Multispectral sensing system and method

    公开(公告)号:US10444415B2

    公开(公告)日:2019-10-15

    申请号:US15432629

    申请日:2017-02-14

    Abstract: A multispectral sensing device is disclosed. The sensing device may comprise an array of pixel units. Each of the pixel units may comprise four pixels in a two by two configuration. Each of the pixels may comprise a plurality of sub-pixels. Each of the pixel units may include at least one pixel that includes at least two sub-pixels configured to detect light of different wavelengths.

    Back side illuminated CMOS image sensor arrays

    公开(公告)号:US10741602B2

    公开(公告)日:2020-08-11

    申请号:US15833553

    申请日:2017-12-06

    Abstract: An image sensor including at least one pixel for collecting charge in its photodiode is provided. The image sensor comprises: a substrate having a first surface on a front side and a second surface on a back side, a photodetector formed in the silicon substrate and having a light-receiving surface on the second surface, and a first layer with positive charges disposed on the second surface, the first layer being configured to form an electron accumulation region at the light-receiving surface of the photodetector for suppressing a dark current at a back side interface of the image sensor. A method for fabricating an image sensor including a first layer with positive charges is also provided.

    Multispectral sensing system and method

    公开(公告)号:US10698142B2

    公开(公告)日:2020-06-30

    申请号:US16555505

    申请日:2019-08-29

    Abstract: A multispectral sensing device is disclosed. The sensing device may comprise an array of pixel units. Each of the pixel units may comprise four pixels in a two by two configuration. Each of the pixels may comprise a plurality of sub-pixels. Each of the pixel units may include at least one pixel that includes at least two sub-pixels configured to detect light of different wavelengths.

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