Pedicle Screw Assembly and Dynamic Spinal Stabilization Devices Incorporating the Pedicle Screw Assembly
    1.
    发明申请
    Pedicle Screw Assembly and Dynamic Spinal Stabilization Devices Incorporating the Pedicle Screw Assembly 有权
    并入椎弓根螺钉组件的椎弓根螺钉组件和动态脊柱稳定装置

    公开(公告)号:US20160106476A1

    公开(公告)日:2016-04-21

    申请号:US14977063

    申请日:2015-12-21

    Abstract: A dynamic spinal stabilization device for the treatment of high-grade spinal disorders is disclosed herein. The dynamic spinal stabilization device includes two or more screw assemblies, each of which include a pedicle screw and a head socket containing a curved internal track that limits the range of motion and center of rotation of the spinal segments stabilized using the device to the physiological levels of a nondegraded spinal segment.

    Abstract translation: 本文公开了一种用于治疗高级脊柱疾病的动态脊柱稳定装置。 动态脊柱稳定装置包括两个或更多个螺钉组件,每个螺钉组件包括椎弓根螺钉和头部插座,其包含弯曲的内部轨道,其将使用该装置稳定的脊柱段的运动范围和旋转中心限制到生理水平 的非降解脊髓段。

    Implant for repairing spinal annular defect, method of fabricating the implant, and method of repairing the defect using the implant

    公开(公告)号:US12171670B2

    公开(公告)日:2024-12-24

    申请号:US18030462

    申请日:2021-10-05

    Abstract: A biocompatible implant, as well as method of fabricating the implant and repairing an annular defect in annulus fibrosus (AF) of an intervertebral disc (IVD) disposed in a functional spinal unit (FSU), includes an insert that provides faces that can interface with the defect to repair or treat the AF. The implant can deliver biological and mechanical factors to enhance healing in an annular defect and prevent recurrence of herniation symptoms. The implant can be fabricated using a hybrid of first fibrous scaffold structure including at least a first layer and a second layer of first fibers fabricated via three-dimensional fiber deposition (3FD) and second fibrous scaffold structure including a third layer and a fourth layer of second fibers formed via melt electrowriting (MEW). Suitable attachment methods, including bio-adhesives can be used to bond the implant to the IVD and/or FSU.

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