-
公开(公告)号:US11649528B2
公开(公告)日:2023-05-16
申请号:US16960080
申请日:2018-12-24
Applicant: BYD COMPANY LIMITED
Inventor: Qing Gong , Qiang Guo , Mengde Wang , Wei An
CPC classification number: C22C9/05 , B22D17/007 , C22C1/02 , C22C30/02 , H04M1/026
Abstract: The present disclosure relates to a copper based microcrystalline alloy and a preparation method thereof, and an electronic product. In percentage by weight and based on the total amount of the copper based microcrystalline alloy, the copper based microcrystalline alloy includes: 30-60 wt % of Cu; 25-40 wt % of Mn; 4-6 wt % of Al; 10-17 wt % of Ni; 0.01-10 wt % of Si; and 0.001-0.03% of Be.
-
公开(公告)号:US10392708B2
公开(公告)日:2019-08-27
申请号:US14576950
申请日:2014-12-19
Applicant: BYD COMPANY LIMITED
Inventor: Qing Gong , Liang Zhou , Weifeng Miao , Xiong Zhang
Abstract: Metalized plastic substrates, and methods thereof are provided herein. The method includes providing a plastic having a plurality of accelerators dispersed in the plastic. The accelerators have a formula ABO3, wherein A is one or more elements selected from Groups 9, 10, and 11 of the Periodic Table of Elements, B is one or more elements selected from Groups 4B and 5B of the Periodic Table of Elements, and O is oxygen. The method includes the step of irradiating a surface of plastic substrate to expose at least a first accelerator. The method further includes plating the irradiated surface of the plastic substrate to form at least a first metal layer on the at least first accelerator, and then plating the first metal layer to form at least a second metal layer.
-
公开(公告)号:US10161045B2
公开(公告)日:2018-12-25
申请号:US15217717
申请日:2016-07-22
Applicant: BYD COMPANY LIMITED
Inventor: Qing Gong , Wei Zhou , Yongliang Sun
IPC: B05D3/00 , C08J7/18 , G21H5/00 , C23C18/18 , C23C18/16 , C23C18/20 , C23C18/40 , C08K3/20 , C23C18/36 , C23C18/54 , C08K3/22
Abstract: A method for metalizing a polymer substrate and a polymer article prepared by the method are provided. First, a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. Then, a surface of the polymer substrate is irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. The surface of the polymer substrate is then subjected to chemical plating.
-
公开(公告)号:US10059852B2
公开(公告)日:2018-08-28
申请号:US14242763
申请日:2014-04-01
Applicant: SHENZHEN BYD AUTO R&D COMPANY LIMITED , BYD COMPANY LIMITED
Inventor: Qing Gong , Wei Zhou , Bifeng Mao , Weifeng Miao
IPC: C23C18/40 , H05K3/18 , C09D11/322 , C23C18/18 , C23C18/16 , C23C18/20 , C01G37/00 , C01G39/00 , C01G49/00 , C01G15/00 , C09D11/10 , B01J37/34 , B01J37/04 , B01J37/08 , B01J23/00 , B01J23/825 , B01J23/86 , B01J23/887 , B01J35/02 , B01J37/00 , B01J31/06
CPC classification number: C09D11/322 , B01J23/002 , B01J23/825 , B01J23/868 , B01J23/8874 , B01J23/8878 , B01J31/06 , B01J35/023 , B01J37/0036 , B01J37/04 , B01J37/08 , B01J37/349 , B01J2523/00 , C01G15/006 , C01G37/006 , C01G39/006 , C01G49/009 , C01P2004/61 , C01P2004/62 , C01P2006/60 , C01P2006/80 , C09D11/10 , C23C18/1608 , C23C18/1612 , C23C18/1641 , C23C18/1651 , C23C18/1653 , C23C18/1879 , C23C18/204 , C23C18/206 , H05K3/182 , H05K3/185 , H05K2201/0236 , H05K2201/09118 , H05K2203/0709 , H05K2203/107 , H05K2203/1131 , H05K2203/125 , B01J2523/17 , B01J2523/31 , B01J2523/67 , B01J2523/32 , B01J2523/842 , B01J2523/33 , B01J2523/68
