heat pipe normal to the main body. A first thermal module and a first fan are disposed on the first heat pipe. The second heat pipe set includes at least one second heat pipe having a first section normal to the main body and a second section extending from the first section in parallel to the main body. A second thermal module and a second fan are disposed on the second section. The first fan creates a first airflow flowing through the first and second thermal modules in a first direction. The second fan creates a second airflow flowing through the second thermal module in a second direction.
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