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公开(公告)号：US20210215992A1
公开(公告)日：2021-07-15
申请号：US17203310
申请日：2021-03-16
Applicant: Aurrion, Inc.
Inventor： John Parker , Gregory Alan Fish , Brian R. Koch
IPC: G02F1/225 , H01L27/146 , H01L31/18
Abstract: In photonic integrated circuits implemented in silicon-on-insulator substrates, nonconductive channels formed, in accordance with various embodiments, in the silicon device layer and/or the silicon handle of the substrate in regions underneath radio-frequency transmission lines of photonic devices can provide breaks in parasitic conductive layers of the substrate, thereby reducing radio-frequency substrate losses.
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公开(公告)号：US10211595B2
公开(公告)日：2019-02-19
申请号：US15612342
申请日：2017-06-02
Applicant: Aurrion, Inc.
Inventor： Erik Johan Norberg , Brian Koch , Gregory Alan Fish , Hyundai Park , Jared Bauters
Abstract: Described herein are lasers comprising an output port to output an optical signal, a plurality of waveguide segments forming an optical cavity length, and a resonant optical cavity comprising the optical cavity length, a gain medium included in the resonant optical cavity to amplify the optical signal, and a heating element disposed near at least two of the plurality of waveguide segments, the heating element controllable to adjust the phase of the optical signal by heating the waveguide segments. Described herein are optical devices comprising a first plurality of ports to output a plurality of optical signals, a second plurality of ports to receive the plurality of optical signals, and a plurality of coupling waveguides. The plurality of waveguide may comprise a pair of adjacent waveguides separated by a first distance, each of the pair of adjacent waveguides comprising a different width.
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公开(公告)号：US10007167B1
公开(公告)日：2018-06-26
申请号：US15786995
申请日：2017-10-18
Applicant: Aurrion, Inc.
Inventor： John Parker , Gregory Alan Fish , Brian R. Koch
IPC: G02F1/035 , G02F1/225 , H01L31/18 , H01L27/146
CPC classification number: G02F1/2255 , G02F1/2257 , H01L27/14625 , H01L31/184
Abstract: In photonic integrated circuits implemented in silicon-on-insulator substrates, non-conductive channels formed, in accordance with various embodiments, in the silicon device layer and/or the silicon handle of the substrate in regions underneath radio-frequency transmission lines of photonic devices can provide breaks in parasitic conductive layers of the substrate, thereby reducing radio-frequency substrate losses.
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公开(公告)号：US10007058B2
公开(公告)日：2018-06-26
申请号：US15838667
申请日：2017-12-12
Applicant: Aurrion, Inc.
Inventor： Jared Bauters , Brian R. Koch , Jonathan Edgar Roth , Gregory Alan Fish
CPC classification number: G02B6/12033 , G02B6/12026 , G02B6/136
Abstract: The wavelength response of an arrayed waveguide grating can be tuned, in accordance with various embodiments, using a beam sweeper including one or more heaters to shift a lateral position of light focused by the beam sweeper at an interface of the beam sweeper with an input free propagation region of the arrayed waveguide grating.
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公开(公告)号：US09685761B2
公开(公告)日：2017-06-20
申请号：US14870225
申请日：2015-09-30
Applicant: Aurrion, Inc.
Inventor： Erik Johan Norberg , Brian Koch , Gregory Alan Fish , Hyundai Park , Jared Bauters
CPC classification number: H01S5/0612 , G02B6/12009 , G02B6/29344 , G02B6/2938 , H01S5/026 , H01S5/0261 , H01S5/06821 , H01S5/14
Abstract: Described herein are lasers comprising an output port to output an optical signal, a plurality of waveguide segments forming an optical cavity length, and a resonant optical cavity comprising the optical cavity length, a gain medium included in the resonant optical cavity to amplify the optical signal, and a heating element disposed near at least two of the plurality of waveguide segments, the heating element controllable to adjust the phase of the optical signal by heating the waveguide segments. Described herein are optical devices comprising a first plurality of ports to output a plurality of optical signals, a second plurality of ports to receive the plurality of optical signals, and a plurality of coupling waveguides. The plurality of waveguide may comprise a pair of adjacent waveguides separated by a first distance, each of the pair of adjacent waveguides comprising a different width.
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Patent Agency Ranking
公开(公告)号：US09647426B1
公开(公告)日：2017-05-09
申请号：US14318468
申请日：2014-06-27
Applicant: Aurrion, Inc.
Inventor： Gregory Alan Fish , Erik Johan Norberg , John M. Garcia , Robert Silvio Guzzon , Daniel Knight Sparacin
CPC classification number: H01S5/5018 , G02B27/283 , G02B27/286 , H01S5/005 , H01S5/5009 , H04J14/02 , H04J14/06
Abstract: Embodiments of the invention describe polarization insensitive optical devices utilizing polarization sensitive components. Light comprising at least one polarization state is received, and embodiments of the invention select a first optical path for light comprising a first polarization state or a second optical path for light comprising a second polarization state orthogonal to the first polarization state. The optical paths include components to at least amplify and/or modulate light comprising the first polarization state; the second optical path includes a polarization rotator to rotate light comprising the second polarization state to the first polarization state. Embodiments of the invention further describe optical devices including a polarization mode converter to convert light comprising a first and a second polarization state to light comprising different spatial modes of the first polarization state; light comprising the different spatial modes of the first polarization state is subsequently amplified and modulated.
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公开(公告)号：US20170031112A1
公开(公告)日：2017-02-02
申请号：US15230631
申请日：2016-08-08
Applicant: Aurrion, Inc.
