公开(公告)号：US20160005786A1

公开(公告)日：2016-01-07

申请号：US14829238

申请日：2015-08-18

Applicant: California Institute of Technology

Inventor： Frank Greer ,  Todd J. Jones ,  Shouleh Nikzad ,  Michael E. Hoenk

IPC: H01L27/146

CPC classification number: H01L27/14685 ,  H01L27/1462 ,  H01L27/1464

Abstract: High-quality surface coatings, and techniques combining the atomic precision of molecular beam epitaxy and atomic layer deposition, to fabricate such high-quality surface coatings are provided. The coatings made in accordance with the techniques set forth by the invention are shown to be capable of forming silicon CCD detectors that demonstrate world record detector quantum efficiency (>50%) in the near and far ultraviolet (155 nm-300 nm). The surface engineering approaches used demonstrate the robustness of detector performance that is obtained by achieving atomic level precision at all steps in the coating fabrication process. As proof of concept, the characterization, materials, and exemplary devices produced are presented along with a comparison to other approaches.

Abstract translation: 提供高质量的表面涂层以及结合分子束外延原子精度和原子层沉积的技术，以制造这种高质量的表面涂层。 根据本发明提出的技术制成的涂层被证明能够形成在近紫外（155nm-300nm）的世界记录检测器量子效率（> 50％）的硅CCD检测器。 使用的表面工程方法证明了通过在涂层制造过程中的所有步骤实现原子级精度而获得的检测器性能的鲁棒性。 作为概念证明，产生的表征，材料和示例性设备与其他方法的比较一起呈现。

公开(公告)号：US10384810B2

公开(公告)日：2019-08-20

申请号：US14800436

申请日：2015-07-15

Applicant: California Institute of Technology

Inventor： Cecile Jung-Kubiak ,  Colleen M. Marrese-Reading ,  Victor E. White ,  Daniel W. Wilson ,  Matthew R. Dickie ,  Karl Y. Yee ,  Richard E. Muller ,  James E. Polk ,  John R. Anderson ,  Nima Rouhi ,  Frank Greer

IPC: B64G1/40

Abstract: Micro-emitter arrays and methods of microfabricating such emitter arrays are provided. The microfabricated emitter arrays incorporate a plurality of emitters with heights greater than 280 microns with uniformity of +/−10 microns arranged on a supporting silicon substrate, each emitter comprising an elongated body extending from the top surface of the substrate and incorporating at least one emitter tip on the distal end of the elongated body thereof. The emitters may be disposed on the substrate in an ordered array in an X by Y grid pattern, wherein X and Y can be any number greater than zero. The micro-emitter arrays may utilize a LMIS propellant source including, for example, gallium, indium, bismuth, or tin. The substrate may incorporate at least one through-via providing a fluid pathway for the LMIS propellant to flow from a propellant reservoir beneath the substrate to the top substrate surface whereupon the micro-emitter array is disposed.

公开(公告)号：US10541266B2

公开(公告)日：2020-01-21

申请号：US14829238

申请日：2015-08-18

Applicant: California Institute of Technology

Inventor： Frank Greer ,  Todd J. Jones ,  Shouleh Nikzad ,  Michael E. Hoenk

IPC: H01L27/146

Abstract: High-quality surface coatings, and techniques combining the atomic precision of molecular beam epitaxy and atomic layer deposition, to fabricate such high-quality surface coatings are provided. The coatings made in accordance with the techniques set forth by the invention are shown to be capable of forming silicon CCD detectors that demonstrate world record detector quantum efficiency (>50%) in the near and far ultraviolet (155 nm-300 nm). The surface engineering approaches used demonstrate the robustness of detector performance that is obtained by achieving atomic level precision at all steps in the coating fabrication process. As proof of concept, the characterization, materials, and exemplary devices produced are presented along with a comparison to other approaches.

公开(公告)号：US20180201395A1

公开(公告)日：2018-07-19

申请号：US14800436

申请日：2015-07-15

Applicant: California Institute of Technology

Inventor： Cecile Jung-Kubiak ,  Colleen M. Marrese-Reading ,  Victor E. White ,  Daniel W. Wilson ,  Matthew R. Dickie ,  Karl Y. Yee ,  Richard E. Muller ,  James E. Polk ,  John R. Anderson ,  Nima Rouhi ,  Frank Greer

IPC: B64G1/40

CPC classification number: B64G1/405

Abstract: Micro-emitter arrays and methods of microfabricating such emitter arrays are provided. The microfabricated emitter arrays incorporate a plurality of emitters with heights greater than 280 microns with uniformity of +/−10 microns arranged on a supporting silicon substrate, each emitter comprising an elongated body extending from the top surface of the substrate and incorporating at least one emitter tip on the distal end of the elongated body thereof. The emitters may be disposed on the substrate in an ordered array in an X by Y grid pattern, wherein X and Y can be any number greater than zero. The micro-emitter arrays may utilize a LMIS propellant source including, for example, gallium, indium, bismuth, or tin. The substrate may incorporate at least one through-via providing a fluid pathway for the LMIS propellant to flow from a propellant reservoir beneath the substrate to the top substrate surface whereupon the micro-emitter array is disposed.