公开(公告)号：US20210202422A1

公开(公告)日：2021-07-01

申请号：US16910461

申请日：2020-06-24

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Hsin-Hao Huang ,  Wen-Fu Chou ,  Gwo-Shyan Sheu

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/538

Abstract: A flip chip interconnection includes a circuit board, a chip and a solder layer. The chip is mounted on an inner bonding area of the circuit board, the solder layer is located between the circuit board and the chip for bonding bumps to inner leads and a T-shaped circuit unit on the inner bonding area. The T-shaped circuit unit has a main part, a connection part and a branch part, the connection part is connected to the main and branch parts, respectively. The main part extends along a lateral direction and the branch part extends outwardly along a longitudinal direction. The connection part is narrower than the main part in width so as to prevent solder short caused by solder overflow on the branch part.

公开(公告)号：US20250157970A1

公开(公告)日：2025-05-15

申请号：US18932755

申请日：2024-10-31

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Kung-Tzu Tu ,  Gwo-Shyan Sheu ,  Hsin-Hao Huang ,  Kuo-Liang Huang ,  Pei-Wen Wang ,  Yu-Chen Ma

IPC: H01L23/00 ,  H01L23/498

Abstract: A flip chip structure includes a circuit board and a chip. The circuit board includes first inner leads and second inner leads, each of the first inner leads has a first bonding portion, each of the second inner leads has a second bonding portion and a connecting segment. An included angle exists between the second bonding portion and the connecting segment, and an included angle exists between center lines of the first and second bonding portions. The chip includes first bumps and second bumps, and an included angle exists between center lines of the first and second bumps. Each of the first bumps is bonded to the first bonding portion, and each of the second bumps is bonded to the second bonding portion and the connecting segment to avoid bonding shift between the inner leads and the bumps or lessen bonding shift.

公开(公告)号：US11812554B2

公开(公告)日：2023-11-07

申请号：US17227458

申请日：2021-04-12

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Hsin-Hao Huang ,  Wen-Fu Chou ,  Gwo-Shyan Sheu

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/118 ,  H05K1/189 ,  H05K2201/0979 ,  H05K2201/09445 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate. The chip is mounted on the chip mounting area, a space exists between a first bump and a second bump of the chip, and there are no additional bumps between the first and second bumps. A first inner lead, a second inner lead, a first dummy lead and a second dummy lead of the circuit layer are located on the chip mounting area. The first and second inner leads are electrically connected to the first and second bumps respectively. The first dummy lead is connected to the first inner lead and adjacent to the first bump, and the second dummy lead is connected to the second inner lead and adjacent to the second bump.

公开(公告)号：US20210204401A1

公开(公告)日：2021-07-01

申请号：US16914861

申请日：2020-06-29

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Hsin-Hao Huang ,  Wen-Fu Chou ,  Gwo-Shyan Sheu

IPC: H05K1/02

Abstract: A flexible circuit board includes a flexible substrate and a stiffening structure, a stiffening area is defined on a bottom surface of the flexible substrate, and the stiffening structure includes a first stiffener and a second stiffener. The first stiffener is disposed on the stiffening area of the bottom surface and the second stiffener is disposed on the first stiffener such that the first stiffener is located between the flexible substrate and the second stiffener. The flexible substrate is protected from punch damage caused by stress concentrations because a cutting line of the flexible substrate only passes through the first stiffener.

公开(公告)号：US20240389224A1

公开(公告)日：2024-11-21

申请号：US18544631

申请日：2023-12-19

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Kung-Tzu Tu ,  Gwo-Shyan Sheu ,  Kuo-Liang Huang ,  Pei-Wen Wang ,  Yu-Chen Ma ,  Chia-Hsin Yen

IPC: H05K1/02

Abstract: A thin film circuit board includes a substrate and a thermal conductive film which is adhered to the substrate and includes a first conductive portion, a second conductive portion and a third conductive portion. The thermal conductive film is designed to be polygonal and non-rectangular in order to reduce stress generated in the substrate and the thermal conductive film and protect the thin film circuit board from warpage.

