公开(公告)号：US10444807B2

公开(公告)日：2019-10-15

申请号：US14939339

申请日：2015-11-12

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Pei-Chiang Lin ,  Yu-Te Wei

IPC: G06F1/20 ,  H05K7/20

Abstract: A heat sink assembly and a fan and a fan module thereof, the heat sink assembly includes a heat sink (1), a heat sink rack and a fan module. The fan module includes a fan rack (3) and a fan (4). The heat sink rack is installed on the heat sink (1). The heat sink rack includes a first sliding portion (200), and the fan rack (3) or the fan (4) includes a second sliding portion (31). The first sliding portion (31) is configured corresponding to the first sliding portion (200) with a slidable cooperation in order to allow the fan rack (3) or the fan (4) to use the cooperation between the first sliding portion (200) and the second sliding portion (31) to slide in a predefined direction.

公开(公告)号：US11314295B2

公开(公告)日：2022-04-26

申请号：US16866986

申请日：2020-05-05

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Yu-Te Wei

IPC: G06F1/20 ,  F28D15/00 ,  F28D20/00 ,  H01L23/473 ,  F04B23/02 ,  H05K7/20

Abstract: A pressurized infusion device and a liquid cooling system are disclosed. The pressurized infusion device includes a liquid storage tank and a pump. The liquid storage tank has a first end and a second end opposite to the first end. The first end has a first connecting structure, and the second end has a second connecting structure. The pump is connected with the first end of the liquid storage tank and has a third connecting structure, a first connecting port, a second connecting port, a third connecting port and a fourth connecting port. The third connecting structure corresponds to the first connecting structure. A pump flow channel from the first connecting port to the second connecting port is formed inside the pump, and a bypass flow channel from the third connecting port to the fourth connecting port is also formed inside the pump.

公开(公告)号：US10790215B1

公开(公告)日：2020-09-29

申请号：US16591452

申请日：2019-10-02

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Yu-Te Wei ,  Di Han Wu

IPC: H01L23/40 ,  H05K7/20 ,  H01L23/427 ,  F28D1/02 ,  F28D15/02

Abstract: This disclosure provides a heat dissipation device configured to be in thermal contact with a heat source of a circuit board and including a main body part and an engagement assembly. The main body part includes a thermally conductive component and at least one fin assembly. The thermally conductive component is configured to be in thermal contact with the heat source, and the at least one fin assembly is thermally coupled to the thermally conductive component. The engagement assembly includes at least one first cover and at least one fastener. The at least one first cover presses against a side of the at least one fin assembly that is located away from the heat source. The at least one fastener is disposed through the at least one first cover and the at least one fin assembly and is configured to be fixed to the circuit board.

公开(公告)号：US10739829B2

公开(公告)日：2020-08-11

申请号：US15332458

申请日：2016-10-24

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Yu-Te Wei

IPC: G06F1/20 ,  F28D15/00 ,  F28D20/00 ,  H01L23/473 ,  F04B23/02 ,  H05K7/20

Abstract: A pressurized infusion device and a liquid cooling system are disclosed. The pressurized infusion device includes a liquid storage tank and a pump. The liquid storage tank has a first end and a second end opposite to the first end. The first end has a first connecting structure, and the second end has a second connecting structure. The pump is connected with the first end of the liquid storage tank and has a third connecting structure, a first connecting port, a second connecting port, a third connecting port and a fourth connecting port. The third connecting structure corresponds to the first connecting structure. A pump flow channel from the first connecting port to the second connecting port is formed inside the pump, and a bypass flow channel from the third connecting port to the fourth connecting port is also formed inside the pump.

公开(公告)号：US10966347B2

公开(公告)日：2021-03-30

申请号：US15878053

申请日：2018-01-23

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Yu-Te Wei ,  Shui-Fa Tsai

IPC: F16L27/08 ,  H05K7/20 ,  G06F1/20 ,  F28F9/26 ,  H01L23/473

Abstract: A liquid cooling device includes body. The body has liquid inlet and liquid outlet. The liquid outlet has first internal thread on its inner wall. The liquid inlet has second internal thread on its inner wall. Another liquid cooling device has body, first thread adapter and second thread adapter. The first thread adapter is movably disposed on the liquid outlet, and has a first internal thread on its inner wall. The second thread adapter is movably disposed on the liquid inlet, and has a second internal thread on its inner wall. Still another liquid cooling device has a body. The body has a liquid passage. The liquid passage has internal thread on its inner wall. Yet another liquid cooling device has body and thread adapter. The body has a liquid passage. The thread adapter is movably disposed on the liquid passage, and has internal thread on its inner wall.

公开(公告)号：US10772235B2

公开(公告)日：2020-09-08

申请号：US15622944

申请日：2017-06-14

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Yu-Te Wei

IPC: H05K7/20 ,  F28D15/02 ,  H01L23/367 ,  H01L23/427 ,  B23P15/26 ,  F28F21/08 ,  G06F1/20

Abstract: A heat sink and its manufacturing method. The heat sink includes a base and plural heat pipes. The base has a first surface, plural parallel heated areas concavely formed on the first surface, a protrusion disposed between any two heated areas and protruding in a direction towards the first surface, and at least one notch formed on each protrusion. A first protrusion portion and a second protrusion portion are formed at the top of the protrusion and the top of notch respectively. The heat pipes are embedded into the heated areas respectively in the lengthwise direction, and the heat pipes at the notches of the protrusions are attached and in contact with each other. The notch of each heat pipe may be compressed and deformed, so that the heat pipes are in contact with each other.

公开(公告)号：US10107568B2

公开(公告)日：2018-10-23

申请号：US15640559

申请日：2017-07-02

Applicant: COOLER MASTER TECHNOLOGY INC.

Inventor： Yu-Te Wei ,  Ling She

IPC: F28F7/00 ,  F28F9/007 ,  H01L23/40 ,  H05K1/02

Abstract: A back plate includes flat polygonal shaped body and locking assembly located at bottom surface of the flat polygonal shaped body. The locking assembly includes pivotal member, connecting member and protruding portion with connecting hole and locking hole. The connecting hole is located at a side of the locking hole. The locking hole is a curved hole with the connecting hole as a center. The pivotal member has hinge hole hinged with the connecting hole and a fixing hole matching with the locking hole, and the fixing hole is movable with respect to the locking hole with the hinge hole as a center. The connecting member is disposed through the fixing hole and the locking hole, and is connected to the seat. The connecting member is movable in the locking hole in order to make the fixing hole to move with respect to the locking hole.