公开(公告)号：US11764450B2

公开(公告)日：2023-09-19

申请号：US16922719

申请日：2020-07-07

Applicant: California Institute of Technology

Inventor： Sofia Rahiminejad ,  Maria A. Del Pino ,  Cecile D. Jung-Kubiak ,  Theodore J. Reck ,  Goutam Chattopadhyay

IPC: H01P1/18 ,  H01Q3/38 ,  H01P11/00

CPC classification number: H01P1/182 ,  H01P11/002 ,  H01Q3/38

Abstract: A phase shifter comprising an actuator coupled to a dielectric. When the dielectric is inserted into the waveguide in response to actuation by the actuator, the phase velocity of the incoming electromagnetic wave is decreased, resulting in a phase shift of the electromagnetic wave. A desired phase shift and a low insertion loss can be controlled by positioning of the dielectric and engineering the permittivity of the dielectric.

公开(公告)号：US20230027356A1

公开(公告)日：2023-01-26

申请号：US17845762

申请日：2022-06-21

Applicant: California Institute of Technology

Inventor： Goutam Chattopadhyay ,  Robert H. Lin ,  Sven L. Van Berkel ,  Sofia Rahiminejad

IPC: H01P1/12 ,  H01P1/02 ,  G02B6/35

Abstract: Low-loss terahertz switches with nanometer resolution positioning and feedback are disclosed. In one embodiment, the switch uses a U-bend waveguide surrounded by an electromagnetic band gap and is implemented in a fully metal-machined fashion in combination with a piezo-electric motor and an optical linear encoder. In another embodiment, the switch comprises a MEMS device.

公开(公告)号：US20200313271A1

公开(公告)日：2020-10-01

申请号：US16878207

申请日：2020-05-19

Applicant: California Institute of Technology

Inventor： Goutam Chattopadhyay ,  Imran Mehdi ,  Choonsup Lee ,  John J. Gill ,  Cecile D. Jung-Kubiak ,  Nuria Llombart

IPC: H01P11/00 ,  H01Q15/08 ,  H01Q19/06

Abstract: A set of antenna geometries for use in integrated arrays at terahertz frequencies are described. Two fabrication techniques to construct such antennas are presented. The first technique uses an advanced laser micro-fabrication, allowing fabricating advanced 3D geometries. The second technique uses photolithographic processes, allowing the fabrication of arrays on a single wafer in parallel.

公开(公告)号：US20150288048A1

公开(公告)日：2015-10-08

申请号：US14678751

申请日：2015-04-03

Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY

Inventor： Adrian J. Tang ,  Goutam Chattopadhyay ,  Choonsup Lee ,  Emmanuel Decrossas ,  Nacer E. Chahat

IPC: H01P3/00 ,  H01P11/00 ,  H01Q1/50

CPC classification number: H01Q1/50 ,  H01Q1/273 ,  H01Q1/364

Abstract: A data link, comprising a substrate; and an ink structure printed and/or marked on a substrate, wherein the structure directs an electric, magnetic, and/or electromagnetic wave between two locations.

Abstract translation: 一种数据链路，包括基板; 以及在基板上印刷和/或标记的油墨结构，其中所述结构在两个位置之间引导电，磁和/或电磁波。

公开(公告)号：US20240426660A1

公开(公告)日：2024-12-26

申请号：US18749191

申请日：2024-06-20

Applicant: California Institute of Technology

Inventor： Goutam Chattopadhyay ,  Sven L. Van Berkel ,  Subash Khanal ,  Conner K. Ballew

IPC: G01J3/02 ,  B82Y20/00 ,  B82Y40/00 ,  G01J3/26 ,  G02B1/00

Abstract: A device including a stack of silicon meta-optical layers forming a meta-material comprising an input surface for receiving terahertz electromagnetic radiation, an output surface for outputting a plurality of beams of the electromagnetic radiation; and a spatially varying permittivity varying with sub-wavelength precision across a volume of the stack, wherein the spatially varying permittivity is configured to focus different spectral bands of the electromagnetic radiation into different spatially separated electromagnetic modes.

公开(公告)号：US20220407200A1

公开(公告)日：2022-12-22

申请号：US17846971

申请日：2022-06-22

Applicant: California Institute of Technology

Inventor： Goutam Chattopadhyay ,  Jacob W. Kooi ,  Choonsup Lee ,  Sofia Rahiminejad ,  Subash Khanal

IPC: H01P1/22 ,  H01P11/00 ,  H04B1/04 ,  H04B1/16

Abstract: A waveguide based variable attenuator device including one or more attenuators each including a porous dielectric material; and a metal coating on the top of the dielectric material; and an actuator coupled to the attenuator. The actuator is configured to position, with nanometer resolution, the one or more attenuators in a waveguide configured and dimensioned to guide an electromagnetic wave having a frequency in a range of 100 gigahertz (GHz) to 1 terahertz (THz). The actuator controls at least one of a position or a volume of the one attenuator inserted in the waveguide to achieve a variable or pre-determined attenuation of the electromagnetic wave transmitted through waveguide.