Abstract: The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-β (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0
-
公开(公告)号:US09968996B2
公开(公告)日:2018-05-15
申请号:US15029110
申请日:2014-09-30
Applicant: BYD COMPANY LIMITED
Inventor: Qing Gong , Shuming Zhao , Yanan Wang , Qiuhui Chen , Xiaohua Wang , Liuping Tang
IPC: B22D17/10 , B22D17/14 , B22D17/20 , B22D17/28 , B22D17/30 , B22D17/32 , B22D27/15 , F27B3/06 , F27B3/08 , F27B3/24 , F27B14/04 , F27B14/06 , F27B14/14 , F27D1/12 , F27D3/12 , F27D7/06 , F27D11/10 , F27D19/00 , F27D21/00 , F27B14/00 , F27B14/08
CPC classification number: B22D17/10 , B22D17/14 , B22D17/2023 , B22D17/32 , B22D27/15 , F27B3/06 , F27B3/085 , F27B3/24 , F27B14/04 , F27B14/06 , F27B14/14 , F27B2014/002 , F27B2014/045 , F27B2014/068 , F27B2014/0837 , F27B2014/0887 , F27D1/12 , F27D3/12 , F27D7/06 , F27D11/10 , F27D19/00 , F27D21/0035 , F27D2007/066
Abstract: A metal forming apparatus includes a smelting device, a molding device, an injection device and a vacuumizing device. The smelting device defines a smelting chamber, and includes a rotatable crucible and a heating unit both disposed within the smelting chamber. The molding device defines a molding chamber sealedly communicated with the smelting chamber. The injection device includes a charging barrel assembly sealedly disposed at a joint between the molding device and the smelting device and an injection unit sealedly connected with the smelting device. The vacuumizing device is sealedly connected with the smelting device and the molding device respectively so as to vacuumize the smelting chamber and the molding chamber.
-
公开(公告)号:US09862131B2
公开(公告)日:2018-01-09
申请号:US14466853
申请日:2014-08-22
Applicant: BYD COMPANY LIMITED , SHENZHEN BYD AUTO R&D COMPANY LIMITED
Inventor: Qing Gong , Xiong Zhang , Yihu Zhang , Wei Zhou
IPC: B32B5/18 , B29C45/14 , B32B15/08 , B32B27/28 , B32B27/32 , B32B27/34 , C25D11/08 , C25D11/16 , C25D11/24 , C25D11/18 , B29K71/00 , B29K105/00 , B29K705/02 , B29L9/00
CPC classification number: B29C45/14795 , B29C45/14311 , B29C45/14778 , B29C2045/14803 , B29C2045/14868 , B29K2071/12 , B29K2105/0067 , B29K2105/0088 , B29K2705/02 , B29K2715/003 , B29K2995/0097 , B29L2009/003 , B32B15/08 , B32B27/28 , B32B27/32 , B32B27/34 , B32B2270/00 , C25D11/08 , C25D11/16 , C25D11/18 , C25D11/24 , C25D11/246 , Y10T428/24997
Abstract: A method for integrally molding a metal and a resin and a metal-resin composite structure obtainable by the same are provided. The method comprises forming a nanopore in a surface of a metal sheet; melting a thermoplastic resin on the surface of the metal sheet formed with the nanopore; and injection molding the thermoplastic resin onto the surface of the metal sheet. The thermoplastic resin is a mixture of a main resin and a polyolefin resin, the main resin is a mixture of polyphenylene oxide and a polyamide, and the polyolefin resin has a melting point of about 65° C. to about 105° C.
