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公开(公告)号：US20250019293A1
公开(公告)日：2025-01-16
申请号：US18706908
申请日：2022-10-28
Applicant: CORNING INCORPORATED
Inventor： Leonard Charles Dabich, II , Traci Nanette Harding , Cameron Robert Nelson , Mark Alejandro Quesada , William Allen Wood , Bin Zhu
Abstract: A glass article comprises a film layer deposited on a glass substrate. The film layer has a melting point less than 450° C. and comprises a thickness and a primary surface. The primary surface defines at least one elevated surface protruding relative to the at least one relief surface. The elevated surface forms a periodic pattern defined by an etch mask, and the relief surface is defined as an inverse pattern of the etch mask. The duration of an etching process applied to the film layer defines a ratio of a first area of the elevated surface to a second area of the relief surface.
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公开(公告)号：US20240427235A1
公开(公告)日：2024-12-26
申请号：US18746402
申请日：2024-06-18
Applicant: CORNING INCORPORATED
Inventor： Robert Alan Bellman , Leonard Charles Dabich, II , Barry James Paddock , Mark Alejandro Quesada , Bin Zhu
Abstract: A method of forming a nanopatterned substrate includes imprinting a deposited photoresist on a substrate with a stamp to form a nanopattern including nanofeatures on the substrate, the nanofeatures including a gap therebetween. The method includes performing glancing angle deposition of a metal on the nanopattern to deposit the metal on the nanofeatures. The method includes directionally etching the nanopattern including the metal in a direction normal to a surface of the nanopattern to remove the photoresist in the gap between the nanofeatures and to expose the substrate in the gap between the nanofeatures. The method includes depositing a deposition material on the directionally etched nanopattern such that the deposition material is deposited on the exposed substrate in the gap between the nanofeatures and on the metal that is on the nanofeatures. The method also includes dissolving the deposited photoresist including the deposited deposition material thereon to remove the photoresist, the metal, and portions of the deposited deposition material that are on the photoresist from the substrate, to form the nanopatterned substrate including the deposition material deposited on the substrate in the gap between the nanofeatures.
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公开(公告)号：US11993028B2
公开(公告)日：2024-05-28
申请号：US17258958
申请日：2019-06-24
Applicant: Corning Incorporated
Inventor： Heather Bossard Decker , Shandon Dee Hart , Yanfei Li , Joseph Edward McCarthy , David John McEnroe , Mark Alejandro Quesada
CPC classification number: B29C70/20 , C03C3/19 , C03C13/00 , B29K2079/085 , B29K2081/04 , B29K2081/06 , B29K2309/08 , C03C2213/00 , C08L81/06 , C08L93/00 , C08K3/04
Abstract: A composite has repeating domains of an inorganic glass and a polymer, such that the inorganic glass and the polymer each have a glass transition temperature (Tg) or softening temperature of less than 450° C., and at least 50% of the inorganic glass domains have a length of less than 30 μm as measured along at least one cross-sectional dimension.
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公开(公告)号：US11884574B2
公开(公告)日：2024-01-30
申请号：US18068784
申请日：2022-12-20
Applicant: CORNING INCORPORATED
Inventor： Leonard Charles Dabich, II , Shari Elizabeth Koval , Mark Alejandro Quesada , Paul Arthur Tick
CPC classification number: C03B37/005 , C03B37/01 , C03B37/055 , C03C3/247 , C03C8/06 , C03C8/08 , C03C8/24 , C03C13/00
Abstract: Disclosed herein are methods for forming low melting point glass fibers comprising providing a glass feedstock comprising a low melting point glass and melt-spinning the glass feedstock to produce glass fibers, wherein the glass transition temperature of the glass fibers is less than or equal to about 120% of the glass transition temperature of the glass feedstock. The disclosure also relates to method for forming low melting point glass frit further comprising jet-milling the glass fibers. Low melting point glass frit and fibers produced by the methods described above are also disclosed herein.
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公开(公告)号：US20230393310A1
公开(公告)日：2023-12-07
申请号：US18033152
申请日：2021-10-07
Applicant: CORNING INCORPORATED
Inventor： Naigeng Chen , Stephan Lvovich Logunov , Weiwei Luo , Mark Alejandro Quesada , Bo Yang
IPC: G02B3/14 , B23K26/57 , B23K26/324 , G02B26/00 , B23K31/12
CPC classification number: G02B3/14 , B23K26/57 , B23K2103/54 , G02B26/005 , B23K31/12 , B23K26/324
Abstract: A device comprising: a first substrate; and a second substrate bonded to the first substrate via an innermost bond, an outermost bond, and bonds between the innermost bond and the outermost bond, the second substrate comprising a through-hole and an axis extending through the through-hole. Each of the bonds has a strength, and the strength of the bonds increases sequentially from the innermost bond to the outermost bond. The strength of each bond is sufficiently low such that the bonds fail in response to liquid (within a cavity defined by the first substrate, a third substrate, and the through-hole of the second substrate) exerting pressure on the first substrate instead of the first substrate failing. Each of the bonds are configured to fail at approximately the same pressure exerted upon the first substrate by the liquid. Additionally disclosed is a method of manufacturing the device.
