公开(公告)号：US20190186037A1

公开(公告)日：2019-06-20

申请号：US15867878

申请日：2018-01-11

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Cheng-Hung Shih ,  Tsuo-Yun Chu ,  Xin-Wei Lo ,  Nian-Cih Yang

IPC: C25D21/04 ,  C25D17/06 ,  C25D5/08

Abstract: An electroplating system for depositing a plating material on an object includes a pressure device and an anode element. The pressure device includes a lid having first and second through holes and a base having a chamber, conduction holes and third through holes located in the chamber. Each of the conduction tubes includes a conduction hole connecting to one of the third through holes. The lid covers the chamber, the first through holes communicate with the chamber for spraying an electroplating solution toward the object and the second through holes reveal the conduction holes. A passage of electric force line is formed in the connected holes and the third through holes filled with the electroplating solution, and the anode element is located outside the passage of electric force line. The electroplating system can prevent defective plating and enhance plating efficiency.

公开(公告)号：US10808331B2

公开(公告)日：2020-10-20

申请号：US15867878

申请日：2018-01-11

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Cheng-Hung Shih ,  Tsuo-Yun Chu ,  Xin-Wei Lo ,  Nian-Cih Yang

IPC: C25D21/04 ,  C25D17/00 ,  C25D21/10 ,  C25D17/06 ,  C25D5/08

Abstract: An electroplating system for depositing a plating material on an object includes a pressure device and an anode element. The pressure device includes a lid having first and second through holes and a base having a chamber, conduction holes and third through holes located in the chamber. Each of the conduction tubes includes a conduction hole connecting to one of the third through holes. The lid covers the chamber, the first through holes communicate with the chamber for spraying an electroplating solution toward the object and the second through holes reveal the conduction holes. A passage of electric force line is formed in the connected holes and the third through holes filled with the electroplating solution, and the anode element is located outside the passage of electric force line. The electroplating system can prevent defective plating and enhance plating efficiency.

公开(公告)号：US10168582B1

公开(公告)日：2019-01-01

申请号：US15841424

申请日：2017-12-14

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chun-Yang Su ,  Jhao-Shin Wang ,  Nian-Cih Yang ,  Xin-Wei Lo

IPC: H01L23/495 ,  G02F1/1339 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498

Abstract: A chip package includes a flexible substrate, a chip, a pressure-proof member and a reinforcement sheet. The chip and the pressure-proof member are located on a first surface of the flexible substrate, and the reinforcement sheet is located on a second surface of the flexible substrate. The pressure-proof member at least includes a pair of pressure-proof ribs which are located outside of the chip oppositely. The pressure-proof ribs located outside the chip can protect the chip from the damage caused by the pressure of other component (e.g. curved panel) except the chip package.