公开(公告)号：US11565825B2

公开(公告)日：2023-01-31

申请号：US17306581

申请日：2021-05-03

Applicant: CYTEC INDUSTRIES INC.

Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli ,  Kevin R. Mullery

IPC: B32B5/24 ,  B32B5/28 ,  B32B27/06 ,  B32B27/08 ,  B32B27/12 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  B32B37/24 ,  B32B38/08 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K3/07 ,  H05K3/14 ,  G21F1/00 ,  B64D45/02 ,  B32B5/02 ,  B32B9/00 ,  B32B9/04 ,  B32B15/08 ,  B32B15/20 ,  B32B27/10 ,  B32B27/36 ,  B32B15/09 ,  B32B7/12 ,  B32B27/28 ,  B32B21/08 ,  B32B5/26 ,  B32B15/088 ,  B32B27/18 ,  B32B29/02 ,  B32B3/26 ,  B32B5/18 ,  B32B27/34 ,  B32B15/14 ,  B32B3/12 ,  B32B21/10 ,  B64C1/12 ,  B64C3/20

Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.

公开(公告)号：US11027856B2

公开(公告)日：2021-06-08

申请号：US15778035

申请日：2016-11-29

Applicant: CYTEC INDUSTRIES INC.

Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli ,  Kevin R. Mullery

IPC: H05B3/00 ,  H05B3/16 ,  B32B5/02 ,  B32B5/12 ,  B32B5/18 ,  B32B5/26 ,  B32B27/04 ,  B32B27/10 ,  B32B27/12 ,  B64D45/02 ,  B32B9/00 ,  B32B9/04 ,  B32B15/08 ,  B32B15/20 ,  B32B27/36 ,  B32B15/09 ,  B32B7/12 ,  B32B27/20 ,  B32B27/28 ,  B32B21/08 ,  B32B15/088 ,  B32B27/18 ,  B32B29/02 ,  B32B5/24 ,  B32B3/26 ,  B32B27/34 ,  B32B27/06 ,  B32B15/14 ,  B32B3/12 ,  B32B21/10 ,  B32B27/26 ,  B64C1/12 ,  B64C3/20

Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.