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Patent Agency Ranking
公开(公告)号：US20230124925A1
公开(公告)日：2023-04-20
申请号：US18068784
申请日：2022-12-20
Applicant: CORNING INCORPORATED
Inventor： Leonard Charles Dabich, II , Shari Elizabeth Koval , Mark Alejandro Quesada , Paul Arthur Tick
Abstract: Disclosed herein are methods for forming low melting point glass fibers comprising providing a glass feedstock comprising a low melting point glass and melt-spinning the glass feedstock to produce glass fibers, wherein the glass transition temperature of the glass fibers is less than or equal to about 120% of the glass transition temperature of the glass feedstock. The disclosure also relates to method for forming low melting point glass frit further comprising jet-milling the glass fibers. Low melting point glass frit and fibers produced by the methods described above are also disclosed herein.
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公开(公告)号：US11560328B2
公开(公告)日：2023-01-24
申请号：US15117954
申请日：2015-02-11
Applicant: Corning Incorporated
Inventor： Leonard Charles Dabich, II , Mark Alejandro Quesada , Shari Elizabeth Koval , Paul Arthur Tick
Abstract: Disclosed herein are methods for forming low melting point glass fibers comprising providing a glass feedstock comprising a low melting point glass and melt-spinning the glass feedstock to produce glass fibers, wherein the glass transition temperature of the glass fibers is less than or equal to about 120% of the glass transition temperature of the glass feedstock. The disclosure also relates to method for forming low melting point glass frit further comprising jet-milling the glass fibers. Low melting point glass frit and fibers produced by the methods described above are also disclosed herein.
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公开(公告)号：US11422310B2
公开(公告)日：2022-08-23
申请号：US16877859
申请日：2020-05-19
Applicant: CORNING INCORPORATED
Abstract: Methods for laser welding one or more optical fibers to a substrate and assemblies are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate having at least one film layer on a surface of the substrate includes directing a laser beam into the optical fiber disposed on the at least one film layer. The optical fiber has a curved surface that focuses the laser beam to a focused diameter. The method further includes melting, using the focused diameter laser beam, a material of the substrate to create a laser bond area between the optical fiber and the surface of the substrate. The laser bond area includes laser-melted material of the substrate that bonds the optical fiber to the substrate. The at least one film layer has an absorption of at least 15% at a wavelength of the focused diameter laser beam.
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公开(公告)号：US20210220947A1
公开(公告)日：2021-07-22
申请号：US16967568
申请日：2019-02-19
Applicant: CORNING INCORPORATED
Inventor： Michael Edward Badding , Leonard Charles Dabich, II , David Mark Lance , Stephan Lvovich Logunov , Mark Alejandro Quesada , Alexander Mikhailovich Streltsov
IPC: B23K26/211 , B23K26/57
Abstract: A laser-welded assembly of opposing sheets of ceramic and glass, ceramic, or glass-ceramic compositions comprises an intervening bonding layer having a thickness dimension that separates the opposing sheets by less than about 1000 nm. Each of the opposing sheets has a thickness dimension at least about 20 times the thickness dimension of the intervening bonding layer. The intervening bonding layer has a melting point greater than that of one or both of the opposing sheets. The ceramic sheet is a pass-through sheet with a composite T/R spectrum comprising a portion that lies below about 30% across a target irradiation band residing at or above about 1400 nm and at or below about 4500 nm wavelength. The intervening bonding layer has an absorption spectrum comprising a portion that lies above about 80% across the target irradiation band. The assembly comprises a weld bonding the opposing surfaces of the opposing sheets.
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公开(公告)号：US20200238437A1
公开(公告)日：2020-07-30
申请号：US15754975
申请日：2016-08-23
Applicant: Corning Incorporated
IPC: B23K26/0622 , H01L51/52 , B23K26/20 , B23K26/211 , B23K26/324
Abstract: A laser-welded, sealed electronic device housing and related systems and methods are provided. The sealed housing includes a first substrate having a first surface and a second substrate having a second surface facing the first surface. The sealed housing includes a recess formed in the first substrate. The recess faces the second surface such that the second surface and the recess define a chamber. A laser weld bonds the first surface to the second surface, and the laser weld surrounds the chamber. A functional film is supported by at least one of the first surface and the second surface, and the functional film extends from the chamber and across the laser weld. In exemplary arrangements the device is an OLED device and the functional film form conductive leads in communication with the OLED.
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