公开(公告)号：US20240074041A1

公开(公告)日：2024-02-29

申请号：US18234642

申请日：2023-08-16

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Gwo-Shyan Sheu ,  Kuo-Liang Huang ,  Hsin-Hao Huang ,  Pei-Wen Wang ,  Yu-Chen Ma

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0268 ,  H05K1/111

Abstract: A circuit board includes a substrate and a metallic layer. A first area and at least one second area are defined on a portion of the substrate, the second area is located outside the first area. The metallic layer includes first test lines disposed on the first area and second test lines disposed on the second area. A first test pad of each of the first test lines has a first width, and a second test pad of each of the second test lines has a second width. The second width is greater than the first width such that probes of an electrical testing tool can contact the first and second test pads on the circuit board correctly during electrical testing.

公开(公告)号：US20230163061A1

公开(公告)日：2023-05-25

申请号：US17975692

申请日：2022-10-28

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Pei-Wen Wang ,  Hsin-Hao Huang ,  Gwo-Shyan Sheu

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/32 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L24/73 ,  H01L2224/26175

Abstract: In a semiconductor package, flow guiding strips are provided on a guiding area of a flexible substrate to separate a chip and the flexible substrate such that a filling material flowing between the chip and the flexible substrate can squeeze out the air between the chip and the flexible substrate to improve the reliability of the semiconductor package.

公开(公告)号：US11606860B2

公开(公告)日：2023-03-14

申请号：US17504635

申请日：2021-10-19

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Gwo-Shyan Sheu ,  Hsin-Hao Huang ,  Yu-Chen Ma ,  Chia-Hsin Yen

IPC: H05K1/02 ,  H05K1/18

Abstract: A flexible circuit board includes a flexible substrate, a chip and a patterned circuit layer. A surface of the flexible substrate is separated into a working area and a nonworking area according to a cutting line. The chip is disposed on the working area. The patterned circuit layer is disposed on the surface and includes signal transmission wires and bypass wires, the bypass wires are not electrically connected to the chip. Each of the bypass wires includes a bypass transmission portion located on the working area and an anti-peeling portion located on the nonworking area. A blank area exists between the anti-peeling area and the bypass transmission portion, and the cutting line passes through the blank area. A distance between 100 um and 400 um exists from the anti-peeling portion to the cutting line.

公开(公告)号：US11322437B2

公开(公告)日：2022-05-03

申请号：US17038237

申请日：2020-09-30

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Hsin-Hao Huang ,  Wen-Fu Chou ,  Gwo-Shyan Sheu

IPC: H01L23/498 ,  H01L23/00

Abstract: A flip chip interconnection including a circuit board is disclosed. The circuit board includes a substrate, inner leads, a T-shaped circuit line and a dummy pattern. The inner leads, the T-shaped circuit line and the dummy pattern are located on an inner bonding area of the substrate. The T-shaped circuit line includes a main segment, a branch segment and a connection segment that is connected to the main segment and the branch segment. The main segment and the branch segment are extended along a lateral direction and a longitudinal direction, respectively. The dummy pattern is located between the connection segment and the inner leads.

公开(公告)号：US20250159801A1

公开(公告)日：2025-05-15

申请号：US18910291

申请日：2024-10-09

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Kung-Tzu Tu ,  Gwo-Shyan Sheu ,  Hsin-Hao Huang ,  Kuo-Liang Huang ,  Pei-Wen Wang ,  Yu-Chen Ma

IPC: H05K1/03 ,  H05K1/18

Abstract: A flexible circuit board includes a flexible substrate, a first circuit and a second circuit. The first circuit is provided on a first area defined on the top surface and includes a first input terminal and a first output terminal. The first input terminal is adjacent to a bottom side of the top surface and the first output terminal is adjacent to a top side of the top surface. The second circuit is provided on a second area defined on the top surface and includes a second input terminal and a second output terminal. The second input terminal is adjacent to the top side of the top surface and the second output terminal is adjacent to the bottom side of the top surface.