公开(公告)号：US20220267140A1

公开(公告)日：2022-08-25

申请号：US17675562

申请日：2022-02-18

Applicant: California Institute of Technology

Inventor： Goutam Chattopadhyay ,  Cecile D. Jung-Kubiak ,  Sofia Rahiminejad ,  Subash Khanal ,  Sven L. Van Berkel

IPC: B81B3/00

Abstract: A phased array system comprising an array of antennas outputting or receiving electromagnetic radiation to or from a steerable direction, wherein the electromagnetic radiation is at submillimeter wavelengths. The system further comprises a plurality of waveguides outputting or receiving the signals to or from the antennas, each of the waveguides with individual phase tuning. The waveguides are configured and dimensioned to guide an electromagnetic wave comprising the signals having a frequency in a range of 100 gigahertz (GHz) to 1000 terahertz (THz). The system further comprises means for phase shifting the signal by means of shifting or varying one or more phases of the signals relative to one another so as to vary, steer, or scan a direction of the electromagnetic radiation.

公开(公告)号：US09461352B2

公开(公告)日：2016-10-04

申请号：US14253541

申请日：2014-04-15

Applicant: California Institute of Technology

Inventor： Cecile Jung-Kubiak ,  Theodore Reck ,  Goutam Chattopadhyay ,  Jose Vicente Siles Perez ,  Robert H. Lin ,  Imran Mehdi ,  Choonsup Lee ,  Ken B. Cooper ,  Alejandro Peralta

IPC: G02B6/136 ,  H01P3/16 ,  H01P11/00

CPC classification number: H01P3/16 ,  H01P11/002 ,  H01P11/006

Abstract: A multi-step silicon etching process has been developed to fabricate silicon-based terahertz (THz) waveguide components. This technique provides precise dimensional control across multiple etch depths with batch processing capabilities. Nonlinear and passive components such as mixers and multipliers waveguides, hybrids, OMTs and twists have been fabricated and integrated into a small silicon package. This fabrication technique enables a wafer-stacking architecture to provide ultra-compact multi-pixel receiver front-ends in the THz range.

Abstract translation: 已经开发了多步硅蚀刻工艺来制造基于硅的太赫兹（THz）波导部件。 该技术通过批处理功能提供跨多个蚀刻深度的精确尺寸控制。 已经制造了非线性和无源部件，例如混频器和乘法器波导，混合器，OMT和扭曲器并集成到小型硅封装中。 这种制造技术使得晶片堆叠架构能够在太赫兹范围内提供超紧凑的多像素接收机前端。

公开(公告)号：US20150236396A1

公开(公告)日：2015-08-20

申请号：US14626757

申请日：2015-02-19

Applicant: California Institute of Technology

Inventor： Adrian Joseph Tang ,  Goutam Chattopadhyay ,  Nacer E. Chahat ,  Emmanuel Decrossas

IPC: H01P5/18 ,  H01P11/00

CPC classification number: H01P5/188 ,  H01P5/12 ,  Y10T29/49016

Abstract: A system, method, device, and apparatus provide a dielectric waveguide splitter/bi-directional link. A dielectric substrate fabricated into a first Y-junction waveguide with a first port splitting into a first branch leading to a second port and a second branch leading to a third port. An angle between the first branch and the second branch is below ninety degrees (90°). The dielectric waveguide splitter enables millimeter-wave (mmWave) transmission between the first port and the second port while reducing feedback of the mmWave between the second and third port. Two Y-junction waveguides may be fabricated back-to-back to provide simultaneous bidirectional mmWave transmission at a single frequency.

Abstract translation: 一种系统，方法，装置和装置提供介质波导分路器/双向链路。 制造成第一Y形结波导的电介质基片，其中第一端口分为通向第二端口的第一支路和通向第三端口的第二支路。 第一分支和第二分支之间的角度低于九十度（90°）。 电介质波导分路器在第一端口和第二端口之间实现毫米波（mmWave）传输，同时减少第二端口和第三端口之间的mmWave的反馈。 可以背对背地制造两个Y形结波导，以在单个频率下提供同时双向mm波传播。

公开(公告)号：US20240345150A1

公开(公告)日：2024-10-17

申请号：US18632116

申请日：2024-04-10

Applicant: California Institute of Technology

Inventor： Jacob W. Kooi ,  Goutam Chattopadhyay ,  Austin Minnich

IPC: G01R29/26 ,  G01K7/00 ,  H01P3/00 ,  H03F7/00

CPC classification number: G01R29/26 ,  G01K7/00 ,  H01P3/003 ,  H03F7/00 ,  H03F2200/294

Abstract: A variable temperature load (VTL) or noise source including a grounded coplanar waveguide (GCPW) comprising a first metallization patterned on a fused quartz substrate, the first metallization comprising a first end for connecting to a coaxial connector and a second end for connecting to a coplanar waveguide (CPW); the CPW coupled to a 50 ohm termination and comprising a second metallization patterned on a top surface of a crystal quartz substrate; a temperature sensing diode thermally coupled to the crystal quartz substrate and the second metallization; and a heater resistor coupled to the crystal quartz substrate via contact metallization.