Inventor： Gregory Alan Fish , Brian R. Koch
CPC classification number: G02B6/4224 , G02B6/12004 , G02B6/1221 , G02B6/132 , G02B6/136 , G02B6/4204 , G02B6/4219 , G02B6/4232 , G02B6/4269 , G02B6/428 , Y10T29/49117
Abstract: Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC.
Abstract translation: 这里描述的是光子系统和设备，其包括设置在光子集成电路（PIC）的底侧上的光接口单元，用于接收来自PIC的发射极的光。 PIC的顶侧包括用于通过顶侧将PIC电耦合到有机衬底的倒装芯片接口。 形成与发射极相对应的对准特征，发射极偏移预定的距离值; 因为发射器和对准特征是使用共享处理操作形成的，因此偏移量（即，预定距离值）可以在类似产生的PIC之间精确和一致。 PIC包括从底侧（例如，孔）成像对准特征的处理特征。 散热器层围绕光学接口单元并且设置在PIC的底部以散布来自PIC的热量。
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公开(公告)号：US09417411B2
公开(公告)日：2016-08-16
申请号：US14611392
申请日：2015-02-02
Applicant: Aurrion, Inc.
Inventor： Gregory Alan Fish , Brian R. Koch
CPC classification number: G02B6/4224 , G02B6/12004 , G02B6/1221 , G02B6/132 , G02B6/136 , G02B6/4204 , G02B6/4219 , G02B6/4232 , G02B6/4269 , G02B6/428 , Y10T29/49117
Abstract: Described herein are photonic systems and devices including a optical interface unit disposed on a bottom side of a photonic integrated circuit (PIC) to receive light from an emitter of the PIC. A top side of the PIC includes a flip-chip interface for electrically coupling the PIC to an organic substrate via the top side. An alignment feature corresponding to the emitter is formed with the emitter to be offset by a predetermined distance value; because the emitter and the alignment feature are formed using a shared processing operation, the offset (i.e., predetermined distance value) may be precise and consistent across similarly produced PICs. The PIC comprises a processing feature to image the alignment feature from the bottom side (e.g., a hole). A heat spreader layer surrounds the optical interface unit and is disposed on the bottom side of the PIC to spread heat from the PIC.
Abstract translation: 这里描述的是光子系统和设备，其包括设置在光子集成电路（PIC）的底侧上的光接口单元，用于接收来自PIC的发射极的光。 PIC的顶侧包括用于通过顶侧将PIC电耦合到有机衬底的倒装芯片接口。 形成与发射极相对应的对准特征，发射极偏移预定的距离值; 因为发射器和对准特征是使用共享处理操作形成的，因此偏移量（即，预定距离值）可以在类似产生的PIC之间精确和一致。 PIC包括从底侧（例如，孔）成像对准特征的处理特征。 散热器层围绕光学接口单元并且设置在PIC的底部以散布来自PIC的热量。
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公开(公告)号：US09122006B1
公开(公告)日：2015-09-01
申请号：US13779590
申请日：2013-02-27
Applicant: Aurrion, Inc.
Inventor： Jonathan Edgar Roth , Gregory Alan Fish
CPC classification number: G02B6/126 , G02B6/105 , G02B6/12002 , G02B6/1228 , G02B6/14 , G02B6/274
Abstract: Embodiments of the invention describe photonic integrated circuits (PICs) for accomplishing polarization splitting and rotation. Embodiments of the invention include a first waveguide to receive light comprising orthogonally polarized transverse electric (TE) and transverse magnetic (TM) modes, and a second waveguide disposed below the first waveguide and comprising a reverse taper-shaped side to adiabatically receive one of the polarization modes (e.g., the TE mode) of the received light from the first waveguide. Said horizontal offset between the first and the reverse taper-shaped side of the second waveguide comprises an offset such that, for example, the TM mode of the received light is rotated to a TE mode in the first waveguide. The above described offsets and taper shaped structures may also be used in an optical combiner.
Abstract translation: 本发明的实施例描述了用于实现偏振分离和旋转的光子集成电路（PIC）。 本发明的实施例包括用于接收包括正交极化横向电（TE）和横向磁（TM）模式的光的第一波导和设置在第一波导下方的第二波导，并且包括倒锥形侧，以绝热地接收 来自第一波导的接收光的偏振模式（例如，TE模式）。 第二波导的第一和反向锥形侧之间的所述水平偏移包括偏移，使得例如所接收的光的TM模式在第一波导中旋转到TE模式。 上述偏移和锥形结构也可以用在光学组合器中。
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公开(公告)号：US20150222968A1
公开(公告)日：2015-08-06
申请号：US14615294
申请日：2015-02-05
Applicant: Aurrion, Inc.
Inventor： John M. Garcia , Anand Ramaswamy , Gregory Alan Fish
IPC: H04Q11/00
CPC classification number: H04Q11/0005 , H04B10/0795 , H04B10/07953 , H04B10/0799 , H04B10/40 , H04Q11/0003 , H04Q2011/0016
Abstract: Embodiments describe transceiver architectures to enable ‘loopback’ operation, thereby allowing or on-chip or intra module characterization of the transceiver. This includes but is not limited to tests such as bit error rate (BER) characterization, received power characterization and calibration of filters (MUX, DMUX etc.) present in the transceiver. Embodiments may also describe architectures for superimposing low-speed data on to the signal coming out of a transmitter, which in turn enables low frequency communication between network elements in the external link.
Abstract translation: 实施例描述了收发器架构，以实现“环回”操作，从而允许或片上或内部模块表征收发器。 这包括但不限于存在于收发器中的诸如误码率（BER）表征，接收功率表征和滤波器（MUX，DMUX等）的校准的测试。 实施例还可以描述用于将低速数据叠加到从发射机出来的信号的架构，这进而使得能够在外部链路中的网络元件之间进行低频通信。
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