公开(公告)号：US09039951B2

公开(公告)日：2015-05-26

申请号：US13776754

申请日：2013-02-26

Applicant: Cytec Technology Corp.

Inventor： Jonathan E. Meegan

IPC: B29C45/02 ,  B29C45/14 ,  C08G65/22 ,  D06M17/04 ,  C08G85/00 ,  C08G59/50 ,  C08G59/56 ,  C08G59/38 ,  C08L63/00 ,  B32B27/04 ,  B32B27/26 ,  B32B27/38

CPC classification number: C08K7/06 ,  B29C70/48 ,  B29K2063/00 ,  B29K2105/0809 ,  C08G59/00 ,  C08G59/38 ,  C08G59/50 ,  C08G59/5026 ,  C08G59/504 ,  C08G59/56 ,  C08G65/22 ,  C08G85/00 ,  C08J3/243 ,  C08J3/244 ,  C08J2363/00 ,  C08L63/00 ,  D06M17/04 ,  Y10T428/24994 ,  Y10T428/31511

Abstract: Disclosed herein is a method for utilizing the exothermic energy generated by a low temperature cure reaction to access a high-temperature cure reaction, which is otherwise energetically inaccessible at a chosen tool temperature, thereby producing a cured resin matrix with properties closely matching to those produced via high-temperature cure reactions but achieved via a short cure time and low cure temperature. Also disclosed is a short-cure resin composition containing: (a) at least one multifunctional epoxy resin having an epoxy functionality of greater than 1; (b) a hardener composition containing (i) at least one aliphatic or cycloaliphatic amine curing agent having one or more amino groups per molecule; (ii) at least one aromatic amine curing agent having one or more amino groups per molecule; and optionally, (iii) an imidazole as curing accelerator. The improved properties of this resin composition include being curable at a temperature of ≦120° C. for a time period of less than 10 minutes to achieve a degree of cure higher than that derived from the same composition with just (i) aliphatic/cycloaliphatic amine or (ii) aromatic amine in isolation.

Abstract translation: 本文公开了一种利用由低温固化反应产生的放热能进行高温固化反应的方法，否则在所选择的工具温度下能够达到高能量固化反应，从而产生固化的树脂基质，其特性与所生产的 通过高温固化反应，但通过短的固化时间和低固化温度实现。 还公开了一种短固化树脂组合物，其包含：（a）至少一种环氧官能度大于1的多官能环氧树脂; （b）一种硬化剂组合物，其包含（i）至少一种每分子具有一个或多个氨基的脂族或脂环族胺固化剂; （ii）每分子具有一个或多个氨基的至少一种芳族胺固化剂; 和（iii）咪唑作为固化促进剂。 该树脂组合物的改进的性质包括在<120℃的温度下可固化的时间小于10分钟，以达到比由相同组成衍生的固化程度更高的刚性（i）脂族/ 脂环族胺或（ii）芳族胺。

公开(公告)号：US09249282B2

公开(公告)日：2016-02-02

申请号：US14686847

申请日：2015-04-15

Applicant: CYTEC TECHNOLOGY CORP.

Inventor： Jonathan E. Meegan

IPC: C08L63/00 ,  C08L63/02 ,  C08G59/38 ,  C08G59/50 ,  C08K7/06 ,  C08G65/22 ,  D06M17/04 ,  C08G85/00 ,  C08G59/56 ,  B29C70/48 ,  C08G59/00 ,  C08J3/24 ,  B29C45/02 ,  C08G59/24 ,  C08G59/32 ,  B29K63/00 ,  B29K105/08

CPC classification number: C08K7/06 ,  B29C70/48 ,  B29K2063/00 ,  B29K2105/0809 ,  C08G59/00 ,  C08G59/38 ,  C08G59/50 ,  C08G59/5026 ,  C08G59/504 ,  C08G59/56 ,  C08G65/22 ,  C08G85/00 ,  C08J3/243 ,  C08J3/244 ,  C08J2363/00 ,  C08L63/00 ,  D06M17/04 ,  Y10T428/24994 ,  Y10T428/31511

Abstract: Disclosed herein is a method for utilizing the exothermic energy generated by a low temperature cure reaction to access a high-temperature cure reaction, which is otherwise energetically inaccessible at a chosen tool temperature, thereby producing a cured resin matrix with properties closely matching to those produced via high-temperature cure reactions but achieved via a short cure time and low cure temperature. Also disclosed is a short-cure resin composition containing: (a) at least one multifunctional epoxy resin having an epoxy functionality of greater than 1; (b) a hardener composition containing (i) at least one aliphatic or cycloaliphatic amine curing agent having one or more amino groups per molecule; (ii) at least one aromatic amine curing agent having one or more amino groups per molecule; and optionally, (iii) an imidazole as curing accelerator. The improved properties of this resin composition include being curable at a temperature of ≦120° C. for a time period of less than 10 minutes to achieve a degree of cure higher than that derived from the same composition with just (i) aliphatic/cycloaliphatic amine or (ii) aromatic amine in isolation.

公开(公告)号：US20150218345A1

公开(公告)日：2015-08-06

申请号：US14686847

申请日：2015-04-15

Applicant: CYTEC TECHNOLOGY CORP.

Inventor： Jonathan E. Meegan

IPC: C08K7/06 ,  B29C70/48 ,  C08G59/00

CPC classification number: C08K7/06 ,  B29C70/48 ,  B29K2063/00 ,  B29K2105/0809 ,  C08G59/00 ,  C08G59/38 ,  C08G59/50 ,  C08G59/5026 ,  C08G59/504 ,  C08G59/56 ,  C08G65/22 ,  C08G85/00 ,  C08J3/243 ,  C08J3/244 ,  C08J2363/00 ,  C08L63/00 ,  D06M17/04 ,  Y10T428/24994 ,  Y10T428/31511

Abstract: Disclosed herein is a method for utilizing the exothermic energy generated by a low temperature cure reaction to access a high-temperature cure reaction, which is otherwise energetically inaccessible at a chosen tool temperature, thereby producing a cured resin matrix with properties closely matching to those produced via high-temperature cure reactions but achieved via a short cure time and low cure temperature. Also disclosed is a short-cure resin composition containing: (a) at least one multifunctional epoxy resin having an epoxy functionality of greater than 1; (b) a hardener composition containing (i) at least one aliphatic or cycloaliphatic amine curing agent having one or more amino groups per molecule; (ii) at least one aromatic amine curing agent having one or more amino groups per molecule; and optionally, (iii) an imidazole as curing accelerator. The improved properties of this resin composition include being curable at a temperature of ≦120° C. for a time period of less than 10 minutes to achieve a degree of cure higher than that derived from the same composition with just (i) aliphatic/cycloaliphatic amine or (ii) aromatic amine in isolation.

Abstract translation: 本文公开了一种利用由低温固化反应产生的放热能进行高温固化反应的方法，否则在所选择的工具温度下能够达到高能量固化反应，从而产生固化的树脂基质，其特性与所生产的 通过高温固化反应，但通过短的固化时间和低固化温度实现。 还公开了一种短固化树脂组合物，其包含：（a）至少一种环氧官能度大于1的多官能环氧树脂; （b）一种硬化剂组合物，其包含（i）至少一种每分子具有一个或多个氨基的脂族或脂环族胺固化剂; （ii）每分子具有一个或多个氨基的至少一种芳族胺固化剂; 和（iii）咪唑作为固化促进剂。 该树脂组合物的改进的性质包括在<120℃的温度下可固化的时间小于10分钟，以达到比由相同组成衍生的固化程度更高的刚性（i）脂族/ 脂环族胺或（ii）芳族胺。