公开(公告)号：US11812554B2

公开(公告)日：2023-11-07

申请号：US17227458

申请日：2021-04-12

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Hsin-Hao Huang ,  Wen-Fu Chou ,  Gwo-Shyan Sheu

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/118 ,  H05K1/189 ,  H05K2201/0979 ,  H05K2201/09445 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate. The chip is mounted on the chip mounting area, a space exists between a first bump and a second bump of the chip, and there are no additional bumps between the first and second bumps. A first inner lead, a second inner lead, a first dummy lead and a second dummy lead of the circuit layer are located on the chip mounting area. The first and second inner leads are electrically connected to the first and second bumps respectively. The first dummy lead is connected to the first inner lead and adjacent to the first bump, and the second dummy lead is connected to the second inner lead and adjacent to the second bump.

公开(公告)号：US20210204401A1

公开(公告)日：2021-07-01

申请号：US16914861

申请日：2020-06-29

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Hsin-Hao Huang ,  Wen-Fu Chou ,  Gwo-Shyan Sheu

IPC: H05K1/02

Abstract: A flexible circuit board includes a flexible substrate and a stiffening structure, a stiffening area is defined on a bottom surface of the flexible substrate, and the stiffening structure includes a first stiffener and a second stiffener. The first stiffener is disposed on the stiffening area of the bottom surface and the second stiffener is disposed on the first stiffener such that the first stiffener is located between the flexible substrate and the second stiffener. The flexible substrate is protected from punch damage caused by stress concentrations because a cutting line of the flexible substrate only passes through the first stiffener.

公开(公告)号：US11350518B2

公开(公告)日：2022-05-31

申请号：US16927059

申请日：2020-07-13

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chia-Sung Lin ,  Huan-Kai Chou ,  Chia-Hsin Yen ,  Wen-Fu Chou

IPC: H05K3/30 ,  H05K1/02 ,  H05K13/04

Abstract: In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.

公开(公告)号：US20210202422A1

公开(公告)日：2021-07-01

申请号：US16910461

申请日：2020-06-24

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Hsin-Hao Huang ,  Wen-Fu Chou ,  Gwo-Shyan Sheu

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/538

Abstract: A flip chip interconnection includes a circuit board, a chip and a solder layer. The chip is mounted on an inner bonding area of the circuit board, the solder layer is located between the circuit board and the chip for bonding bumps to inner leads and a T-shaped circuit unit on the inner bonding area. The T-shaped circuit unit has a main part, a connection part and a branch part, the connection part is connected to the main and branch parts, respectively. The main part extends along a lateral direction and the branch part extends outwardly along a longitudinal direction. The connection part is narrower than the main part in width so as to prevent solder short caused by solder overflow on the branch part.

公开(公告)号：US11322437B2

公开(公告)日：2022-05-03

申请号：US17038237

申请日：2020-09-30

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Hsin-Hao Huang ,  Wen-Fu Chou ,  Gwo-Shyan Sheu

IPC: H01L23/498 ,  H01L23/00

Abstract: A flip chip interconnection including a circuit board is disclosed. The circuit board includes a substrate, inner leads, a T-shaped circuit line and a dummy pattern. The inner leads, the T-shaped circuit line and the dummy pattern are located on an inner bonding area of the substrate. The T-shaped circuit line includes a main segment, a branch segment and a connection segment that is connected to the main segment and the branch segment. The main segment and the branch segment are extended along a lateral direction and a longitudinal direction, respectively. The dummy pattern is located between the connection segment and the inner leads.

公开(公告)号：US11309238B2

公开(公告)日：2022-04-19

申请号：US17227470

申请日：2021-04-12

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Hsin-Hao Huang ,  Wen-Fu Chou ,  Gwo-Shyan Sheu

IPC: H05K1/18 ,  H01L23/498 ,  H01L23/00

Abstract: A layout structure of flexible circuit board includes a flexible substrate, a chip and a circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate, the circuit area surrounds the chip mounting area. The chip is mounted on the chip mounting area of the top surface and includes a bump. The circuit layer is disposed on the top surface. A connection portion of the circuit layer extends across a first side of the chip mounting area and into the chip mounting area. A transmission portion of the circuit layer is located on the circuit area and electrically connected to the connection portion. A stress release portion of the circuit layer is located between the transmission portion and a second side of the chip mounting area and is a comb-shaped structure.

公开(公告)号：US20210227679A1

公开(公告)日：2021-07-22

申请号：US16927059

申请日：2020-07-13

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chia-Sung Lin ,  Huan-Kai Chou ,  Chia-Hsin Yen ,  Wen-Fu Chou

IPC: H05K1/02 ,  H05K3/30

Abstract: In a method of heat sink attachment, a heat-sink tape includes a plurality of heat sinks and a flexible carrier, and a holder is provided to allow the heat sinks on the moving heat-sink tape to peel from the flexible carrier and attach to a heat-sink mounting area of a moving circuit tape automatically and successively.

公开(公告)号：US10999928B1

公开(公告)日：2021-05-04

申请号：US16914844

申请日：2020-06-29

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Hsin-Hao Huang ,  Wen-Fu Chou ,  Gwo-Shyan Sheu

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/03

Abstract: A circuit board electrically connected to a chip includes a substrate and a circuit layer. A first conductive line of the circuit layer includes a main line and a branch lead connected with each other. The branch lead provided to increase lead quantity for bonding with the chip includes an extension part and a bonding part which is used for bonding a bump of the chip. During thermal compression, gaps existing between the extension part and the main line and between the bonding part and the main line can prevent solder on the main line from flowing toward the bump and overflowing from the branch lead.

公开(公告)号：US10993319B1

公开(公告)日：2021-04-27

申请号：US16939243

申请日：2020-07-27

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Hsin-Hao Huang ,  Wen-Fu Chou ,  Gwo-Shyan Sheu

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/28

Abstract: A chip package includes a circuit board, a chip and an underfill. A solder resist layer formed on the circuit board is modified in edge profile so as to reduce required amount of the underfill. The fewer underfill is still enough to be filled between the circuit board and the chip, and still can cover circuit lines that are not covered by the solder resist layer to protect the circuit lines from oxidation.

公开(公告)号：US11581283B2

公开(公告)日：2023-02-14

申请号：US16910461

申请日：2020-06-24

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Yu-Chen Ma ,  Hsin-Hao Huang ,  Wen-Fu Chou ,  Gwo-Shyan Sheu

IPC: H01L23/00 ,  H01L23/538 ,  H01L23/498

Abstract: A flip chip package includes a circuit board, a chip and a solder layer. The chip is mounted on an inner bonding area of the circuit board. The solder layer is located between the circuit board and the chip for bonding bumps to inner leads and a T-shaped circuit unit is on the inner bonding area. The T-shaped circuit unit has a main part, a connection part, and a branch part. The connection part is connected to the main and branch parts, respectively. The main part extends along a lateral direction and the branch part extends outwardly along a longitudinal direction. The connection part is narrower than the main part in width so as to inhibit solder shorts caused by solder overflow on the branch part.