-
公开(公告)号:US11382216B2
公开(公告)日:2022-07-05
申请号:US16274103
申请日:2019-02-12
Applicant: BYD COMPANY LIMITED
Inventor: Qing Gong , Xinping Lin , Yongpeng Ren , Baoxiang Zhang
IPC: H05K3/18 , C04B41/88 , C04B41/00 , C04B41/51 , C23C18/06 , C23C18/12 , C23C18/16 , H05K1/03 , C04B111/00
Abstract: A method for selectively metallizing a surface of a ceramic substrate, a ceramic product and use of the ceramic product are provided. The method comprises steps of: A) molding and sintering a ceramic composition to obtain the ceramic substrate, in which the ceramic composition comprises a ceramic powder and a functional powder dispersed in the ceramic powder; the ceramic powder is at least one selected from a group consisting of an oxide of E, a nitride of E, a oxynitride of E, and a carbide of E; E at least one selected from a group consisting of Li, Na, K, Rb, Cs, Be, Mg, Ca, Sr, Ba, B, Al, Ga, Si, Ge, P, As, Sc, Y, Zr, Hf, is and lanthanide elements; the functional powder is at least one selected from a group consisting of an oxide of M, a nitride of M, a oxynitride of M, a carbide of M, and a simple substance of M; and M is at least one selected from a group consisting of Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Nb, Mo, Tc, Ru, Rh, Pd, Ag, Cd, Ta, W, Re, Os, Ir, Pt, Au, In, Sn, Sb, Pb, Bi, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu; B) radiating a predetermined region of the surface of the ceramic substrate using an energy beam to form a chemical plating active center on the predetermined region of the surface of the ceramic substrate; and C) performing chemical plating on the ceramic substrate formed with the chemical plating active center to form a metal layer on the predetermined region of the surface of the ceramic substrate.
-
公开(公告)号:US10532949B2
公开(公告)日:2020-01-14
申请号:US15775104
申请日:2016-11-23
Applicant: BYD COMPANY LIMITED
Inventor: Qing Gong , Xinping Lin , Ge Chen , Bo Wu
IPC: C04B35/488 , C04B35/64 , C04B35/48 , C04B35/626
Abstract: A Zr-based composite ceramic material, a preparation method thereof and a shell or a decoration are provided. The Zr-based composite ceramic material includes a zirconia matrix and a cubic SrxNbO3 stable phase dispersed within the zirconia matrix, where 0.7≤x≤0.95.
-
公开(公告)号:US10138557B2
公开(公告)日:2018-11-27
申请号:US15217681
申请日:2016-07-22
Applicant: BYD COMPANY LIMITED
Inventor: Qing Gong , Wei Zhou , Yongliang Sun
IPC: B05D3/00 , C08J7/18 , G21H5/00 , C23C18/18 , C23C18/16 , C23C18/20 , C23C18/40 , C08K3/20 , C23C18/36 , C23C18/54 , C08K3/22
Abstract: A method for metalizing a polymer substrate and a polymer article prepared thereof. First a polymer substrate having a base polymer and at least one metal compound dispersed in the base polymer is provided. A surface of the polymer substrate is then irradiated with an energy beam such that a water contact angle of the surface of the polymer substrate is at least 120°. And then the surface of the polymer substrate is subjected to chemical plating.
-
10.
公开(公告)号:US09879880B2
公开(公告)日:2018-01-30
申请号:US14260465
申请日:2014-04-24
Applicant: SHENZHEN BYD AUTO R&D COMPANY LIMITED , BYD COMPANY LIMITED
Inventor: Qing Gong , Xinping Lin , Maolin Ren , Xiaofang Li , Tianyou Deng , Shumin Wang , Hui Wu , Mengxiang Wu , Hongmei Qiu , Huaitong Wen , Weifeng Zhang
CPC classification number: F24H3/0405 , B60H1/00471 , B60H1/2225 , B60H2001/2287 , F24H3/0435 , F24H9/0063 , F24H9/0073 , F24H9/1872 , F24H9/2071 , H05B3/04 , H05B3/50 , H05B2203/02 , H05B2203/023
Abstract: An electric heater, and an apparatus, a heating and air conditioning system and a vehicle, each comprising the electric heater, are provided. The electric heater comprises an outer frame; a heating core configured to connect to a power source and disposed within the outer frame; and a sealing-waterproof glue member disposed within the outer frame and configured to encase at least one end of the heating core. The heating core further comprises: a plurality of heat dissipating components and heating components arranged alternately, and each of the heat dissipating component is coupled with a heating component via a thermal conductor. Each of the heating components further comprises a core tube and a positive temperature coefficient thermistor disposed in the core tube.
-
-
-
-
-
-
-
-
-