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公开(公告)号:US11685707B2
公开(公告)日:2023-06-27
申请号:US17415378
申请日:2019-12-20
Applicant: Cytec Industries Inc.
Inventor: Jonathan E. Meegan , Victor Maruani , Vincent Schanen , Paul Cross
IPC: C07C209/84
CPC classification number: C07C209/84
Abstract: The present invention is directed to a method for making a di(aminoaryl)fluorene compound that includes the steps of: (a) reacting a fluorenone compound according structure (I) with excess aminobenzene according to structure (II) wherein: each R1, R2, R3, R4, R12, and R13 is independently a group that is inert in the polymerization of epoxy compounds, and R11 is H or (C1-C6)alkyl, in the presence of an acid catalyst, in a liquid medium comprising an aromatic or substituted aromatic solvent having a boiling point of greater than or equal to 150° C. and in the presence of an acid catalyst, in a liquid medium comprising an aromatic or substituted aromatic solvent having a boiling point of greater than or equal to 150° C. and from which the di(aminoaryl)fluorene compound is crystallizable, to form a crude product mixture comprising the di(aminoaryl)fluorene compound, (b) crystallizing di(aminoaryl)fluorene compound in the product mixture, and (c) separating the product mixture into crystallized di(aminoaryl)fluorene compound and a filtrate.
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公开(公告)号:US10196479B2
公开(公告)日:2019-02-05
申请号:US15990058
申请日:2018-05-25
Applicant: CYTEC INDUSTRIES INC.
Inventor: Jonathan E. Meegan
Abstract: A method for producing a modified form of an aromatic amine compound represented by the following structure I: where A is an amine group —NHR, R is independently selected from hydrogen, linear and branched alkyl groups having 1 to 6 carbon atoms, preferably A is NH2; X is a halogen selected from Cl, Br, F, I, and At, or hydrogen (H). The method includes heating the aromatic amine compound, in its initial crystalline form, to a temperature above its melting point in order to obtain a molten material, then cooling the molten material to a temperature below the melting point of the crystalline compound so as to produce an amorphous, glassy form of the aromatic amine compound. The modified aromatic amine compound is suitable as a curing agent in resin compositions that are used for fabricating fiber-reinforced composites.
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公开(公告)号:US11111333B2
公开(公告)日:2021-09-07
申请号:US16169062
申请日:2018-10-24
Applicant: Cytec Industries Inc.
Inventor: Jonathan E. Meegan , Marco Aurilia
IPC: C08G59/38 , C08G59/50 , C08L63/00 , C08G59/32 , C08G59/26 , C08G59/18 , B29C70/48 , C08L63/04 , C08L9/06 , C08L51/04 , C08G59/22
Abstract: Curable epoxy resin compositions suitable for liquid resin infusion processes. In one embodiment, the resin composition contains (a) at least two polyepoxides, one of which is triglycidyl ether of tris(hydroxyphenyl)methane, (b) an aromatic amine curing agent, and (c) core-shell rubber particles. In another embodiment, the resin composition (a) at least two polyepoxides, one of which is diglycidyl ether of bis(hydroxyphenyl)fluorene, (b) an aromatic amine curing agent, and (c) core-shell rubber particles.
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公开(公告)号:US10682791B2
公开(公告)日:2020-06-16
申请号:US16276800
申请日:2019-02-15
Applicant: Cytec Industries Inc.
Inventor: Jonathan E. Meegan , Olivia Denman , Marco Aurilia
IPC: B32B27/38 , B32B27/26 , B32B27/20 , B32B27/18 , B32B27/04 , C08L63/00 , B29C35/02 , B29C45/00 , C08K3/01 , C08G59/50 , B29C45/14 , B29C45/72 , C08J5/24 , B29C45/02 , B29C70/44 , B29C70/48 , B29K63/00 , B29K105/08 , B29K105/16 , B29K409/06 , B29K509/08
Abstract: A curable composition for liquid resin infusion (LRI) and a manufacturing process for producing a molded article. The curable composition includes: a) no more than 5.0 wt % of a thermoplastic polymer; b) no more than 5.0 wt % of nano-sized core-shell particles; c) no more than 5.0 wt % of nano-sized inorganic particles; d) an epoxy resin component; and e) one or more amine curing agent(s), wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80° C. to about 130° C.
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公开(公告)号:US20180273677A1
公开(公告)日:2018-09-27
申请号:US15990058
申请日:2018-05-25
Applicant: CYTEC INDUSTRIES INC.
Inventor: Jonathan E. Meegan
IPC: C08G59/50 , C08K5/18 , C07C211/50 , C08J5/24
CPC classification number: C08G59/5033 , C07C211/50 , C08J5/24 , C08J2363/00 , C08K5/18
Abstract: A method for producing a modified form of an aromatic amine compound represented by the following structure I: where A is an amine group —NHR, R is independently selected from hydrogen, linear and branched alkyl groups having 1 to 6 carbon atoms, preferably A is NH2; X is a halogen selected from Cl, Br, F, I, and At, or hydrogen (H). The method includes heating the aromatic amine compound, in its initial crystalline form, to a temperature above its melting point in order to obtain a molten material, then cooling the molten material to a temperature below the melting point of the crystalline compound so as to produce an amorphous, glassy form of the aromatic amine compound. The modified aromatic amine compound is suitable as a curing agent in resin compositions that are used for fabricating fiber-reinforced composites.
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公开(公告)号:US10245764B2
公开(公告)日:2019-04-02
申请号:US14970159
申请日:2015-12-15
Applicant: Cytec Industries Inc.
Inventor: Jonathan E. Meegan , Olivia Denman , Marco Aurilia
IPC: C08J5/24 , B29C35/02 , B29C45/02 , C08L63/00 , B29C45/00 , C08K3/01 , B29C45/14 , B29C45/72 , C08G59/50 , B32B27/04 , B32B27/18 , B32B27/20 , B32B27/26 , B32B27/38 , B29K63/00 , B29K105/08 , B29K105/16 , B29K409/06 , B29K509/08 , B29C70/44 , B29C70/48
Abstract: A curable composition for liquid resin infusion (LRI) and a manufacturing process for producing a molded article. The curable composition includes: a) no more than 5.0 wt % of a thermoplastic polymer; b) no more than 5.0 wt % of nano-sized core-shell particles; c) no more than 5.0 wt % of nano-sized inorganic particles; d) an epoxy resin component; and e) one or more amine curing agent(s), wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80° C. to about 130° C.
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